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XCZU7EG-3FFVC1156E Zynq UltraScale+ MPSoC FPGA

Original price was: $20.00.Current price is: $19.00.

Product Specification

The XCZU7EG-3FFVC1156E is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from Xilinx, featuring a perfect balance of processing power and programmable logic for advanced embedded applications. This versatile device combines a quad-core ARMยฎ Cortexโ„ข-A53 processor operating at up to 1.5GHz, a dual-core ARM Cortex-R5 real-time processor, and a Maliโ„ข-400 MP2 GPU with high-capacity FPGA fabric.

Key Features:

  • Device Family: Zynq UltraScale+ MPSoC
  • Speed Grade: -3 (highest performance option)
  • Package Type: FFVC1156 (1156-pin flip-chip ball grid array)
  • Temperature Grade: E (Extended temperature range: -40ยฐC to +85ยฐC)
  • Processing System:
    • Quad-core ARM Cortex-A53 Application Processing Unit (APU) up to 1.5GHz
    • Dual-core ARM Cortex-R5 Real-Time Processing Unit (RPU) up to 600MHz
    • ARM Mali-400 MP2 Graphics Processing Unit (GPU)
    • 256KB on-chip memory
  • Programmable Logic Resources:
    • 504K logic cells
    • 230,400 CLB flip-flops
    • 28.3 Mb block RAM
    • 1,728 DSP slices
  • I/O and Memory Interfaces:
    • 362 available user I/Os
    • Support for DDR4, LPDDR4, DDR3, DDR3L, LPDDR3
    • PCIeยฎ Gen3 x16, SATA 3.1, DisplayPort, USB 3.0
  • Power Efficiency: Low-power 16nm FinFET+ technology

Price

The XCZU7EG-3FFVC1156E is available at competitive pricing tiers based on order quantity:

  • Single Unit: $2,495.00
  • Volume Discount (10+ units): $2,295.00 per unit
  • Volume Discount (50+ units): $2,095.00 per unit
  • Volume Discount (100+ units): Contact for custom pricing

Note: Prices are subject to change. Please contact your authorized distributor for current pricing and availability.

Documents & Media

Access comprehensive technical resources to maximize your development experience with the XCZU7EG-3FFVC1156E:

  • Technical Documentation:
    • Product Datasheet
    • Zynq UltraScale+ MPSoC Technical Reference Manual
    • FFVC1156 Package Pinout and Mechanical Drawings
    • Power Management User Guide
    • PCB Design and Assembly Guidelines
  • Design Resources:
    • Reference Designs
    • IP Core Documentation
    • Vivado Design Suite User Guides
    • PetaLinux Tools Documentation
    • Software Development Kit (SDK) Guides
  • Programming Resources:
    • Boot Image Creation Guide
    • Software Driver Documentation
    • Application Examples
    • Device Programming Guide

Related Resources

Enhance your development experience with these complementary tools and resources for the XCZU7EG-3FFVC1156E:

  • Development Tools:
    • Vivado Design Suite HLx Editions
    • Vitisโ„ข Unified Software Platform
    • PetaLinux Tools
    • System Generator for DSP
  • Development Boards:
    • ZCU106 Evaluation Kit
    • Compatible third-party carrier boards
  • Learning Materials:
    • Application Notes
    • Training Courses
    • Webinars
    • Developer Forums
    • Knowledge Base Articles
  • Support Services:
    • Technical Support
    • Design Services
    • Training Programs

Environmental & Export Classifications

The XCZU7EG-3FFVC1156E meets stringent industry standards for reliability and compliance:

  • Environmental Compliance:
    • RoHS-6 Compliant
    • REACH Compliant
    • Lead-Free Package
    • Halogen-Free Package Substrate
  • Operating Conditions:
    • Extended Temperature Range: -40ยฐC to +85ยฐC
    • Storage Temperature: -65ยฐC to +150ยฐC
    • Junction Temperature: 0ยฐC to +110ยฐC
    • Relative Humidity: 5% to 95%, non-condensing
  • Export Classification:
    • ECCN: 3A001.a.2.c
    • HTS: 8542.31.0000
    • CCATS: G176080
  • Reliability:
    • Military Standard 883 Group A & B Equivalent Testing
    • Conducted Temperature Cycling, ESD, and Latch-Up Testing
    • Mean Time Between Failures (MTBF): >1 million hours