Product Specification
The XCZU7EV-L2FFVF1517E is a cutting-edge multiprocessor system-on-chip (MPSoC) from AMD/Xilinx’s Zynq UltraScale+ family, designed for demanding applications requiring real-time processing and video capabilities. This powerful EV-variant device combines advanced processing units with programmable logic on a single chip fabricated using 20nm technology.
Key Features:
- Processing System: Quad-core ARM Cortex-A53 application processor (up to 1.5GHz)
- Real-Time Processing: Dual-core ARM Cortex-R5 real-time processor
- Graphics Processing: ARM Mali-400 MP2 graphics processing unit
- Video Capabilities: 4K60 H.264/H.265 video codec for simultaneous encode/decode
- Programmable Logic: 504,000 system logic cells
- Memory: On-chip memory including LUTRAM, Block RAM, and UltraRAM
- Package Type: 1517-Pin FCBGA (40ร40)
- Speed Grade: L2 speed grade with extended temperature range
- Power Efficiency: Operates at 0.85V with reduced static power consumption
- Technology: 16nm FinFET+ technology
Applications:
- Machine vision and embedded vision systems
- Video surveillance and processing
- ADAS (Advanced Driver-Assistance Systems)
- Industrial IoT and automation
- 5G wireless infrastructure
- High-performance computing applications
Price
The XCZU7EV-L2FFVF1517E is a premium component with pricing that varies based on quantity and supplier. Current market pricing ranges approximately from $1,800 to $4,700 per unit, with significant discounts available for bulk orders. For the most competitive pricing and availability information, we recommend requesting a customized quote based on your specific quantity requirements and delivery timeline.
Contact our sales team for current pricing, lead times, and volume discount options. Pricing is subject to change based on market conditions and component availability.
Documents & Media
Technical Documentation:
- Complete datasheet (DS891): Comprehensive technical specifications and electrical characteristics
- Packaging information and pinout diagrams
- Thermal specifications and power consumption details
- Implementation guides and reference designs
- Technical application notes
Development Resources:
- Vitis Unified Software Platform for development
- PetaLinux and embedded Linux BSPs
- Device drivers and firmware
- Reference designs for common applications
- IP core documentation and integration guides
Design Support:
- FPGA programming guides
- Hardware design guidelines
- Power analysis and optimization tools
- Signal integrity and thermal analysis tools
- Performance optimization recommendations
Related Resources
Development Platforms:
- ZCU102 Evaluation Kit: Full-featured development platform
- ZCU104 Evaluation Kit: Optimized for embedded vision applications
- ZCU106 Evaluation Kit: Includes the ZU7EV device with 4KP60 video codec
- Third-party carrier boards and System-on-Modules (SoMs)
Software Tools:
- Vitis AI: Development environment for AI inference
- Vivado Design Suite: For hardware design and implementation
- PetaLinux Tools: For embedded Linux development
- Software Development Kit (SDK): For application software development
- Model-based design tools and high-level synthesis
Support Resources:
- AMD/Xilinx technical support and forums
- Application engineering assistance
- Training materials and educational resources
- Design services and consultation
- IP licensing and customization options
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (Restriction of Hazardous Substances Directive)
- REACH compliant (Registration, Evaluation, Authorization of Chemicals)
- Free of banned substances as defined by environmental regulations
- Extended temperature range operation capability (E-grade)
- Low power consumption design for energy efficiency
Export Classifications:
- Subject to export control regulations
- ECCN (Export Control Classification Number) classification applies
- International shipping and trade compliance documentation available
- Import/export declaration requirements vary by country
- End-use certifications may be required for certain applications or regions
Reliability:
- Operating temperature range: Extended industrial (0ยฐC to +100ยฐC junction temperature)
- Enhanced reliability testing and qualification
- Long-term availability and product lifecycle support
- Advanced packaging for improved thermal performance and signal integrity
- Designed for high-reliability applications with stringent requirements
