1. Product Specifications
Core Architecture
- Part Number: XQVR600-3CB228M
- Family: QPro Virtex 2.5V Radiation-Hardened FPGAs
- Logic Gates: 644,940 logic gates
- Logic Cells: 13,824 configurable logic cells
- Operating Frequency: Up to 200MHz (speed grade -3)
- Process Technology: Advanced 0.22ฮผm CMOS with 5-layer metal
- Supply Voltage: 2.5V core voltage
Package Details
- Package Type: 228-pin Ceramic Quad Flat Package (CQFP)
- Package Code: CB228M
- Pin Count: 228 pins
- Package Material: Ceramic for enhanced radiation tolerance
Performance Characteristics
- Speed Grade: -3 (high performance)
- Temperature Range: Military grade (-55ยฐC to +125ยฐC)
- Radiation Hardness: Designed for space and high-radiation environments
- Qualification: MIL-PRF-38535 QML (Qualified Manufacturer Listing)
Memory and I/O Features
- Block RAM: Dedicated memory blocks for data storage
- I/O Standards: Support for multiple voltage levels and signaling standards
- Programmable Features: Configurable logic blocks, routing resources, and I/O blocks
- Design Flexibility: Full reconfigurability for custom logic implementations
2. Price
XQVR600-3CB228M pricing varies based on quantity, distributor, and market conditions. As a specialized radiation-hardened component for aerospace and defense applications, this FPGA is priced at a premium compared to commercial-grade devices.
Pricing Information
- Price Range: Contact authorized distributors for current pricing
- Volume Discounts: Available for large quantity orders
- Lead Time: Typically 12-16 weeks for standard orders
- Minimum Order Quantity: Varies by distributor
- Warranty: 365-day manufacturer warranty included
Note: Prices are subject to change without notice. Contact authorized AMD Xilinx distributors for real-time pricing and availability.
3. Documents & Media
Technical Documentation
- Datasheet: QPro Virtex 2.5V Radiation-Hardened FPGAs Complete Specifications
- User Guide: QPro Virtex Configuration and Programming Guide
- Application Notes: Radiation effects characterization and mitigation
- Package Drawings: Mechanical specifications and pin-out diagrams
- Qualification Reports: MIL-PRF-38535 test data and reliability analysis
Design Resources
- Development Tools: Xilinx Vivado Design Suite compatibility
- Reference Designs: Space-qualified application examples
- IP Cores: Radiation-hardened intellectual property blocks
- Evaluation Boards: Development and prototyping platforms
- Technical Support: Access to Xilinx field application engineers
Media Resources
- Product Images: High-resolution package and die photographs
- Block Diagrams: Architecture and functional block representations
- Performance Graphs: Timing and power consumption charts
- Application Videos: Configuration and programming tutorials
4. Related Resources
Development Ecosystem
- Design Software: Vivado Design Suite for synthesis and implementation
- Simulation Tools: ModelSim and Questa for functional verification
- Programming Solutions: iMPACT and Vivado Hardware Manager
- Debug Tools: ChipScope Pro and Vivado Logic Analyzer
Companion Products
- Configuration Memory: Radiation-hardened configuration PROMs
- Power Management: Space-qualified voltage regulators and converters
- Clock Management: Low-jitter clock generators and distribution
- Interface Components: Radiation-tolerant transceivers and buffers
Application Solutions
- Satellite Communications: Signal processing and protocol handling
- Space Instrumentation: Data acquisition and control systems
- Defense Electronics: Secure communications and radar processing
- Nuclear Facilities: Monitoring and control in high-radiation environments
Technical Support
- Application Notes: Design guidelines and best practices
- Training Materials: Online courses and certification programs
- Community Forums: Developer discussion and knowledge sharing
- Professional Services: Design consultation and custom IP development
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Restriction of Hazardous Substances compliant
- REACH Regulation: European chemical safety requirements met
- Conflict Minerals: Responsibly sourced materials certification
- ISO 14001: Environmental management system certified manufacturing
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Export Restrictions: Subject to U.S. Export Administration Regulations (EAR)
- ITAR Status: Not ITAR controlled for standard commercial applications
Quality and Reliability Standards
- MIL-PRF-38535: Qualified Manufacturer Listing compliance
- MIL-STD-883: Military standard test methods and procedures
- JEDEC Standards: Industry-standard qualification and testing
- ISO 9001:2015: Quality management system certification
Radiation Environment Ratings
- Total Ionizing Dose (TID): >300 krad(Si) guaranteed
- Single Event Upset (SEU): Characterized and mitigated
- Single Event Latch-up (SEL): Immune to latch-up effects
- Neutron Fluence: Specified for space mission profiles
Shipping and Storage
- ESD Sensitivity: Class 1 electrostatic discharge sensitive
- Moisture Sensitivity: Level 3 per JEDEC J-STD-020
- Storage Temperature: -65ยฐC to +150ยฐC
- Packaging: Anti-static, moisture barrier bags with desiccant
Contact Information: For technical support, pricing, or availability inquiries regarding the XQVR600-3CB228M, please contact your local AMD Xilinx authorized distributor or visit the official AMD Xilinx website for comprehensive product information and design resources.
