1. Product Specifications
Device Architecture
- Family: QPro Virtex 2.5V Radiation-Hardened FPGAs
- Device Density: 1,000,000 system gates
- Process Technology: 0.22 ฮผm 5-layer epitaxial CMOS
- Core Voltage: 2.5V
- I/O Standards: 16 high-performance interface standards supported
- Package Type: 560-pin Ball Grid Array (BGA)
- Package Designation: BG560N
Performance Specifications
- Maximum System Frequency: 200 MHz
- Operating Temperature Range: -55ยฐC to +125ยฐC (Military Grade)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Junction Temperature: +150ยฐC maximum
Radiation Specifications
- Total Ionizing Dose (TID): 100 kRad(Si) guaranteed
- Single Event Latch-up (SEL): Immune to LET = 125 MeV cmยฒ/mg
- Single Event Upset (SEU): Mitigation achievable with TMR implementation
- Neutron Fluence: Specified per QML requirements
Power Specifications
- Core Power Supply: 2.5V ยฑ 5%
- I/O Power Supply: 1.5V to 3.3V (depending on I/O standard)
- Power Consumption: Contact manufacturer for specific application requirements
Physical Specifications
- Package Dimensions: 27mm ร 27mm (nominal)
- Pin Count: 560 pins
- Pin Pitch: 1.27mm
- Package Height: 2.55mm maximum
- Weight: Approximately 5.2 grams
2. Price
Pricing Information:
- List Price: Contact authorized distributors for current pricing
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: 12-20 weeks (subject to availability)
- Minimum Order Quantity: 1 piece
- Sample Availability: Contact AMD Xilinx for evaluation samples
Note: Pricing is subject to change based on market conditions, volume requirements, and specific customer applications. For current pricing and availability, please contact authorized AMD Xilinx distributors or sales representatives.
3. Documents & Media
Technical Documentation
- Complete Datasheet: XQVR1000-3BG560N Product Specification (PDF)
- User Guide: QPro Virtex Radiation-Hardened FPGA User Guide
- Application Notes:
- AN-001: Radiation Hardening Design Techniques
- AN-002: Power Supply Design Guidelines
- AN-003: Thermal Management Considerations
- Reliability Report: QPro Virtex Radiation Test Results
- Quality & Reliability Manual: QML Class V Certification
Design Resources
- Pinout Diagram: Complete pin assignment and function reference
- Package Drawings: Mechanical specifications and land pattern
- IBIS Models: Signal integrity simulation models
- Thermal Models: Package thermal characterization data
- 3D Package Models: CAD models for mechanical design
Software Tools
- Vivado Design Suite: Latest version with XQVR1000-3BG560N support
- ISE Design Tools: Legacy tool support for existing designs
- Programming Utilities: Device configuration and programming tools
- IP Core Library: Radiation-hardened IP cores catalog
4. Related Resources
Development Tools
- Evaluation Boards: Contact AMD Xilinx for availability
- Programming Cables: USB and JTAG programming solutions
- Design Kits: Complete development environment packages
- Debug Tools: ChipScope Pro and integrated logic analyzer
Technical Support
- Application Engineers: Dedicated aerospace and defense support team
- Design Services: Custom design and consultation services
- Training Programs: Radiation-hardened FPGA design workshops
- Community Forums: AMD Xilinx developer community access
Compatible Products
- Radiation-Hardened Memory: Compatible SRAM and Flash memory solutions
- Power Management: Rad-hard power supply and regulation ICs
- Interface Devices: Rad-hard transceivers and level shifters
- Connector Systems: Space-qualified connectors and cables
Standards Compliance
- QML-V (Qualified Manufacturers List – Class V)
- MIL-PRF-38535 Qualified
- JEDEC Standards Compliant
- NASA NEPP (NASA Electronic Parts and Packaging) Approved
5. Environmental & Export Classifications
Environmental Classifications
- RoHS Compliance: Fully compliant with EU RoHS Directive 2011/65/EU
- REACH Compliance: Registered under EU REACH Regulation (EC) No 1907/2006
- Conflict Minerals: Compliant with Dodd-Frank Act Section 1502
- Halogen-Free: Package materials meet halogen-free requirements
- WEEE Directive: Compliant with Waste Electrical and Electronic Equipment Directive
Quality Standards
- ISO 9001:2015: Quality management system certified
- AS9100D: Aerospace quality management system
- IPC Standards: Assembly and soldering guidelines compliance
- MIL-STD-883: Military standard test methods and procedures
Export Control Classifications
- ECCN (Export Control Classification Number): 3A991.a.2
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: United States
- Export License Requirements: Subject to U.S. Export Administration Regulations (EAR)
- ITAR Classification: Not subject to International Traffic in Arms Regulations
Shipping & Handling
- ESD Sensitivity: Class 1 (โฅ2000V HBM, โฅ200V MM)
- Moisture Sensitivity Level (MSL): Level 3 (168 hours at 30ยฐC/60% RH)
- Package Marking: Lot traceability and date code marking
- Anti-Static Packaging: Conductive tubes and static-shielded bags
- Storage Requirements: Controlled temperature and humidity environment
Regulatory Approvals
- FCC Compliance: Part 15 Class B digital device requirements
- CE Marking: European Conformity for applicable directives
- UL Recognition: Safety standards compliance where applicable
- NASA GSFC Approved: Goddard Space Flight Center approved for space applications
For the most current specifications, pricing, and availability information, please contact AMD Xilinx directly or visit an authorized distributor. All specifications are subject to change without notice.
