The XCZU5CG-1FBVB900E is a powerful System-on-Chip (SoC) multiprocessor from AMD’s Zynq UltraScale+ MPSoC family, designed for high-performance embedded applications requiring both processing power and programmable logic flexibility.
Product Specifications
Core Architecture
- Processor Configuration: Dual ARM Cortex-A53 MPCore with CoreSight
- Real-Time Processors: Dual ARM Cortex-R5 with CoreSight
- Device Family: Zynq UltraScale+ MPSoC CG Series
- Logic Cells: 256,200+ programmable logic cells
- Technology Node: Advanced 20nm FinFET+ technology
Performance Specifications
- Application Processor Speed: 500MHz, 1.2GHz
- Real-Time Processor Speed: 600MHz
- Speed Grade: -1 (Commercial grade)
- Operating Voltage: 0.85V VCCINT core voltage
- Power Options: Standard and low-power variants available
Package Information
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 900-pin configuration
- Package Code: FBVB900
- Package Size: 31mm x 31mm
- Temperature Grade: E (Extended commercial: 0ยฐC to +85ยฐC)
Key Features
- 64-bit Processor Scalability: Combines real-time control with soft and hard processing engines
- Integrated Graphics: Support for graphics, video, waveform, and packet processing
- Programmable Logic: Extensive FPGA fabric for custom acceleration
- Memory Support: DDR4/DDR3L memory interfaces
- High-Speed Connectivity: Multiple high-speed serial transceivers
- Security Features: Hardware-based security and encryption capabilities
Pricing
Current Market Pricing (2025)
- DigiKey: Starting from $2,059.02 USD (single unit pricing)
- Mouser Electronics: Competitive pricing available upon request
- Volume Pricing: Contact authorized distributors for quantity discounts
- Availability: Regular stock at major distributors
Pricing may vary based on quantity, packaging options, and market conditions. Contact authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Product Datasheet: AMD Zynq UltraScale+ MPSoC DS891 Overview
- Package Pinout Files: Available in TXT and CSV formats (UG1075)
- Design Guide: UltraScale Architecture and Product Data Sheet
- Programming Guide: Vivado Design Suite documentation
- Reference Manual: Zynq UltraScale+ MPSoC Technical Reference Manual
Development Resources
- Software Tools: AMD Vivado Design Suite (recommended)
- SDK Support: Xilinx SDK and PetaLinux tools
- Evaluation Boards: Compatible development platforms available
- Application Notes: Industrial control, motor control, and sensor fusion examples
Package Files and Downloads
- ASCII package files in TXT format
- CSV format pinout files
- IBIS models for signal integrity analysis
- Footprint and symbol libraries for PCB design
Related Resources
Development Ecosystem
- Primary IDE: AMD Vivado Design Suite
- Operating System Support: Linux, FreeRTOS, bare-metal
- Programming Languages: C/C++, VHDL, Verilog, HLS
- Debugging Tools: ARM Development Studio, Vivado Logic Analyzer
Compatible Products
- Memory: DDR4-2400, DDR3L-1600 SODIMM modules
- Power Management: Compatible PMICs for UltraScale+ family
- Connectors: High-speed board-to-board connectors
- Oscillators: Low-jitter clock sources for optimal performance
Application Areas
- Industrial Automation: Motor control and sensor fusion
- Communications: 5G infrastructure and wireless base stations
- Aerospace & Defense: Radar, electronic warfare systems
- Medical Devices: Real-time imaging and diagnostic equipment
- Automotive: ADAS, infotainment, and autonomous driving systems
Training and Support
- Technical Forums: AMD developer community support
- Training Courses: Online and instructor-led training programs
- Application Support: Field Application Engineer assistance
- Documentation Portal: Comprehensive technical library access
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS 2011/65/EU compliant
- REACH Compliance: EU REACH regulation compliant
- Conflict Minerals: Conflict-free sourcing certified
- Green Package: Lead-free and halogen-free options available
Export Classifications
- USHTS Code: 8542390001
- TARIC Code: 8542399000
- ECCN Classification: 5A002.A.4
- Export License: May require export license for certain destinations
- Country of Origin: Typically manufactured in Taiwan or Singapore
Operating Conditions
- Operating Temperature: 0ยฐC to +85ยฐC (Extended Commercial)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 5,000 meters operational
Package and Handling
- Moisture Sensitivity Level: MSL 3
- Package Materials: Lead-free, RoHS compliant
- Electrostatic Discharge: ESD sensitive device (Class 1)
- Shelf Life: Standard semiconductor storage guidelines
Note: The XCZU5CG-1FBVB900E represents AMD’s commitment to providing scalable, high-performance SoC solutions for demanding embedded applications. This device combines the flexibility of programmable logic with the power of ARM processors, making it ideal for applications requiring both real-time processing and hardware acceleration capabilities.
For the latest specifications, pricing, and availability, consult authorized AMD distributors or visit the official AMD documentation portal.
