Product Specification
The XCZU9EG-2FFVC900I is an advanced Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from the Xilinx UltraScale+ family designed for high-performance computing applications. This industrial-grade (-I temperature range) device features:
- Processing System: Quad-core ARM Cortex-A53 processor (up to 1.5GHz) and dual-core ARM Cortex-R5 real-time processor (up to 600MHz)
- Programmable Logic: 600K system logic cells with 548K LUTs and 1M flip-flops
- Memory: 32.1 Mb of block RAM and 4.5 Mb of UltraRAM
- DSP Slices: 2,520 DSP slices for high-performance signal processing
- Package Type: FFVC900 flip-chip package with 900 pins
- Speed Grade: -2 speed grade offering balanced performance and power efficiency
- Temperature Range: Industrial temperature (-40ยฐC to +100ยฐC) for harsh environment applications
- I/O Pins: 328 user I/O pins supporting various I/O standards
- Transceivers: 24 GTH transceivers supporting data rates up to 16.3 Gbps
This MPSoC combines real-time processing, graphics processing, video encoding/decoding, and programmable logic in a single device, making it ideal for industrial automation, medical imaging, aerospace, and defense applications.
Price
The XCZU9EG-2FFVC900I is priced competitively within the high-performance FPGA market segment. Current pricing typically ranges from $2,500 to $3,500 per unit, with volume discounts available for large orders. For the most current pricing, please contact authorized Xilinx distributors such as Avnet, Arrow Electronics, or Mouser Electronics. Lead times may vary from 12-26 weeks depending on market conditions.
Documents & Media
Access comprehensive documentation to maximize your development with the XCZU9EG-2FFVC900I:
- Product Brief: Overview of features and capabilities
- Data Sheet: Complete technical specifications (DS891)
- User Guide: Detailed implementation guidelines (UG1085)
- Reference Designs: Accelerate development with pre-built applications
- Technical Reference Manual: Architecture details and register descriptions
- Application Notes: Implementation best practices and optimization techniques
- Errata: Known issues and workarounds for specific silicon versions
Development tools supporting this device include Vivado Design Suite, Vitis Unified Software Platform, and PetaLinux Tools for embedded Linux development.
Related Resources
Enhance your XCZU9EG-2FFVC900I development with these additional resources:
- Evaluation Boards: ZCU102 Evaluation Kit provides a comprehensive platform for prototyping
- IP Cores: Access to over 200 pre-verified IP cores through the Vivado IP catalog
- Design Advisory: Expert guidance for complex implementation challenges
- Training Resources: Webinars, tutorials, and hands-on labs for skill development
- Community Support: Active forums and knowledge base at Xilinx Community Portal
- Partner Solutions: Ecosystem of third-party tools, IP, and design services
- Migration Guides: Streamlined transition from previous generation devices
Environmental & Export Classifications
The XCZU9EG-2FFVC900I meets stringent environmental standards and export requirements:
- RoHS Compliance: Fully compliant with EU RoHS Directive 2011/65/EU
- REACH Compliance: Conforming to EU REACH regulations
- Lead-Free Status: 100% lead-free package and manufacturing process
- Export Control: ECCN 3A001.a.2.c classification requires appropriate export licensing
- Reliability Rating: Extensive qualification testing with detailed reliability reports available
- Operating Temperature: Industrial-grade temperature range from -40ยฐC to +100ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Moisture Sensitivity Level (MSL): MSL 3 rated
The industrial temperature grade makes this device suitable for deployment in challenging environments including industrial automation, outdoor telecommunications equipment, and military applications where standard commercial temperature ranges would be insufficient.
