The XCZU6CG-1FFVC900I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s renowned Zynq UltraScale+ MPSoC family. This industrial-grade device combines dual ARM Cortex-A53 and dual ARM Cortex-R5 processors with programmable logic, delivering exceptional processing power and flexibility for demanding embedded applications.
1. Product Specifications
Core Processing Architecture
- Processor Configuration: Dual ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight
- FPGA Logic: 469,446+ Logic Cells (469K+ Logic Units)
- Operating Frequency: 500MHz (Processing System), 1.2GHz (Application Processing Unit)
- Speed Grade: -1 (Industrial grade performance)
- Process Technology: Advanced 16nm FinFET+ technology
Memory and Storage Features
- On-chip Memory: Extensive distributed memory architecture including LUTRAM, Block RAM, UltraRAM
- L3 Cache: Integrated for reduced memory access latency
- Memory Interface: Support for DDR4/DDR3L memory controllers
Package and I/O Specifications
- Package Type: 900-pin FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 31mm x 31mm
- I/O Count: 204 User I/Os
- Operating Voltage: 0.85V core voltage (VCCINT)
- Temperature Range: Industrial (-40°C to +100°C junction temperature)
Key Technical Features
- Programmable Logic: UltraScale+ FPGA architecture with advanced DSP and memory capabilities
- Processing System: 64-bit processor scalability for real-time control
- Connectivity: Multiple high-speed serial transceivers and flexible I/O standards
- Security: Hardware-based security features and encryption support
- Power Management: Advanced power optimization with up to 30% static power reduction capability
2. Price Information
The XCZU6CG-1FFVC900I pricing varies based on quantity, supplier, and market conditions. Current market pricing information includes:
- Reference Price Range: $1,600 – $2,704 USD (varies by supplier and quantity)
- Packaging: Available in Tray packaging for volume orders
- Lead Time: Typically 16 weeks factory lead time for new orders
- Availability: In stock at multiple authorized distributors worldwide
Note: Prices are subject to change based on market conditions. Contact authorized distributors for current pricing and volume discounts.
3. Documents & Media
Official Documentation
- Product Datasheet: DS891 – Zynq UltraScale+ MPSoC Data Sheet Overview
- Technical Reference Manual: Complete hardware specifications and programming guide
- Package Pinout Files: Available in TXT and CSV formats (reference UG1075)
- Application Notes: Design implementation guidelines and best practices
Development Resources
- Software Tools: AMD Vitis Unified Software Platform for embedded development
- Design Suite: Vivado Design Suite for FPGA implementation and synthesis
- Evaluation Boards: Compatible with various Zynq UltraScale+ development kits
- Reference Designs: Pre-built application examples and starter projects
Media Resources
- Product Images: High-resolution package and pinout diagrams
- Technical Videos: Design tutorials and implementation guides
- Webinars: Live and recorded training sessions
- White Papers: Advanced implementation strategies and performance optimization
4. Related Resources
Development Ecosystem
- Compatible Evaluation Kits: ZCU102, ZCU104, and other UltraScale+ development boards
- Software Framework: Support for Linux, FreeRTOS, and bare-metal applications
- AI/ML Acceleration: Vitis AI framework compatibility for machine learning applications
- Industrial Protocols: Support for EtherCAT, PROFINET, and other industrial communication standards
Application Areas
- Industrial Automation: Motor control, sensor fusion, and real-time control systems
- 5G Wireless Infrastructure: Base station processing and network acceleration
- Automotive Systems: ADAS (Advanced Driver Assistance Systems) applications
- Aerospace & Defense: Mission-critical embedded systems and signal processing
- Data Center Acceleration: Hardware acceleration for compute-intensive workloads
Technical Support
- AMD Support Portal: Access to technical documentation and support resources
- Community Forums: Developer community for technical discussions and troubleshooting
- Training Programs: Comprehensive learning resources and certification programs
- Design Services: Professional services and consulting support
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS (Restriction of Hazardous Substances) directive
- REACH Regulation: Compliant with European REACH chemical safety requirements
- Conflict Minerals: DRC conflict-free certified components
- Environmental Standards: Meets ISO 14001 environmental management standards
Export Control Classifications
- ECCN (Export Control Classification Number): 5A002.A.4
- HTS Code: 8542390001 (US Harmonized Tariff Schedule)
- TARIC Code: 8542399000 (European customs classification)
- Country of Origin: Manufactured under strict quality control standards
Regulatory Certifications
- CE Marking: European Conformity marking for applicable directives
- FCC Compliance: Federal Communications Commission standards compliance
- EMC Testing: Electromagnetic Compatibility certified
- Industrial Standards: IEC 61508 functional safety compliance capability
Quality Assurance
- Reliability Standards: Meets JEDEC standards for semiconductor reliability
- Quality System: ISO 9001 certified manufacturing processes
- Temperature Cycling: Extensive testing for industrial temperature ranges
- ESD Protection: Enhanced electrostatic discharge protection for reliable operation
Product Code: XCZU6CG-1FFVC900I
Manufacturer: AMD (formerly Xilinx)
Product Category: Embedded System-on-Chip (SoC)
Series: Zynq UltraScale+ MPSoC CG Family
For technical support, pricing inquiries, or design consultation, contact your local AMD authorized distributor or visit the AMD support portal for comprehensive resources and documentation.
