Product Overview
The XCZU5CG-1FBVB900I is a high-performance dual-core ARM Cortex-A53 MPCore with CoreSight and dual ARM Cortex-R5 with CoreSight System-on-Chip (SoC) from AMD’s Zynq UltraScale+ MPSoC CG family. This advanced programmable device combines 64-bit processor scalability with programmable logic, delivering exceptional performance for industrial motor control, sensor fusion, and embedded vision applications.
1. Product Specifications
Core Architecture
- Processor: Dual ARM Cortex-A53 MPCore with CoreSight (up to 1.2GHz)
- Real-time Processor: Dual ARM Cortex-R5 with CoreSight (up to 500MHz)
- FPGA Fabric: 256,200+ logic cells with Zynq UltraScale+ programmable logic
- Memory: Distributed on-chip memory including LUTRAM, Block RAM, and UltraRAM
Package Details
- Package Type: 900-pin FC-FBGA (Flip Chip Fine Pitch Ball Grid Array)
- Package Dimensions: 31mm ร 31mm ร 2.27mm
- Pin Count: 900 pins
- Pin Pitch: 1.0mm
- Mounting: Surface Mount Technology (SMT)
- Package Material: Plastic
Electrical Specifications
- Process Technology: 20nm FinFET+ process
- Core Voltage (VCCINT): 0.95V
- Speed Grade: -1 (Industrial grade)
- Operating Temperature: Commercial (0ยฐC to 85ยฐC) / Industrial (-40ยฐC to 100ยฐC)
- Power Efficiency: Up to 30% less static power consumption vs. previous generation
Key Features
- 64-bit Processor Scalability: Combines real-time control with soft and hard processing engines
- High-Speed Peripherals: Gigabit Ethernet, PCIe Gen2, DisplayPort, USB 3.0, SATA 3.1
- Security Features: Trusted boot, secure boot capabilities, and hardware encryption
- Integrated GPU: Graphics processing unit for enhanced visual applications
- Video Processing: Hardware-accelerated video encode/decode capabilities
2. Pricing Information
Current Market Pricing (May 2025)
- DigiKey: $2,574.39 (Single unit pricing)
- Pricing varies by quantity: Volume discounts available for larger orders
- Lead Time: Typically ships same day when in stock
- Availability: Available through authorized distributors including DigiKey, Mouser Electronics, and ECIA authorized partners
Cost Considerations
- Pricing fluctuates based on market demand and supply conditions
- Volume pricing available for production quantities
- Extended temperature range variants may have different pricing
- Engineering samples available for qualified customers
3. Documents & Media
Official Documentation
- Datasheet: Zynq UltraScale+ MPSoC Data Sheet: Overview (DS891)
- Package Files: Pinout files available in TXT and CSV formats
- User Guides: Comprehensive documentation available through AMD Technical Information Portal
- Application Notes: Industry-specific implementation guides
Development Resources
- Design Tools: Vivado Design Suite for FPGA development
- Software Development: Vitis Unified Software Platform for embedded development
- Debug Tools: Integrated debugging and performance optimization tools
- IP Library: Extensive intellectual property library for accelerated development
Technical Support Materials
- Reference Designs: Pre-validated designs for common applications
- White Papers: Performance and power optimization guides
- Training Materials: AMD learning resources and documentation
- Community Support: Technical forums and expert assistance
4. Related Resources
Development Boards and Evaluation Kits
- ZCU102 Evaluation Kit: High-performance development platform
- Custom Development Boards: Third-party boards available from various vendors
- Starter Kits: Entry-level development platforms for prototyping
Software and Tools
- Vivado Design Suite: Complete FPGA design environment
- Vitis Platform: Unified software development platform
- PetaLinux: Embedded Linux development tools
- SDK Support: Software development kit for ARM core programming
Compatible Components
- Memory Controllers: DDR4, LPDDR4 support
- Communication Interfaces: Multiple high-speed serial transceivers
- Power Management: Optimized power delivery solutions
- Development Accessories: Debug probes, cables, and adapters
Application Areas
- Industrial Automation: Motor control and sensor fusion applications
- Automotive Systems: ADAS and infotainment systems
- Telecommunications: 5G wireless infrastructure
- Medical Devices: Portable and stationary medical equipment
- Aerospace & Defense: Mission-critical embedded systems
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European RoHS directive requirements
- Lead-Free: Pb-free package and assembly process
- Halogen-Free: Environmentally conscious packaging materials
- Temperature Grades: Commercial, Industrial, and Extended temperature ranges available
Export Control Classifications
- ECCN (Export Control Classification Number): 5A002.A.4
- USHTS (US Harmonized Tariff Schedule): 8542390001
- TARIC (EU Tariff Code): 8542399000
- Export Restrictions: Subject to US export administration regulations
Quality and Reliability
- Qualification Standards: Automotive-grade versions available for safety-critical applications
- Reliability Testing: Extensive qualification testing for industrial environments
- Lifecycle Support: Extended product lifecycle through 2045
- Quality Certifications: ISO 9001 manufacturing and quality management
Packaging and Handling
- ESD Sensitive: Proper electrostatic discharge precautions required
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification per JEDEC standards
- Storage Requirements: Proper temperature and humidity controlled storage
- Handling Guidelines: Follow semiconductor handling best practices
Why Choose XCZU5CG-1FBVB900I?
The XCZU5CG-1FBVB900I represents the pinnacle of embedded processing technology, combining the flexibility of ARM processors with the parallel processing power of FPGA fabric. Dual-core application processor-equipped (CG) devices are optimal for industrial motor control and sensor fusion, making this device ideal for demanding applications that require real-time processing and adaptability.
With its advanced 20nm process technology, comprehensive peripheral support, and robust development ecosystem, the XCZU5CG-1FBVB900I provides an unmatched platform for next-generation embedded system design. Whether you’re developing Industrial IoT solutions, autonomous vehicle systems, or advanced telecommunications equipment, this MPSoC delivers the performance, efficiency, and scalability your project demands.
Contact our technical team today to discuss your XCZU5CG-1FBVB900I requirements and receive expert guidance on implementation strategies.
