The XCZU5EV-3SFVC784E is a cutting-edge System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC family, specifically designed for multimedia, automotive ADAS, and surveillance applications. This advanced video codec-equipped (EV) device delivers exceptional performance with integrated ARM Cortex-A53 processing and programmable logic capabilities.
1. Product Specifications
Core Architecture
- Processor: Quad ARM Cortex-A53 MPCore with CoreSight
- Real-Time Processor: Dual ARM Cortex-R5 with CoreSight
- Graphics Processing: ARM Mali-400 MP2 GPU
- Video Processing: Dedicated H.264/H.265 video codec engines
Technical Specifications
- Technology Node: 20nm FinFET process
- Logic Cells: 256,200+ programmable logic cells
- Operating Voltage: 0.85V VCCINT
- Speed Grade: -3E (highest performance grade)
- Package: 784-pin FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 23mm x 23mm
- Operating Temperature: Extended commercial grade (-40ยฐC to +100ยฐC)
Memory and I/O Features
- High-Speed Serial I/O: Multi-gigabit transceivers
- DDR Memory Support: DDR4/DDR3L memory interfaces
- Processing System: 64-bit processor scalability
- Programmable Logic: UltraScale+ FPGA fabric
- Video Codec: Hardware-accelerated H.264/H.265 encoding/decoding
Key Performance Metrics
- Application Processor Speed: Up to 1.2GHz
- Real-Time Processor Speed: Up to 600MHz
- GPU Speed: Up to 500MHz
- Maximum System Performance: Multi-hundred gigabit-per-second levels
2. Price Information
Current Pricing (Subject to availability and quantity):
- Single unit price: $5,486.61 USD
- Volume pricing available upon request
- Prices vary by distributor and quantity ordered
- Contact authorized distributors for current stock levels and lead times
Authorized Distributors:
- DigiKey Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
Note: Pricing fluctuates based on market conditions, availability, and order quantities. Contact distributors for current pricing and volume discounts.
3. Documents & Media
Official Documentation
- Datasheet: Zynq UltraScale+ MPSoC Data Sheet (DS925)
- User Guide: UltraScale Architecture User Guide (UG1075)
- Package Files: ASCII package files in TXT and CSV format
- Product Change Notifications: Available through AMD support portal
Design Resources
- Vivado Design Suite: Primary development environment
- PetaLinux: Linux distribution for Zynq UltraScale+ devices
- Vitis Unified Software Platform: AI and accelerated computing development
- Reference Designs: Available for common applications
Media Resources
- Product overview videos
- Technical webinars
- Application notes
- Design tutorials and examples
4. Related Resources
Development Platforms
- ZCU104 Evaluation Kit: Compatible evaluation platform
- ZCU106 Evaluation Kit: Advanced development platform
- MYC-CZU3EG/4EV/5EV-V2 CPU Module: Third-party System-on-Module (SoM) solution
Software Tools
- AMD Vivado Design Suite: Synthesis, implementation, and debugging
- Vitis HLS: High-level synthesis for acceleration
- PetaLinux Tools: Embedded Linux development
- XSDK/Vitis IDE: Software development environment
Technical Support
- AMD Developer Forums
- Technical documentation portal
- Application engineering support
- Training and certification programs
Compatible Accessories
- Power Management: TPS259520DSGT electronic fuse
- Capacitors: EEF-GX0D471R, EEF-CX0J121R, EEU-FM1E331L
- Development Boards: Various third-party evaluation platforms
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes, meets EU RoHS directive requirements
- REACH Compliant: Complies with EU REACH regulation 211
- Conflict Minerals: Compliant with conflict minerals regulations
- MSL Rating: Moisture Sensitivity Level specified in packaging
Export Classifications
- USHTS Code: 8542390001
- TARIC Code: 8542399000
- ECCN: 5A002.A.4 (Export Control Classification Number)
Quality Standards
- AEC-Q100: Automotive qualified variants available
- ISO 9001: Manufacturing quality certification
- Military/Aerospace: -M grade devices available for qualified applications
Packaging Information
- Package Type: Tray packaging standard
- Lead-Free: Yes, compliant with lead-free soldering requirements
- Halogen-Free: Available upon request
- Thermal Management: Enhanced thermal performance package options
Target Applications:
- Automotive ADAS systems
- Industrial machine vision
- Video surveillance and analytics
- Medical imaging equipment
- Broadcast and professional video
- 5G wireless infrastructure
- Edge AI and machine learning
Key Advantages:
- Multi-hundred gigabit-per-second system performance capability
- Combines real-time control with graphics, video, waveform, and packet processing engines
- Industry’s high-end FPGA at 20nm process node, ideal for 400G networking and large-scale ASIC prototyping
- Software and hardware programmability for maximum flexibility
- Comprehensive development ecosystem and tool support
For the most current technical specifications, pricing, and availability, please consult the official AMD documentation and authorized distributors.
