The XCZU5CG-L1SFVC784I is a cutting-edge System-on-Chip (SoC) solution from AMD (formerly Xilinx), designed to deliver exceptional performance for demanding embedded and edge computing applications. This powerful multiprocessor system-on-chip combines the flexibility of FPGA programmable logic with high-performance ARM processors, making it ideal for industrial automation, automotive systems, aerospace applications, and advanced signal processing.
1. Product Specifications
Core Architecture
- Device Family: Zynq UltraScale+ MPSoC CG Series
- Part Number: XCZU5CG-L1SFVC784I
- Manufacturing Process: 20nm FinFET+ technology
- Core Voltage: 0.85V (VCCINT)
- Speed Grade: -L1 (Low power variant)
Processing System Features
- Application Processors: Dual ARM Cortex-A53 MPCore with CoreSight
- Operating frequency: Up to 1.2GHz
- 64-bit processor architecture
- Level 1 and Level 2 cache memory
- Real-Time Processors: Dual ARM Cortex-R5 with CoreSight
- Operating frequency: Up to 500MHz
- Real-time processing capabilities
- Tightly coupled memory (TCM)
Programmable Logic Resources
- Logic Cells: 256,200+ equivalent logic cells
- CLB Slices: Available for custom logic implementation
- Block RAM: High-capacity on-chip memory blocks
- DSP Slices: Dedicated digital signal processing blocks
- UltraRAM: High-density memory blocks for data-intensive applications
Package and I/O
- Package Type: 784-pin FCBGA (Flip Chip Ball Grid Array)
- Package Size: 23mm x 23mm
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Package Marking: SFVC784I
Power Management
- Low Power Design: L-grade device optimized for reduced power consumption
- Multiple Power Domains: Independent voltage scaling
- Power Management Unit: Integrated PMU for system power control
- Sleep and Standby Modes: Advanced power management features
Connectivity and Interfaces
- High-Speed Transceivers: Integrated GTH transceivers
- PCIe Support: PCIe Gen2/Gen3 interfaces
- Ethernet: Multiple Gigabit Ethernet MACs
- USB: USB 2.0/3.0 controller support
- Memory Interfaces: DDR3/DDR4 memory controller support
2. Price Information
Current Market Pricing (as of May 2025):
The XCZU5CG-L1SFVC784I is available through authorized distributors including:
- DigiKey: Authorized AMD distributor with immediate availability
- Mouser Electronics: Global electronic components distributor
- Avnet: Authorized design chain partner
- Arrow Electronics: Global technology solutions provider
Pricing Factors:
- Volume discounts available for quantities of 1,000+ units
- Pricing varies by distributor and order quantity
- Extended commercial temperature range options may affect pricing
- Lead times typically range from stock to 12-16 weeks for large quantities
For current pricing and availability, please contact authorized distributors directly or request a quote through official channels.
3. Documents & Media
Technical Documentation
- Datasheet: DS891 – Zynq UltraScale+ MPSoC Data Sheet Overview
- User Guide: UG1085 – Zynq UltraScale+ Device Technical Reference Manual
- Package Information: UG1075 – Zynq UltraScale+ Packaging and Pinout Guide
- Selection Guide: Zynq UltraScale+ MPSoC Product Selection Guide
Development Resources
- Vivado Design Suite: Complete FPGA design environment
- Vitis Unified Software Platform: Software development toolkit
- PetaLinux Tools: Embedded Linux development kit
- Reference Designs: Pre-built application examples
Package Files
- Pinout Files: Available in TXT and CSV formats
- Symbol Libraries: For schematic capture tools
- PCB Footprints: For board layout design
- 3D Models: For mechanical design validation
Application Notes
- Power Management: Best practices for low-power design
- High-Speed Design: Signal integrity guidelines
- Thermal Management: Cooling and thermal considerations
- EMC Compliance: Electromagnetic compatibility guidelines
4. Related Resources
Development Boards and Kits
- ZCU102 Evaluation Kit: Full-featured development platform
- ZCU104 Evaluation Kit: Mid-range development solution
- Custom Carrier Boards: Third-party development options
Software Tools
- Xilinx Software Development Kit (SDK): Legacy development environment
- Vitis IDE: Modern unified development platform
- PetaLinux: Embedded Linux distribution
- Bootgen: Boot image generation utility
IP Cores and Libraries
- LogiCORE IP: Verified IP solutions
- Third-Party IP: Partner ecosystem solutions
- Open Source Libraries: Community-developed resources
- Application-Specific IP: Industry-focused solutions
Training and Support
- Technical Documentation: Comprehensive user guides and tutorials
- Online Training: Self-paced learning modules
- Community Forums: Developer community support
- Technical Support: Direct engineering assistance
Alternative Part Numbers
- XCZU5CG-1SFVC784I: Standard speed grade (-1) variant
- XCZU5CG-2SFVC784I: Higher speed grade (-2) variant
- XCZU5CG-L1FBVB900I: 900-pin package alternative
- XCZU4CG-L1SFVC784I: Lower logic capacity alternative
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European Union RoHS directive requirements
- REACH Compliance: Complies with EU chemical regulations
- Halogen-Free: Green package option available
- Lead-Free: Pb-free solder ball construction
Operating Conditions
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Thermal Resistance: Junction-to-case thermal specifications available
Reliability and Quality
- JEDEC Standards: Compliant with industry reliability standards
- Qualification Testing: Extensive reliability testing performed
- Mean Time Between Failures (MTBF): High reliability specifications
- Quality Grade: Industrial temperature and quality standards
Export and Trade Compliance
- Export Classification: Subject to U.S. Export Administration Regulations (EAR)
- ECCN: Export Control Classification Number available upon request
- Country of Origin: Manufacturing location information available
- Trade Compliance: Meets international trade regulations
Packaging and Shipping
- Moisture Sensitivity Level: MSL rating for proper handling
- Packaging Options: Tray, tape and reel available
- Anti-Static Packaging: ESD protection during transport
- Shipping Classifications: Proper hazmat classifications applied
Sustainability
- Conflict Minerals: Compliant with conflict minerals regulations
- Environmental Impact: Low environmental impact manufacturing
- Recycling Programs: End-of-life recycling options available
- Green Initiatives: Part of AMD’s sustainability commitment
Keywords: XCZU5CG-L1SFVC784I, Zynq UltraScale+ MPSoC, AMD FPGA, ARM Cortex-A53, System-on-Chip, embedded processing, programmable logic, 784-pin FCBGA, industrial automation, edge computing, signal processing, low power design
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