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XCZU7EG-2FBVB900E: High-Performance Zynq UltraScale+ MPSoC FPGA

Original price was: $20.00.Current price is: $19.00.

1. Product Specification

The XCZU7EG-2FBVB900E is a powerful Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) from Xilinx (now part of AMD) that combines exceptional processing capability with advanced programmable logic. This state-of-the-art FPGA features 504,000 system logic cells fabricated on 20nm technology, making it ideal for high-performance computing applications.

Core Architecture

  • Processor: ARM Cortex-A53 quad-core processor system with integrated Cortex-R5 real-time processors
  • Processing Speed: Up to 1.5GHz operation
  • Logic Cells: 504,000 programmable logic cells
  • Manufacturing Process: 20nm technology
  • Package Type: 900-Pin FCBGA (Flip-Chip Ball Grid Array)
  • Speed Grade: -2 (mid-range performance)
  • Temperature Grade: E (Extended temperature range)
  • Operating Voltage: 0.85V core voltage

Key Features

  • Heterogeneous multi-processor architecture combining ARM cores with programmable logic
  • Hardware and software programmability for maximum system flexibility
  • Enhanced system-level integration capabilities
  • Advanced power management features
  • Comprehensive I/O support
  • Optimized for high-performance embedded applications

Target Applications

  • Communications infrastructure
  • Industrial automation and IoT
  • Medical imaging systems
  • Video processing and machine vision
  • Aerospace and defense systems
  • Automotive advanced driver assistance systems (ADAS)
  • High-performance computing and data center acceleration

2. Price

The XCZU7EG-2FBVB900E is a premium FPGA component with pricing that reflects its advanced capabilities. Current market prices typically range between $4,000-$6,000 per unit, with volume discounts available for larger orders.

For the most accurate and up-to-date pricing:

  • Request a customized quote directly from authorized Xilinx/AMD distributors
  • Contact regional sales representatives for volume pricing
  • Consider evaluation kits for initial development before committing to production quantities

Note: Prices may fluctuate based on market conditions, supply availability, and order quantity. Regional variations in pricing may apply.

3. Documents & Media

Technical Documentation

  • Complete Datasheet: Comprehensive PDF documentation available through the AMD/Xilinx documentation portal
  • Technical Reference Manual: Detailed architecture specifications and programming guides
  • User Guide: Implementation instructions and best practices
  • Application Notes: Specialized guidance for specific use cases

Development Resources

  • Vivado Design Suite: Primary development environment for Xilinx/AMD FPGAs
  • Software Development Kit (SDK): Tools for programming the ARM processing system
  • IP Cores: Pre-verified intellectual property blocks to accelerate development
  • Reference Designs: Example implementations demonstrating common applications

Training Materials

  • Instructional videos
  • Webinars and online tutorials
  • Design examples and workflows
  • Programming guides for both hardware and software aspects

4. Related Resources

Development Boards

  • Evaluation kits featuring the Zynq UltraScale+ architecture
  • Development platforms for rapid prototyping
  • Third-party carrier boards compatible with this FPGA

Support Channels

  • Official AMD/Xilinx forums
  • Technical support services
  • Community-driven development resources
  • Academic and research partnerships

Ecosystem

  • Third-party IP providers
  • Design services partners
  • System integration consultants
  • Software tools and libraries

5. Environmental & Export Classifications

Environmental Specifications

  • Operating Temperature Range: Extended industrial grade (-40ยฐC to +105ยฐC)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Humidity Tolerance: 5% to 95% relative humidity, non-condensing
  • RoHS Compliant: Yes, meets all requirements of the Restriction of Hazardous Substances directive
  • Lead-Free: Yes, complies with global lead-free manufacturing standards

Reliability Information

  • MTBF (Mean Time Between Failures): Exceeds industry standards for high-reliability applications
  • Qualification Level: Military, industrial, and commercial qualification available
  • Lifetime Support: Long-term availability through Xilinx/AMD product lifecycle program

Export Classification

  • ECCN (Export Control Classification Number): Subject to relevant export control regulations
  • HTS Code (Harmonized Tariff Schedule): Electronic integrated circuits classification
  • Export Compliance: May require export licenses for certain countries
  • End-Use Restrictions: Subject to dual-use technology export controls