Product Overview
The XCZU6CG-2FFVB1156E is a high-performance System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC CG series, combining 64-bit ARM processors with advanced FPGA fabric in a single device. This dual ARM Cortex-A53 MPCore processor with dual ARM Cortex-R5 real-time processors delivers exceptional processing capability for demanding embedded applications including 5G wireless, next-generation ADAS, and Industrial Internet-of-Things.
1. Product Specifications
Core Architecture
- Processing System: Dual ARM Cortex-A53 MPCore with CoreSight (up to 1.3GHz)
- Real-Time Processing: Dual ARM Cortex-R5 with CoreSight (up to 533MHz)
- FPGA Logic: 469,446+ Logic Cells (469K+ Logic Elements)
- Manufacturing Process: 16nm FinFET+ technology
Memory & Storage
- Block RAM: Integrated high-density block RAM
- UltraRAM: High-density, dual-port synchronous memory blocks
- External Memory Support: DDR4/DDR3L/LPDDR4 interfaces
- On-Chip Memory (OCM): 256KB
Package & Physical
- Package Type: 1156-FCBGA (Flip Chip Ball Grid Array)
- Package Size: 35mm x 35mm
- Ball Pitch: 1.0mm
- Operating Voltage: 0.72V/0.85V VCCINT
- Speed Grade: -2 (Commercial grade)
I/O & Connectivity
- High-Performance I/O: Configurable I/O banks
- High-Density I/O: Multiple I/O standards support
- Processing System I/O: Dedicated PS I/O pins
- Serial Transceivers: PS-GTR transceivers (up to 6.0 Gb/s)
Temperature Range
- Extended Temperature Range: 0°C to +100°C (E grade)
- Junction Temperature: Optimized for industrial applications
2. Pricing Information
The XCZU6CG-2FFVB1156E is available through authorized distributors including DigiKey, Mouser, Avnet, and other global electronics suppliers. Pricing varies based on:
- Quantity: Volume discounts available for bulk orders
- Lead Time: Standard lead times 2-12 weeks depending on supplier
- Package Options: Available in bulk packaging
- Regional Availability: Stocked globally with same-day shipping options
Price Range: Contact authorized distributors for current pricing and availability. Typical pricing reflects the high-performance nature of this MPSoC with costs varying based on market conditions and order volume.
3. Documents & Media
Technical Documentation
- Datasheet: XCZU6CG-2FFVB1156E Complete Specifications (102 pages, PDF)
- Product Selection Guide: Zynq UltraScale+ MPSoC Family Overview (DS891)
- User Guides: Software Developer Guide (UG1137)
- Application Notes: Design implementation guidelines
Development Resources
- Vivado Design Suite: Complete FPGA development environment
- Vitis Unified Software Platform: Embedded development tools
- PetaLinux: Linux distribution for Zynq devices
- Reference Designs: Example implementations and TRDs
Evaluation Platforms
- ZCU102 Evaluation Kit: Full-featured development platform
- ZCU104 Evaluation Kit: Video-focused evaluation board
- ZCU106 Evaluation Kit: Multi-media applications
4. Related Resources
Development Tools
- AMD Vivado Design Suite: Hardware design and implementation
- AMD Vitis Platform: Software development environment
- PetaLinux Tools: Embedded Linux development
- Embedded Design Tutorial: Step-by-step learning resources
Compatible Products
- XCZU6EG-2FFVB1156E: EG variant with GPU acceleration
- XCZU6CG-2FFVB1156I: Industrial temperature grade version
- XCZU6CG-1FFVB1156E: -1 speed grade alternative
Support Ecosystem
- AMD Partner Network: Certified design partners
- Training Resources: Online courses and certification
- Technical Support: Community forums and direct support
- Third-Party IP: Extensive IP portfolio for rapid development
Application Examples
- Industrial Automation: Motor control and sensor fusion
- Automotive Systems: ADAS and infotainment platforms
- Communications: 5G infrastructure and base stations
- Aerospace & Defense: Mission-critical embedded systems
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: YES – Restriction of Hazardous Substances compliant
- REACH Compliant: Complies with EU REACH regulation
- Lead-Free: Pb-free package and assembly process
- Halogen-Free: Environmentally friendly packaging materials
- Conflict Minerals: Compliant with conflict minerals regulations
Quality & Reliability
- Qualification Standards: AEC-Q100 automotive qualified versions available
- Quality System: ISO 9001:2015 certified manufacturing
- Reliability Testing: Extensive qualification and stress testing
- Supply Chain: Secure and traceable component sourcing
Export Classifications
- ECCN: Export Control Classification Number (contact AMD for specific classification)
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufacturing location details available upon request
- Export License: May require export license for certain destinations
Packaging & Handling
- ESD Protection: Anti-static packaging and handling procedures
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) rating provided
- Storage Requirements: Temperature and humidity specifications
- Shelf Life: Long-term storage guidelines and recommendations
Key Features & Benefits
✅ Dual-Core ARM Processing – High-performance application processing with real-time capabilities
✅ Advanced FPGA Fabric – 469K+ logic cells for hardware acceleration
✅ Integrated Solution – Eliminates need for separate processor and FPGA components
✅ Comprehensive Tool Support – Complete development ecosystem from AMD
✅ Scalable Architecture – Footprint compatibility across UltraScale+ family
✅ Industrial Grade – Extended temperature and reliability specifications
The XCZU6CG-2FFVB1156E represents the optimal choice for developers requiring high-performance processing with FPGA flexibility in a single, cost-effective device. Its proven architecture and comprehensive ecosystem support make it ideal for next-generation embedded applications across multiple industries.
