The XCZU5EV-1FBVB900E from AMD Xilinx represents a cutting-edge System-on-Chip (SoC) solution that combines the power of ARM processors with FPGA flexibility. This Zynq UltraScale+ MPSoC EV device delivers exceptional performance for demanding applications in networking, data centers, aerospace, and industrial automation.
1. Product Specifications
Core Architecture
The XCZU5EV-1FBVB900E features a robust heterogeneous architecture designed for maximum performance and efficiency:
Processing Units:
- Quad ARM Cortex-A53 MPCore with CoreSightโข debug and trace capabilities
- Dual ARM Cortex-R5 real-time processors with CoreSightโข
- ARM Mali-400 MP2 graphics processing unit for enhanced visual performance
FPGA Fabric:
- 256,200+ logic cells providing extensive programmable logic resources
- 20nm FinFET technology for superior power efficiency and performance
- UltraScale+ architecture enabling multi-hundred gigabit-per-second system performance
Memory and I/O:
- 0.85V operating voltage for optimized power consumption
- High-speed serial I/O bandwidth for demanding connectivity requirements
- Advanced signal processing capabilities for complex algorithm implementation
Package Details:
- 900-pin FCBGA package (31x31mm form factor)
- Commercial temperature grade (-1 speed grade)
- FBVB900 package optimized for high-density applications
Operating Frequencies:
- Application Processing System: Up to 1.5GHz
- Real-time Processing System: Up to 600MHz
- FPGA fabric: Up to 500MHz
Key Features
- 64-bit processor scalability combining real-time control with programmable logic
- Hard IP blocks for graphics, video, waveform, and packet processing
- Scalable platform supporting system-level investment across product families
- Advanced security features with ARM TrustZone technology
- Comprehensive development ecosystem with Vivado Design Suite support
2. Price Information
Current Market Pricing
The XCZU5EV-1FBVB900E is positioned as a premium SoC solution with pricing reflecting its advanced capabilities:
Reference Pricing Range:
- FOB Price: $1,713.25 – $1,903.61 per unit (minimum order: 1 piece)
- Volume Pricing: Significant discounts available for bulk orders (1,000+ units)
- Distribution: Available through authorized Xilinx/AMD distributors worldwide
Pricing Factors:
- Market demand and supply fluctuations
- Order quantity and volume commitments
- Regional distribution and logistics costs
- Custom packaging and testing requirements
Cost Optimization:
- Long-term supply agreements available for OEM customers
- Engineering support packages included with development quantities
- Flexible payment terms for qualified system integrators
3. Documents & Media
Technical Documentation
Comprehensive documentation package supports rapid development and deployment:
Core Documentation:
- Product Datasheet (PDF): Complete electrical and mechanical specifications
- UltraScale Architecture Overview (PDF): Detailed architecture reference
- Package Pinout Files: ASCII and CSV formats for PCB design
- Product Change Notifications: Latest updates and revisions
Development Resources:
- Vivado Design Suite compatibility guides
- Software Development Kit (SDK) documentation
- Hardware Description Language (HDL) reference materials
- Application notes for specific use cases
Design Files:
- Schematic symbols and PCB footprints for major CAD tools
- 3D models available for mechanical design verification
- Pin assignment files for development boards
- Reference designs for common applications
Software and Tools
- Vivado Design Suite: Industry-leading FPGA development environment
- PetaLinux Tools: Embedded Linux development framework
- Vitis Unified Software Platform: Accelerated development for heterogeneous computing
- Software Development Kit: C/C++ development tools and debuggers
4. Related Resources
Development Platforms
Evaluation and Development Boards:
- ZCU104 Evaluation Kit (recommended for XCZU5EV evaluation)
- Custom development platforms from third-party vendors
- Reference design platforms for specific applications
Design Services:
- Technical Support: Dedicated FPGA engineering assistance
- Design Consultation: Architecture optimization services
- Training Programs: Comprehensive development training courses
- Community Forums: Active developer community support
Ecosystem Partners
Software Partners:
- Real-time operating system vendors
- Computer vision and AI framework providers
- Communication protocol stack suppliers
- Security solution integrators
Hardware Partners:
- Module and SOM manufacturers
- Custom board design services
- Test and measurement equipment providers
- Production and manufacturing services
Application Areas
The XCZU5EV-1FBVB900E excels in demanding applications requiring high performance and flexibility:
Target Markets:
- 5G Infrastructure: Base stations and small cell deployments
- Data Center Acceleration: Network processing and storage acceleration
- Aerospace & Defense: Radar systems and signal intelligence
- Industrial Automation: Machine vision and real-time control
- Medical Imaging: High-resolution imaging and analysis systems
- Automotive: ADAS and autonomous vehicle processing
5. Environmental & Export Classifications
Environmental Compliance
The XCZU5EV-1FBVB900E meets stringent environmental and regulatory standards:
RoHS Compliance:
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- Lead-free packaging and manufacturing processes
- Environmental documentation available for regulatory compliance
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC junction temperature
- Industrial variants available for extended temperature ranges
- Humidity tolerance: Up to 95% non-condensing
- Altitude rating: Up to 2000m operational altitude
Export Control Classifications
International Trade Classifications:
- ECCN (Export Control Classification Number): 5A002.A.4
- HTS (Harmonized Tariff Schedule): 8542390001
- TARIC Code: 8542399000
Export Restrictions:
- Subject to U.S. export administration regulations
- End-use and end-user restrictions may apply
- Export license requirements vary by destination country
- Compliance documentation required for international shipments
Quality and Reliability:
- ISO 9001 certified manufacturing facilities
- Automotive-grade variants available (AEC-Q100 qualified)
- Military-grade options for defense applications
- Extended lifecycle support for long-term deployments
Manufacturing and Lifecycle
Production Information:
- Fab Location: Advanced semiconductor foundries
- Assembly and Test: Global supply chain with regional support
- Lead Times: Standard commercial quantities available
- Lifecycle Status: Active production with long-term roadmap support
Quality Assurance:
- Comprehensive testing at device, package, and system levels
- Statistical quality control with detailed test coverage
- Failure analysis support for field reliability issues
- Product obsolescence planning with minimum 7-year availability guarantee
The XCZU5EV-1FBVB900E represents AMD Xilinx’s commitment to delivering high-performance, power-efficient solutions for next-generation applications. Contact authorized distributors for current pricing, availability, and technical support.
