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XCZU6CG-L1FFVC900I: High-Performance AMD Zynq UltraScale+ MPSoC

Original price was: $20.00.Current price is: $19.00.

The XCZU6CG-L1FFVC900I is a cutting-edge System-on-Chip (SoC) from AMD’s (formerly Xilinx) Zynq UltraScale+ MPSoC family, delivering exceptional performance for demanding embedded applications. This industrial-grade device combines dual-core ARM Cortex-A53 processors with advanced programmable logic in a compact 900-pin FCBGA package.

Product Specifications

Core Processing System

  • Application Processing Unit: Dual-core Arm Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point
  • Real-Time Processing Unit: Dual-core Arm Cortex-R5 with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1
  • Processing Frequency: Up to 1.3GHz for Cortex-A53, up to 533MHz for Cortex-R5
  • System Logic Cells: 469446 Logic Units 469446 Cells

Technical Specifications

  • Part Number: XCZU6CG-L1FFVC900I
  • Manufacturer: AMD (formerly Xilinx)
  • Device Family: Zynq UltraScale+ MPSoC family
  • Package Type: 900-pin FCBGA (Flip Chip Ball Grid Array)
  • Technology Node: 16nm Technology
  • Core Voltage: 0.85V
  • Operating Frequency: 645MHz
  • I/O Count: 204 I/O
  • Speed Grade: -L1 (Low Power Industrial)
  • Temperature Range: Industrial (-40ยฐC to +100ยฐC)

Memory and Connectivity

  • General Connectivity: 214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers
  • Memory Interfaces: Support for DDR4, DDR3, DDR3L, and LPDDR3
  • Programmable Logic: UltraScale architecture with advanced FPGA capabilities
  • On-chip Memory: Block RAM, UltraRAM, and distributed memory

Key Features

  • CG Device Variant: dual application processor (CG) devices optimized for industrial applications
  • Power Efficiency: L devices can operate at a VCCINT voltage at 0.85V or 0.72V and are screened for lower maximum static power
  • 64-bit Processing: feature-rich 64-bit quad-core or dual-core Arm Cortex-A53
  • Real-time Control: Integrated dual-core ARM Cortex-R5 for deterministic real-time processing

Price Information

The XCZU6CG-L1FFVC900I is available through authorized distributors with competitive pricing. Current stock levels indicate good availability:

  • Stock Availability: 266 units available at Worldway Electronics
  • Additional Stock: 35 pcs available at Micro-Semiconductor
  • Date Code: Recent production with 1843+ date codes available

Note: Pricing varies by quantity and distributor. Contact authorized suppliers for current quotes and volume pricing.

Documents & Media

Technical Documentation

  • Official Datasheet: DS891 – Zynq UltraScale+ MPSoC Overview
  • Selection Guide: Zynq UltraScale+ MPSoC Product Tables and Selection Guide
  • Technical Reference Manual: UG1085 – Zynq UltraScale+ Device Technical Reference Manual
  • PCB Footprint: FCBGA-900 footprint files and symbols available
  • Pin Assignment: Comprehensive pinout documentation

Development Resources

  • Software Tools: Vivado Design Suite for FPGA development
  • Programming Platform: Vitis Unified Software Platform
  • Operating System: Linux, Bare-metal, and RTOS support
  • Example Designs: Reference designs and application notes

Multimedia Resources

  • Product overview videos and webinars
  • Application-specific demonstration videos
  • Training materials and tutorials
  • White papers on power management and optimization

Related Resources

Development Platforms

  • Evaluation Boards: ZCU102, ZCU104, ZCU106 development boards
  • Third-party Boards: ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7
  • System-on-Modules: Compatible SoMs from various vendors

Compatible Devices

  • XCZU6CG-1FFVC900I: Standard industrial temperature version
  • XCZU6CG-2FFVC900I: Higher speed grade variant
  • XCZU6CG-1FFVC900E: Extended temperature range version
  • XCZU6EG Series: Enhanced graphics variants with Mali-400 MP2 GPU

Application Areas

  • Industrial Automation: Motor control and sensor fusion
  • Automotive: Next-generation ADAS applications
  • Communications: 5G Wireless infrastructure
  • IoT Applications: Industrial Internet-of-Things
  • Edge Computing: AI inference and data processing

Software Ecosystem

  • Embedded Linux: Full Linux distribution support
  • Real-time OS: FreeRTOS and other RTOS options
  • AI/ML Frameworks: TensorFlow, PyTorch integration
  • Communication Stacks: Industrial protocols and wireless standards

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Meets EU RoHS directive requirements
  • REACH Compliant: Complies with EU REACH regulation
  • Conflict Minerals: Compliant with conflict minerals regulations
  • Environmental Rating: Industrial temperature range operation
  • Package Material: Lead-free, halogen-free package construction

Quality Standards

  • ISO Standards: Manufactured under ISO 9001 quality management
  • Automotive Grade: AECQ-100 qualified versions available
  • Reliability: Extensive qualification and reliability testing
  • ESD Protection: Built-in ESD protection circuits

Export Classifications

  • ECCN: Export Control Classification Number as per US regulations
  • Country of Origin: Manufactured in authorized facilities
  • Export Restrictions: Subject to export control regulations
  • Documentation: Export compliance documentation available

Operating Conditions

  • Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
  • Storage Temperature: Extended storage temperature range
  • Humidity: Non-condensing humidity tolerance
  • Altitude: Commercial and industrial altitude operation
  • Vibration/Shock: Meets industrial vibration and shock requirements

Package Information

  • Tray Packaging: Standard tray packaging for manufacturing
  • Lead-free: Pb-free package construction
  • Moisture Sensitivity: MSL-3 moisture sensitivity level
  • Weight: Lightweight design for space-constrained applications

The XCZU6CG-L1FFVC900I represents the pinnacle of AMD’s MPSoC technology, offering unmatched performance, flexibility, and integration for next-generation embedded systems. Its combination of high-performance ARM processing, advanced FPGA capabilities, and comprehensive I/O makes it ideal for demanding industrial, automotive, and communications applications.