The XCZU5EG-2FBVB900E is a premium system-on-chip (SOC) solution from AMD’s Zynq UltraScale+ MPSoC family, designed to deliver exceptional processing power and versatility for demanding applications. This advanced multiprocessor system combines ARM Cortex-A53 and Cortex-R5 processing cores with high-performance FPGA fabric, making it ideal for industrial automation, automotive systems, aerospace applications, and advanced embedded computing.
Product Specifications
Processor Architecture
- Primary Processing Core: Quad ARM Cortex-A53 MPCore with CoreSight debug and trace capabilities
- Real-Time Processing: Dual ARM Cortex-R5 processors with CoreSight for real-time control applications
- Graphics Processing: ARM Mali-400 MP2 GPU for advanced graphics rendering
- Operating Frequencies: 533MHz, 600MHz, and 1.3GHz depending on configuration
FPGA and Logic Resources
- Logic Cells: 256K+ programmable logic cells for flexible hardware acceleration
- FPGA Family: Zynq UltraScale+ technology built on advanced 20nm process node
- Speed Grade: -2 speed grade offering balanced performance and power efficiency
- Architecture: UltraScale+ architecture for optimized power consumption and performance
Memory and Connectivity
- Operating Voltage: 0.85V core voltage for enhanced power efficiency
- Package Type: 900-pin FCBGA (31x31mm) for high-density integration
- Package Code: FBVB900 configuration
- Temperature Grade: Extended (E) temperature range for industrial applications
Key Features
- Advanced heterogeneous multiprocessing capabilities
- Integrated security features and encryption acceleration
- High-speed transceivers for communication interfaces
- Extensive peripheral support including PCIe, USB, Ethernet, and serial interfaces
- Real-time processing with deterministic performance
- Scalable architecture supporting various application requirements
Pricing Information
Current Market Pricing (as of May 2025):
- List Price Range: $2,200 – $3,500 USD per unit (varies by distributor and quantity)
- Volume Pricing: Significant discounts available for quantities over 100 units
- Authorized Distributors: Available through DigiKey, Mouser, Avnet, and other major electronics distributors
- Lead Time: Typically 8-16 weeks depending on current demand and inventory levels
Note: Pricing fluctuates based on market conditions, quantity breaks, and distributor agreements. Contact authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Official Datasheet: DS891 – Zynq UltraScale+ MPSoCs Data Sheet: Overview
- Reference Manual: UG1085 – Zynq UltraScale+ Device Technical Reference Manual
- PCB Design Guide: UG1099 – Zynq UltraScale+ MPSoC PCB Design and Pin Planning Guide
- Package and Pinout Files: Available in ASCII TXT and CSV formats from AMD support portal
Software and Development Tools
- Vivado Design Suite: Complete FPGA design environment with synthesis, implementation, and debugging tools
- Vitis Unified Software Platform: Software development environment for application development
- PetaLinux Tools: Embedded Linux development tools and BSP
- SDK and Runtime Libraries: ARM development tools and optimized libraries
Application Notes and White Papers
- Power Management and Optimization Guidelines
- Security Implementation Best Practices
- Real-Time System Design Methodology
- High-Speed Design Considerations
Design Examples and Reference Designs
- Industrial Ethernet Reference Design
- Computer Vision Acceleration Examples
- Motor Control Applications
- Wireless Communication Implementations
Related Resources
Development Platforms
- ZCU102 Evaluation Kit: Full-featured development platform for prototyping
- ZCU104 Evaluation Kit: Cost-optimized development board for evaluation
- Third-Party Boards: Compatible with various commercial and academic development platforms
Compatible Software Frameworks
- OpenAMP: Asymmetric multiprocessing framework
- FreeRTOS: Real-time operating system support
- Linux: Full Linux support with device tree configurations
- Bare Metal: Direct hardware programming capabilities
Training and Support Resources
- AMD University Program training materials
- Online learning modules and tutorials
- Community forums and technical support
- Application engineering consultation services
Ecosystem Partners
- Board-level product partners and system integrators
- Software tool vendors and IP providers
- Training and consulting service providers
- Academic research institutions and programs
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with EU RoHS Directive 2011/65/EU
- REACH Regulation: Compliant with EU REACH chemical safety requirements
- Lead-Free: Lead-free terminations and solder connections
- Halogen-Free: Available in halogen-free package options upon request
Environmental Operating Conditions
- Operating Temperature Range: -40°C to +100°C (Extended temperature grade)
- Storage Temperature Range: -65°C to +150°C
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
Export Control Classifications
- ECCN (Export Control Classification Number): 5A002.A.4
- USHTS (US Harmonized Tariff Schedule): 8542390001
- TARIC (EU Trade Classification): 8542399000
- Export Licensing: May require export license for certain destinations and applications
Quality and Reliability Standards
- ISO 9001: Manufacturing quality management system certification
- ISO 14001: Environmental management system compliance
- IPC Standards: PCB assembly and soldering standards compliance
- Automotive Standards: Available in automotive-qualified versions (Q-grade)
Packaging and Materials
- Package Materials: Industry-standard materials meeting environmental regulations
- Moisture Sensitivity Level: MSL-3 (168 hours at 30°C/60% RH after opening)
- ESD Sensitivity: Class 2 (1000V Human Body Model)
- Shelf Life: 12 months when stored under proper conditions
For technical support, pricing inquiries, or additional product information, contact AMD’s authorized distributors or visit the official AMD developer portal. The XCZU5EG-2FBVB900E represents the cutting edge of heterogeneous computing technology, enabling next-generation applications across multiple industries.
