“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XCZU7EV-2FBVB900E: Xilinx Zynq UltraScale+ MPSoC

Original price was: $20.00.Current price is: $19.00.

Product Specification

The XCZU7EV-2FBVB900E is a high-performance multiprocessor system-on-chip (MPSoC) from the Xilinx Zynq UltraScale+ family, now part of AMD’s adaptive computing portfolio. This advanced device combines powerful processing capabilities with programmable logic for demanding applications requiring both software and hardware flexibility.

Key Features:

  • Processing System:
    • Quad-core ARM Cortex-A53 processors (64-bit) running at up to 1.5GHz
    • Dual-core ARM Cortex-R5 real-time processors with CoreSight
    • ARM Mali-400 MP2 GPU for enhanced graphics acceleration
  • Programmable Logic:
    • 504,000 logic cells built on 20nm technology
    • Extensive DSP resources for high-performance computing
    • Optimized for low power consumption with high performance
  • Memory Interfaces:
    • DDR4 memory controller
    • Advanced memory interfaces for high-bandwidth applications
  • Package Details:
    • 900-pin FCBGA (Fine-Pitch Ball Grid Array)
    • Speed grade -2 for enhanced performance
    • Extended temperature range (“E” suffix)
    • RoHS compliant
  • Power Management:
    • Multiple operating voltage options
    • Power optimization capabilities
    • VCCINT voltage support for optimal performance/power balance

The XCZU7EV variant specifically includes video codec support, making it ideal for applications requiring video processing capabilities alongside general-purpose and real-time computing.

Price

The XCZU7EV-2FBVB900E is typically available through authorized distributors with pricing that varies based on volume and market conditions. As of 2025, pricing information requires direct inquiry with distributors due to the specialized nature of this component.

Current pricing ranges depend on:

  • Order quantity (bulk discounts available)
  • Lead time requirements
  • Distributor-specific terms

This product is categorized as Non-Cancellable and Non-Returnable (NCNR) by many distributors, which should be considered during procurement planning.

Documents & Media

Technical Documentation:

  • Datasheets:
    • Zynq UltraScale+ MPSoC Data Sheet (DS891)
    • Device-specific technical specifications
  • Design Resources:
    • Package device pinout files (available in TXT and CSV formats)
    • UltraScale+ Architecture Technical Reference Manuals
    • Zynq UltraScale+ MPSoC Programming Guides
  • Development Tools:
    • Vivado Design Suite compatibility
    • Software development tools for ARM processors
    • IP cores and reference designs

Design Support:

  • Programming guides
  • Application notes
  • Reference designs for common applications
  • Technical support documentation

Related Resources

Development Boards:

Several development platforms support the XCZU7EV family, including:

  • Various vendor evaluation boards
  • System-on-Module (SoM) solutions
  • Starter kits for rapid development

Software Resources:

  • Xilinx/AMD Vivado Design Suite
  • Software Development Kit (SDK)
  • PetaLinux tools for embedded Linux development
  • FPGA programming resources and guides

Community Support:

  • Technical forums for knowledge sharing
  • Application examples
  • Design guidelines and best practices

Environmental & Export Classifications

Environmental Information:

  • RoHS Compliant: Yes
  • Operating Temperature Ranges:
    • Extended (E): -40ยฐC to +105ยฐC
    • Other variants available in Industrial (I) temperature grades

Packaging:

  • Moisture Sensitivity Level (MSL): MSL 4 – 72 hours
  • Tray packaging for volume handling
  • Lead-free package construction

Export Classification:

The XCZU7EV-2FBVB900E, like other advanced integrated circuits, may be subject to export controls depending on the destination country and intended application. Compliance with relevant export regulations is required when shipping internationally.

For specific export classification details, consult with your compliance department or refer to the manufacturer’s export guidelines. Advanced semiconductor components often require appropriate export licensing depending on destination and use case.