1. Product Specifications
Core Architecture
- Processor System: Quad-core ARM Cortex-A53 MPCore with CoreSight + Dual ARM Cortex-R5 with CoreSight
- FPGA Logic Cells: 930,300+ logic cells with UltraScale+ architecture
- Operating Frequencies: 533MHz, 1.333GHz
- Technology Node: 16nm FinFET+ process technology
- Operating Voltage: 0.95V core voltage
Package Details
- Package Type: 1517-pin FC-FBGA (Flip Chip Ball Grid Array)
- Package Size: 40mm ร 40mm
- Pin Count: 1517 pins
- Packaging Format: Tray packaging
- Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
Memory and Storage
- On-chip RAM: 256KB integrated memory
- Processing System: Feature-rich 64-bit processing capabilities
- Memory Controllers: DDR4/DDR3L support with high-bandwidth interfaces
RF Data Conversion Features
- RF-ADCs and RF-DACs: Up to 16 channels of integrated RF data converters
- Direct RF Sampling: Eliminates need for external converters
- Digital Signal Processing: Integrated DDCs (Digital Down Converters) and DUCs (Digital Up Converters)
- Soft-Decision FEC: Forward Error Correction capabilities
- I/Q Data Support: Real and complex data processing
Key Applications
- Software-Defined Radio (SDR) systems
- 5G wireless infrastructure
- Cable infrastructure (DOCSIS)
- Cellular base stations
- Radar and satellite communications
- Test and measurement equipment
2. Price Information
XCZU47DR-2FFVG1517E pricing varies based on quantity and supplier:
- Lead Time: Typically 25 weeks from major distributors
- Availability: Active product status with global distribution
- Volume Pricing: Available for bulk orders – contact authorized distributors for quotes
- Market Position: Premium pricing tier reflecting advanced integration and performance
Note: Prices fluctuate based on market conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Official Datasheet: DS889 – Zynq UltraScale+ RFSoC Overview
- User Guides: UG1075 – Package and Pinout Information
- Reference Manuals: Complete technical specifications and programming guides
- Application Notes: Design implementation examples and best practices
Development Resources
- Package Pinout Files: Available in TXT and CSV formats
- Design Files: Reference designs and evaluation board schematics
- Software Tools: Vivado Design Suite compatibility
- Programming Support: Comprehensive development environment
Media Resources
- Product imagery and technical diagrams
- Block diagrams and architecture overviews
- Performance benchmarks and test results
- Video tutorials and webinar recordings
4. Related Resources
Development Tools
- Vivado Design Suite: Primary development environment for XCZU47DR-2FFVG1517E
- Evaluation Boards: XCZU47DR development and evaluation platforms
- Starter Kits: Zynq UltraScale+ RFSoC starter development kits
- Reference Designs: Pre-built solutions for common applications
Software and IP
- ARM Development Tools: Cortex-A53 and Cortex-R5 toolchains
- RF IP Cores: Digital signal processing and communication IP
- Operating System Support: Linux, real-time OS compatibility
- Third-party IP: Ecosystem of compatible intellectual property
Training and Support
- Technical Documentation: Comprehensive user guides and tutorials
- Community Forums: Developer community and technical support
- Training Courses: FPGA design and RFSoC implementation training
- Application Support: Dedicated technical assistance for complex implementations
Compatible Products
- Memory Solutions: DDR4 and DDR3L memory modules
- Clock Management: Precision timing and clock distribution ICs
- Power Management: Specialized power supply solutions for RFSoC
- Development Boards: Evaluation and prototyping platforms
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant – meets current environmental standards
- REACH Compliance: Compliant with EU chemical regulation requirements
- Lead-Free: Manufactured using lead-free processes and materials
- Halogen-Free: Environmentally friendly packaging materials
Quality Standards
- ISO Certifications: Manufactured under ISO 9001 quality management systems
- Automotive Grade: Commercial temperature range suitable for industrial applications
- Reliability Testing: Extensive qualification testing for long-term reliability
- ESD Protection: Anti-static packaging and handling procedures
Export Classifications
- Export Control: Subject to US export administration regulations (EAR)
- ECCN Classification: Check current export control classification number
- Country Restrictions: May require export licenses for certain destinations
- Dual-Use Technology: Advanced semiconductor technology with potential dual-use applications
Shipping and Handling
- Anti-Static Packaging: ESD protection during shipping and storage
- Global Distribution: Available through authorized distributors worldwide
- Express Shipping: DHL, FedEx, UPS, and TNT shipping options available
- Custom Documentation: Proper customs declarations for international shipping
Certifications
- CE Marking: European conformity marking where applicable
- FCC Compliance: US federal communications commission compliance
- IC Certification: Industry Canada certification for Canadian markets
- Regional Approvals: Various regional certifications for global markets
XCZU47DR-2FFVG1517E represents the pinnacle of integrated RF processing technology, combining high-performance ARM processors, advanced FPGA logic, and integrated RF data converters in a single, powerful SoC solution. This device enables next-generation wireless infrastructure, software-defined radio applications, and advanced signal processing systems with unprecedented integration and performance capabilities.
