1. Product Specifications
The XCZU7EV-L1FBVB900I is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) manufactured by Xilinx (now AMD). This advanced computing solution integrates powerful processing capabilities with programmable logic in a single device, making it ideal for applications requiring real-time processing, video processing, and high-performance computing.
Key Technical Specifications:
- Device Family: Zynq UltraScale+ MPSoC EV Series
- Processing System:
- Quad-core ARM Cortex-A53 processor (up to 1.5GHz)
- Dual-core ARM Cortex-R5 real-time processor
- ARM Mali-400 MP2 GPU
- Video codec support
- Programmable Logic:
- 504,000 System Logic Cells
- 20nm technology
- Package: 900-Pin FCBGA (Flip-Chip Ball Grid Array)
- Speed Grade: -1L (low power variant)
- Temperature Range: Industrial (-40ยฐC to +100ยฐC)
- Power:
- Operates at VCCINT voltage of 0.85V (standard) or 0.72V (reduced power)
- Optimized for lower maximum static power
- Memory Interfaces: Support for DDR4, DDR3, LPDDR4, LPDDR3
- I/O Interfaces: PCIe Gen3, USB 3.0/2.0, SATA 3.1, DisplayPort, Ethernet
Applications:
- Video processing and encoding/decoding
- Embedded vision systems
- Automated Driver Assistance Systems (ADAS)
- Industrial automation and control
- Aerospace and defense systems
- High-performance computing
- Software-defined radio
- Artificial intelligence and machine learning acceleration
2. Price
The XCZU7EV-L1FBVB900I is a premium component available through authorized distributors. Pricing varies based on quantity, with volume discounts available. For current pricing:
- Contact authorized distributors such as Mouser, Newark, Arrow, or Avnet
- Request a custom quote through the manufacturer’s (AMD/Xilinx) website
- Pricing typically ranges from $2,000 to $3,500 per unit for small quantities
- Volume discounts apply for larger orders
- Non-Cancellable and Non-Returnable (NCNR) terms may apply
3. Documents & Media
The following documentation is available to support the implementation and use of the XCZU7EV-L1FBVB900I:
- Technical Datasheet: Comprehensive specifications, electrical characteristics, and pinout information
- Zynq UltraScale+ MPSoC Overview (DS891): Detailed architectural overview and features
- UltraScale Architecture and Product Data Sheet: Complete technical specifications
- Package, Pinouts Guide: Physical dimensions and pin configuration
- User Guides: Programming, implementation, and system design guidelines
- Reference Designs: Example implementations for various applications
- Evaluation Board Documentation: Guidelines for development boards compatible with this device
Software Resources:
- Vivado Design Suite: Comprehensive design environment for FPGA development
- Vitis Unified Software Platform: Application development environment
- PetaLinux: Linux distribution optimized for Xilinx devices
Development Tools:
- ZCU102/ZCU104/ZCU106 Evaluation Kit compatibility
- Software development tools for both processing system and programmable logic
4. Related Resources
- Development Boards: Compatible with ZCU102, ZCU104, ZCU106 evaluation boards
- Starter Kits: Zynq UltraScale+ MPSoC starter kits for rapid prototyping
- Reference Designs: Application-specific designs demonstrating capabilities
- Support Forums: Xilinx/AMD community forums for technical assistance
- Training Resources: Online courses, webinars, and documentation
- IP Cores: Pre-verified intellectual property for accelerated development
- Third-party Accessories: Partner-developed add-on boards and modules
- FPGA Design Services: Consulting services for custom implementations
5. Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Yes
- MSL Rating: MSL 4 – 72 hours
- Lead-Free: Yes
- Operating Temperature Range: Industrial (-40ยฐC to +100ยฐC)
- Storage Temperature Range: -65ยฐC to +150ยฐC
Export Classifications:
- ECCN (Export Control Classification Number): 5A002.A.4
- HTS (Harmonized Tariff Schedule):
- US: 8542390001
- EU (TARIC): 8542399000
- Country of Origin: Various facilities worldwide
- Packaging: Tray packaging
This component is subject to export regulations and may require appropriate licensing for international shipments. Consult with compliance experts when exporting this device internationally.
