Product Overview
The XCZU5EV-2FBVB900I is a high-performance System-on-Chip (SoC) from AMD’s Xilinx Zynq UltraScale+ MPSoC EV (Embedded Vision) device family. This advanced multiprocessor system combines ARM Cortex-A53 and Cortex-R5 processors with programmable logic, delivering exceptional performance for embedded vision, industrial automation, and edge AI applications.
1. Product Specification
Processor System
- Application Processing Unit (APU): Quad-core ARM Cortex-A53 MPCore with CoreSightโข debug
- Real-Time Processing Unit (RPU): Dual-core ARM Cortex-R5 with CoreSightโข debug
- Graphics Processing Unit (GPU): ARM Mali-400 MP2 graphics processor
- CPU Operating Frequency: Up to 1.3GHz (APU), 600MHz (RPU)
Memory Interfaces
- On-Chip Memory: 256KB integrated SRAM
- External Memory Support: DDR4/DDR3L/LPDDR4 controllers
- Cache: 32KB L1 instruction and data caches per Cortex-A53 core
Programmable Logic (PL)
- Logic Cells: 256,200+ equivalent logic cells
- Process Technology: Advanced 20nm FinFET+ technology
- Lookup Tables (LUTs): High-density 6-input LUT architecture
- Block RAM: Integrated UltraRAM and Block RAM resources
- DSP Slices: Dedicated DSP48E2 slices for signal processing
I/O and Connectivity
- High-Speed Serial I/O: Multi-gigabit transceivers
- General Purpose I/O: Configurable I/O with multiple voltage standards
- Peripheral Interfaces: USB 3.0, PCIe Gen2, SATA 3.1, Ethernet controllers
- Display Interfaces: DisplayPort and HDMI support
Package and Operating Conditions
- Package Type: 900-pin FCBGA (Flip Chip Ball Grid Array)
- Package Size: 31mm ร 31mm FBVB900 package
- Speed Grade: -2 (industrial grade performance)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Core Voltage: 0.85V typical operating voltage
2. Price
Pricing Information
- Unit Price: Contact authorized distributors for current pricing
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: Typically 25-30 weeks from major suppliers
- Availability: Active product status with ongoing production
Authorized Distributors
- Mouser Electronics
- Digi-Key Electronics
- Avnet
- Arrow Electronics
- FPGAkey (specialized FPGA distributor)
Note: The XCZU5EV-2FBVB900I is classified as Non-Cancellable, Non-Returnable (NCNR) due to its specialized nature and custom configuration requirements.
3. Documents & Media
Technical Documentation
- Primary Datasheet: Zynq UltraScale+ MPSoC Data Sheet: Overview (DS891)
- Technical Reference Manual: Zynq UltraScale+ Device Technical Reference Manual (UG1085)
- Package Files: Pinout and packaging information available via AMD support portal
- User Guides:
- UltraScale Architecture and Product Data Sheet: Overview
- Zynq UltraScale+ MPSoC Software Developer Guide
Design Resources
- Vivado Design Suite: Primary development environment and toolchain
- Package Pinout Files: Available in TXT and CSV formats
- Reference Designs: Embedded vision and industrial automation examples
- Application Notes: Performance optimization and design best practices
Software Support
- PetaLinux Tools: Linux BSP development framework
- Vitis Unified Software Platform: Application development environment
- XSDK/Vitis IDE: Integrated development environment for embedded applications
4. Related Resources
Development Platforms
- ZCU104 Evaluation Kit: Compatible development platform for Zynq UltraScale+ EV devices
- ZCU102 Evaluation Kit: High-performance development and prototyping platform
- Custom Carrier Boards: Third-party development solutions available
Compatible Device Family
- XCZU5EV-1FBVB900I: Lower speed grade variant (-1 speed grade)
- XCZU5EV-L1FBVB900I: Low-power variant with reduced voltage operation
- XCZU7EV-2FBVB900I: Higher performance variant with increased logic capacity
Application Areas
- Embedded Vision: Machine vision, surveillance systems, medical imaging
- Industrial Automation: Motor control, sensor fusion, real-time processing
- Edge AI/ML: Neural network acceleration, intelligent edge computing
- Automotive: ADAS systems, infotainment, autonomous driving applications
- Aerospace & Defense: Radar processing, communication systems, avionics
Technical Support
- AMD Developer Zone: Online resources and community forums
- Documentation Portal: Comprehensive technical documentation library
- Application Engineering: Direct technical support for complex implementations
- Training Resources: Online courses and certification programs
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS3 compliant (Restriction of Hazardous Substances)
- REACH Compliance: Compliant with EU REACH regulation
- Conflict Minerals: Compliant with conflict-free minerals sourcing requirements
- Environmental Standards: Meets international environmental protection standards
Export Control Classifications
- ECCN (Export Control Classification Number): 5A002.A.4
- USHTS (US Harmonized Tariff Schedule): 8542390001
- TARIC (EU Integrated Tariff Code): 8542399000
- Country of Origin: Manufactured under AMD/Xilinx quality standards
Regulatory Certifications
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management system compliance
- ITAR: Not subject to International Traffic in Arms Regulations
- Export Licensing: May require export licenses for certain countries/applications
Package and Shipping
- Package Materials: Lead-free, environmentally friendly packaging
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Storage Requirements: Store in anti-static, climate-controlled environment
- Shelf Life: 2 years from date of manufacture when properly stored
Key Features Summary
The XCZU5EV-2FBVB900I delivers:
- Heterogeneous Processing: ARM Cortex-A53/R5 + FPGA fabric integration
- Embedded Vision Capabilities: Dedicated hardware acceleration for vision processing
- Industrial-Grade Reliability: Extended temperature range and robust design
- Comprehensive Software Ecosystem: Full toolchain and development support
- Scalable Architecture: Future-proof design with upgrade path options
Bottom Line: The XCZU5EV-2FBVB900I represents AMD Xilinx’s advanced 20nm UltraScale+ technology, providing an optimal balance of processing power, programmable logic resources, and integrated peripherals for demanding embedded applications requiring real-time performance and vision processing capabilities.
