Product Specification
The XCZU9CG-L1FFVC900I is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from Xilinx’s advanced FPGA lineup. This industrial-grade component features the powerful XCZU9CG silicon die housed in an FFVC900 package with 900 pins, designed for demanding applications requiring robust processing capabilities.
Key specifications of the XCZU9CG-L1FFVC900I include:
- Processing System: Quad-core ARM Cortex-A53 (up to 1.5GHz) and dual-core Cortex-R5 real-time processors
- Logic Cells: Approximately 600,000 system logic cells
- Block RAM: 32.1 Mb
- UltraRAM: 36.0 Mb
- DSP Slices: 2,520 for high-performance signal processing
- Temperature Range: -40ยฐC to +100ยฐC (Industrial grade “I” suffix)
- Package Type: FFVC900 flip-chip fine-pitch ball grid array
- Speed Grade: -1 (indicated by “L1” in part number)
- I/O Pins: Supports numerous high-speed transceivers and programmable I/O
The XCZU9CG-L1FFVC900I is optimized for applications requiring hardware acceleration, real-time processing, and high-speed connectivity, making it ideal for industrial automation, medical imaging, aerospace and defense systems, and advanced communications equipment.
Price
The XCZU9CG-L1FFVC900I is a premium component with pricing that reflects its advanced capabilities. Current market pricing ranges between $2,500 to $3,800 per unit, depending on quantity, availability, and supply chain conditions. For volume orders, please contact authorized distributors like Avnet, Arrow Electronics, or Digikey for the most competitive pricing and availability information.
Documents & Media
The XCZU9CG-L1FFVC900I is supported by comprehensive documentation from Xilinx:
- Technical Reference Manual (Document UG1085)
- Data Sheet: DC and AC Switching Characteristics (DS925)
- Product Specification Guide (UG1075)
- Packaging and Pinout Specifications (UG865)
- Power Management User Guide (UG580)
- Zynq UltraScale+ Device Technical Reference Manual (UG1085)
- PCB Design Guide for Zynq UltraScale+ MPSoCs (UG1182)
All documentation can be accessed through the Xilinx/AMD website or through authorized distributor portals.
Related Resources
Developers working with the XCZU9CG-L1FFVC900I can leverage these valuable resources:
- Vivado Design Suite for comprehensive design environment
- Vitis Unified Software Platform for accelerated application development
- PetaLinux Tools for embedded Linux development
- System Generator for DSP for model-based design
- Development boards featuring compatible Zynq UltraScale+ MPSoCs:
- ZCU102 Evaluation Kit
- ZCU106 Evaluation Kit
- Reference designs and application notes specific to industrial applications
- Online forums and community support through AMD/Xilinx Developer Zone
Environmental & Export Classifications
The XCZU9CG-L1FFVC900I meets strict environmental standards and export regulations:
- RoHS Compliant: Yes
- Lead-Free: Yes
- REACH Compliant: Yes
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Storage Temperature: -65ยฐC to +150ยฐC
- Moisture Sensitivity Level (MSL): MSL 3
- ECCN Classification: 3A001.a.2.c
- HTS Code: 8542.31.0000
- Country of Origin: Various (typically United States, Malaysia, or Taiwan)
Export of the XCZU9CG-L1FFVC900I may be subject to regulations including U.S. Export Administration Regulations (EAR). Certain applications and destinations may require export licenses. Consult with legal compliance teams before international shipment.
