1. Product Specifications
Core Architecture
- FPGA Family: QPro Virtex 2.5V Radiation-Hardened
- System Gates: Approximately 322,970 gates
- Logic Cells: 6,912 cells
- Operating Frequency: Up to 250 MHz
- Process Technology: Advanced 0.22µm 5-layer epitaxial CMOS process
- Supply Voltage: 2.5V core voltage
Package Details
- Package Type: CQFP (Ceramic Quad Flat Pack)
- Pin Count: 228 pins
- Package Code: CB228M
- Temperature Grade: -3 speed grade (Industrial/Military temperature range)
- Operating Temperature: -55°C to +125°C (full military temperature range)
Radiation Hardening Features
- QML Certified: MIL-PRF-38535 qualified for high-reliability applications
- Total Ionizing Dose (TID): Guaranteed to 100K Rad(Si)
- Single Event Latch-up (SEL): Immune to LET = 125 MeV·cm²/mg
- Single Event Upset (SEU): Immunity achievable with recommended redundancy implementation
- Space-Grade Reliability: Designed for satellite and deep-space applications
Performance Features
- High-Speed Operation: System performance up to 200-250 MHz
- Dedicated Arithmetic Support: Built-in carry logic for high-speed arithmetic operations
- Flexible Architecture: Optimized balance of speed and density
- Advanced Interconnect: Rich hierarchy of fast, flexible routing resources
- IEEE 1149.1 Boundary Scan: Built-in JTAG support for testing and debugging
Memory and I/O
- Abundant Registers: Configurable flip-flops and latches with clock enable
- Dual Set/Reset: Both synchronous and asynchronous set and reset capabilities
- Internal 3-State Bussing: Efficient internal bus architecture
- Cascade Chains: Support for wide-input logical functions
- Die Temperature Sensing: Integrated temperature monitoring device
2. Pricing Information
Note: Pricing for radiation-hardened FPGAs like the XQVR300-3CB228M varies significantly based on quantity, certification requirements, and supply chain factors.
- Typical Price Range: $2,000 – $8,000+ per unit (depending on volume and specifications)
- Minimum Order Quantity: Typically 1 piece for prototyping
- Volume Pricing: Available for quantities of 25+ units
- Lead Time: 12-20 weeks for standard orders
- Request Quote: Contact authorized distributors for current pricing and availability
Pricing subject to change based on market conditions and specific customer requirements. Contact authorized distributors for the most current pricing information.
3. Documents & Media
Technical Documentation
- Product Datasheet: XQVR300-3CB228M detailed specifications and electrical characteristics
- QPro Virtex Data Sheet: Comprehensive family documentation including timing specifications
- Package Specifications: CB228M package mechanical drawings and thermal characteristics
- Application Notes: Implementation guidelines for radiation-hardened designs
- Reliability Reports: QML qualification test results and reliability data
Design Resources
- FPGA Foundation Software: Compatible development environment
- Alliance Development System: Advanced design tools and libraries
- Unified Libraries: Pre-verified design components
- Relationally Placed Macros (RPMs): Optimized logic blocks
- Design Manager: Project management and version control tools
Reference Designs
- Space-Grade Reference Designs: Proven implementations for satellite applications
- Radiation-Tolerant Design Guidelines: Best practices for harsh environment deployment
- Power Management Solutions: Optimized power consumption strategies
- Thermal Management Guidelines: Heat dissipation and thermal design considerations
4. Related Resources
Development Tools
- Vivado Design Suite: Modern FPGA development environment (for newer devices)
- ISE Design Tools: Legacy development environment for Virtex series
- FPGA Foundation: Entry-level design software
- ModelSim: Advanced simulation and verification tools
Evaluation and Development Platforms
- QPro Virtex Evaluation Boards: Hardware platforms for prototyping
- Development Kits: Complete solution packages for rapid deployment
- Programming Cables: JTAG and configuration hardware
- Socket Adapters: For device testing and validation
Related Products
- XQVR300-4CB228V: Alternative speed/temperature grade variant
- XQVR300-1CB228I: Different speed grade option
- XQVR600 Series: Higher-density radiation-hardened options
- XQV300 Series: Commercial-grade alternatives for non-radiation environments
Technical Support
- Application Engineering: Expert design assistance and optimization
- Field Application Engineers: Local technical support worldwide
- Online Documentation: Comprehensive technical library and knowledge base
- Community Forums: Peer-to-peer technical discussions and solutions
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Regulation: EU chemical safety compliance
- ISO 14001: Environmental management system certified manufacturing
- Conflict Minerals: Compliant with conflict-free sourcing requirements
Quality Certifications
- MIL-PRF-38535: Military specification for high-reliability microcircuits
- QML Class V: Qualified Manufacturer Listing certification
- ISO 9001: Quality management system certification
- AS9100: Aerospace quality management standard
- Six Sigma: Manufacturing process excellence certification
Export Control Information
- ECCN Classification: 3A001.a.7 (Subject to Export Administration Regulations)
- ITAR Considerations: May require special export licensing for certain applications
- Country Restrictions: Export restrictions apply to certain countries and end-users
- End-Use Restrictions: Military and space applications may require additional licensing
- Dual-Use Technology: Subject to export control regulations
Environmental Operating Conditions
- Operating Humidity: 5% to 95% relative humidity (non-condensing)
- Storage Temperature: -65°C to +150°C
- Thermal Shock: MIL-STD-883 compliant
- Vibration Resistance: MIL-STD-883 Method 2007 certified
- Shock Resistance: MIL-STD-883 Method 2002 certified
Packaging and Handling
- ESD Protection: Class 1A electrostatic discharge sensitive
- Moisture Sensitivity: Level 3 (MSL-3) per J-STD-020
- Dry Pack Requirements: Vacuum-sealed packaging with desiccant
- Shelf Life: 12 months in original sealed packaging
- Handling Precautions: Anti-static procedures required during assembly
For the most current specifications, pricing, and availability information, please contact authorized AMD Xilinx distributors or visit the official AMD Xilinx website. Product specifications are subject to change without notice.
