Overview
The XCZU5EG-1FBVB900I is a high-performance System-on-Chip (SoC) from AMD Xilinx’s Zynq UltraScale+ MPSoC family. This advanced multiprocessor system-on-chip combines ARM processors with programmable logic, delivering exceptional processing power for demanding applications in industrial automation, automotive, communications, and embedded computing.
1. Product Specifications
Processor Architecture
- Processor: Quad ARMยฎ Cortexยฎ-A53 MPCoreโข with CoreSightโข, Dual ARMยฎCortexโข-R5 with CoreSightโข, ARM Maliโข-400 MP2
- CPU Frequencies: 500MHz, 600MHz, 1.2GHz
- Graphics Processing Unit: ARM Mali-400 MP2 for enhanced graphics capabilities
FPGA Specifications
- Logic Cells: 256K+ Logic Cells
- Technology: 20nm Technology
- Operating Voltage: 0.85V
- Family: ZynqยฎUltraScale+โข FPGA
Package & Physical Characteristics
- Package Type: 900-FCBGA (31×31)
- Pin Count: 900 pins
- Form Factor: FC-BGA (Flip Chip Ball Grid Array)
- Mounting Type: Surface Mount Technology (SMT)
Connectivity & Interfaces
The XCZU5EG-1FBVB900I supports comprehensive connectivity options including:
- CANbus, EBI/EMI, Ethernet, IยฒC, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- High-speed serial interfaces for data communication
- Configurable I/O for custom interface requirements
Operating Conditions
- Temperature Range: Industrial grade (-40ยฐC to +85ยฐC)
- Speed Grade: -1 (Standard performance)
- Product Status: Active
2. Price Information
The XCZU5EG-1FBVB900I pricing varies based on quantity and distributor. Current price of XCZU5EG-1FBVB900I is for reference only, if you want to get best price, please submit a inquiry to authorized distributors. Pricing is subject to market conditions and availability.
Availability: Stock: Yes, shipping: Can Ship Immediately from major distributors.
Ordering Information:
- Contact authorized distributors for current pricing
- Minimum order quantities may apply
- Volume discounts available for large orders
3. Documents & Media
Technical Documentation
- Primary Datasheet: Zynq UltraScale+ MPSoC Overview
- Package & Pinout Information: Package Device Pinout Files available in TXT and CSV formats
- Architecture Documentation: UltraScale Architecture and Product Data Sheet: Overview
Safety & Compliance Documents
- Material Safety Data Sheet (MSDS): MSDS Material safety datasheet available
- Application Notes: MFG Application Notes and technical guides
- Design Resources: Comprehensive design guides and reference materials
Development Tools
- Vivado Design Suite: Primary development environment for FPGA design
- Software Development Kit (SDK): For ARM processor programming
- Hardware Description Language (HDL): Support for VHDL and Verilog
4. Related Resources
Development Boards & Evaluation Kits
- Zynq UltraScale+ MPSoC evaluation boards available from various vendors
- Third-party development platforms supporting the XCZU5EG-1FBVB900I
- Reference designs and starter projects
Compatible Products
- XCZU5EG-2FBVB900I: Higher speed grade variant (-2 speed grade)
- XCZU5EG-L1FBVB900I: Low-power variant
- XCZU4EG-1FBVB900I: Alternative with different logic capacity
Software & Programming Tools
- Xilinx Vivado: Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation
- PetaLinux: Linux operating system for Zynq devices
- Bare-metal and RTOS support: FreeRTOS, Zephyr, and other real-time operating systems
Technical Support
- Online forums and community support
- Application engineering assistance
- Training resources and webinars
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Xilinx RoHS Cert certified
- REACH Compliance: Xilinx REACH211 Cert compliant
- Environmental Information: Comprehensive environmental documentation available
Export Control Classifications
- ECCN: 5A002.A.4 (Export Control Classification Number)
- USHTS: 8542390001 (US Harmonized Tariff Schedule)
- TARIC: 8542399000 (European Tariff Classification)
Packaging & Handling
- Standard Packaging: Tray packaging for production quantities
- ESD Sensitivity: Electrostatic discharge sensitive device – proper handling required
- Storage Conditions: Controlled temperature and humidity environment recommended
Applications
The XCZU5EG-1FBVB900I is ideal for:
- Industrial Automation: Motor control, sensor fusion, and process control
- Automotive Electronics: ADAS systems, infotainment, and vehicle networking
- Communications: 5G infrastructure, wireless base stations, and network processing
- Medical Devices: Imaging systems, diagnostic equipment, and patient monitoring
- Aerospace & Defense: Radar systems, communication systems, and signal processing
Key Features & Benefits
- Heterogeneous Processing: Combines ARM processors with FPGA fabric for optimal performance
- Scalable Architecture: Flexible design allows for customization based on application requirements
- Low Power Consumption: Advanced 20nm process technology delivers power efficiency
- High Integration: Reduces system complexity and board space requirements
- Comprehensive Connectivity: Extensive I/O and communication interfaces
- Robust Development Ecosystem: Mature toolchain and extensive community support
Ordering Information
Part Number: XCZU5EG-1FBVB900I
Manufacturer: AMD Xilinx
Category: Integrated Circuits (ICs) – Embedded – System On Chip (SoC)
Lifecycle Status: Active and recommended for new designs
For technical support, pricing, and availability, contact authorized AMD Xilinx distributors or visit the official AMD Xilinx website.
