1. Product Specifications
Core Technical Specifications
- Part Number: XQR1701LCC44MES
- Manufacturer: Xilinx (now AMD)
- Product Category: Configuration PROM, Memory Device
- Memory Density: 1 Megabit (1M-bit)
- Operating Voltage: 3.3V
- Package Type: 44-Pin LCC (Leadless Chip Carrier)
- Series: QPro Radiation-Hardened (XQR)
- Interface: Serial Configuration
- Temperature Range: Extended temperature range for military applications
Key Features
- Radiation-Hardened Design: Qualified for space and high-radiation environments
- QML-Certified Manufacturing: Built on Xilinx QML certified production lines
- Epitaxial Substrate Technology: Enhanced radiation tolerance
- TID Lot Qualification: Per Method 1019 testing standards
- 3.3V Operation: Low power consumption and compatibility
- Serial Interface: Optimized for FPGA configuration
- Master/Slave Serial Mode Support: Flexible configuration options
Performance Characteristics
- Configuration Clock Support: Compatible with FPGA-generated clocks
- Fast Access Time: Optimized data output timing
- Cascading Capability: Multiple devices can be chained
- FPGA Compatibility: Designed for Xilinx FPGA configuration
- One-Time Programmable: Secure, permanent configuration storage
2. Price Information
Contact for Current Pricing
The XQR1701LCC44MES pricing varies based on:
- Order quantity and volume discounts
- Current market availability
- Lead time requirements
- Distributor and regional variations
For accurate pricing and availability of the XQR1701LCC44MES:
- Contact authorized Xilinx/AMD distributors
- Request quotes from certified aerospace/defense suppliers
- Verify current stock levels through electronic component distributors
- Consider long-term supply agreements for critical applications
Note: As a radiation-hardened, space-qualified component, the XQR1701LCC44MES typically commands premium pricing compared to commercial-grade alternatives.
3. Documents & Media
Technical Documentation
- Datasheet: XQR1701LCC44MES complete specifications
- QPro Series Configuration PROM Family Guide
- Application Notes: FPGA configuration best practices
- Programming Guide: Device programming procedures
- Reliability Reports: Radiation testing and qualification data
Design Resources
- Reference Designs: Sample FPGA configuration circuits
- PCB Layout Guidelines: Package-specific design recommendations
- Evaluation Boards: Development and testing platforms
- Programming Software: Xilinx ISE/Vivado compatibility information
Quality Documentation
- QML Certification: Space-grade qualification certificates
- Test Reports: Radiation characterization data
- Reliability Analysis: MTBF and failure rate statistics
- Compliance Certificates: Export control and regulatory documentation
4. Related Resources
Compatible Products
- Xilinx FPGAs: Spartan, Virtex, and Kintex series compatibility
- Programming Equipment: Elnec and other programmer support
- Development Tools: Xilinx ISE Foundation and Vivado Design Suite
- Evaluation Platforms: ZedBoard, Basys 3, and other development boards
Alternative Solutions
- XQR1701LCC44M: Standard military temperature variant
- XQR1701LCC44V: Alternative voltage specification
- XQR17V16 Series: Higher density options
- Commercial Variants: Non-radiation-hardened alternatives for standard applications
Support Resources
- Technical Support: Xilinx/AMD customer support channels
- Community Forums: FPGA design and configuration discussions
- Training Materials: Configuration PROM design tutorials
- Application Engineering: Design consultation services
Design Tools
- Xilinx Vivado Design Suite: Latest FPGA design environment
- ISE Design Tools: Legacy development platform support
- Programming Tools: Device programming and verification utilities
- Simulation Models: Behavioral and timing models
5. Environmental & Export Classifications
Environmental Specifications
- Operating Temperature: Extended military temperature range
- Storage Temperature: Wide temperature storage capability
- Humidity Resistance: Moisture sensitivity level classification
- Shock and Vibration: Military standard compliance (MIL-STD)
- Altitude: High-altitude operation capability
Radiation Specifications
- Total Ionizing Dose (TID): Space-qualified radiation tolerance
- Single Event Effects (SEE): Latch-up and upset immunity
- Neutron Fluence: High-energy neutron resistance
- Proton Radiation: Space environment radiation testing
- Heavy Ion Testing: Complete radiation characterization
Export Control Classifications
- ECCN: Export Control Classification Number
- ITAR: International Traffic in Arms Regulations compliance
- RoHS Compliance: Environmental regulation conformity
- REACH Compliance: European chemical regulation adherence
- Country of Origin: Manufacturing location information
Quality Standards
- QML-Q Qualified: Space-grade quality assurance
- ISO 9001: Quality management system certification
- AS9100: Aerospace quality standard compliance
- MIL-STD-883: Military standard test methods
- JEDEC Standards: Industry standard compliance
Package Environmental Data
- Lead-Free: RoHS compliant packaging
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) rating
- Thermal Characteristics: Junction temperature specifications
- ESD Classification: Electrostatic discharge sensitivity
- Package Marking: Traceability and identification standards
Keywords: XQR1701LCC44MES, Xilinx PROM, radiation-hardened memory, FPGA configuration, QPro series, space-qualified, 44-pin LCC, 1M-bit PROM, 3.3V operation, QML certified, aerospace components, defense electronics, configuration memory, serial PROM
For the most current technical specifications, pricing, and availability of the XQR1701LCC44MES, please consult with authorized distributors or contact Xilinx/AMD directly.
