1. Product Specifications
Core Architecture
- Device Family: AMD Zynq UltraScale+ RFSoC
- Part Number: XCZU29DR-2FFVF1760I
- Logic Cells: 930,300 cells
- Process Technology: 20nm FinFET+ technology
- Operating Voltage: 0.85V core voltage
- Speed Grade: -2 (commercial temperature range)
Package Details
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 1760 pins
- Package Code: FFVF1760
- Form Factor: Tray packaging
- Thermal Performance: Industrial-grade thermal characteristics
Processing System
- Application Processing Unit (APU): Quad-core ARM Cortex-A53 64-bit processor
- Real-time Processing Unit (RPU): Dual-core ARM Cortex-R5 32-bit processor
- Memory Support: DDR4, DDR3, LPDDR4 memory interfaces
- Cache: L1 and L2 cache hierarchy for optimal performance
RF Data Converters
- RF-ADCs: Up to 16 channels of high-speed RF analog-to-digital converters
- RF-DACs: Up to 16 channels of high-speed RF digital-to-analog converters
- Sampling Rate: Multi-GSPS capability with excellent noise spectral density
- Resolution: 12-bit to 14-bit precision for superior signal fidelity
Connectivity & I/O
- High-Speed Transceivers: GTH transceivers supporting up to 16.3 Gbps
- PCIe Support: PCIe Gen3 and Gen4 interfaces
- Ethernet: 100G Ethernet capability
- Interlaken: 150G Interlaken support
- General Purpose I/O: Extensive GPIO options for flexible connectivity
Advanced Features
- SD-FEC: Integrated Soft-Decision Forward Error Correction cores
- LDPC Support: Low-Density Parity-Check coding
- Turbo Codec: Advanced error correction capabilities
- RF PLL: Ultra-low noise programmable RF phase-locked loops
2. Pricing
The XCZU29DR-2FFVF1760I is available through authorized distributors with competitive pricing for volume purchases. Pricing varies based on:
- Quantity: Volume discounts available for larger orders
- Lead Time: Standard and expedited delivery options
- Distribution Channel: Authorized AMD distributors and suppliers
- Market Conditions: Current supply and demand factors
For current pricing and availability, contact authorized AMD distributors or use electronic component search platforms that provide real-time market intelligence and price comparisons from multiple suppliers.
3. Documents & Media
Technical Documentation
- Product Datasheet: Comprehensive specifications and electrical characteristics
- Reference Manual: Detailed programming and configuration guide
- User Guide: Implementation and design methodology documentation
- Pinout Files: Package pinout information in CSV and TXT formats
- Application Notes: Design guidelines and best practices
Development Tools
- Vivado Design Suite: Complete FPGA design environment
- Vitis Unified Software Platform: Software development tools
- PetaLinux Tools: Linux BSP and kernel customization
- RF Analyzer Tool: RF data converter configuration and debug utility
- Frequency Planner: RF frequency planning assistance
Evaluation Platforms
- ZCU111 Evaluation Kit: Comprehensive development platform
- ZCU208 Evaluation Kit: Advanced RF prototyping platform
- ZCU216 Evaluation Kit: High-performance development board
Software Support
- MATLAB/Simulink Integration: Model-based design flow
- Example Designs: Reference implementations and demos
- IP Cores: Pre-verified intellectual property blocks
- Board Support Packages: Ready-to-use software stacks
4. Related Resources
Design Ecosystem
- Xilinx Alliance Program: Partner solutions and support
- Third-party IP: Certified IP from ecosystem partners
- Development Boards: Various form factors and configurations
- System-on-Modules (SOMs): Ready-to-integrate solutions
Training & Support
- Online Training: Comprehensive learning resources
- Webinars: Regular technical presentations and updates
- Technical Forums: Community support and knowledge sharing
- Field Application Engineers: Local technical support
Application Areas
- 5G Infrastructure: Base station and small cell applications
- Wireless Communications: Multi-band, multi-mode radio systems
- Cable Infrastructure: DOCSIS and broadband applications
- Aerospace & Defense: Radar and electronic warfare systems
- Test & Measurement: High-speed data acquisition systems
Competitive Advantages
- Integration: Single-chip RF-to-baseband solution
- Power Efficiency: Up to 50% power reduction vs. multi-chip solutions
- Flexibility: Software-defined radio capabilities
- Performance: Industry-leading RF specifications
- Longevity: Extended product lifecycle support through 2045
5. Environmental & Export Classifications
Environmental Compliance
- Operating Temperature Range: Commercial grade (-40ยฐC to +85ยฐC junction temperature)
- Storage Temperature: Extended range for reliable storage
- Humidity Tolerance: Industrial-grade environmental specifications
- Thermal Management: Advanced package design for efficient heat dissipation
Quality & Reliability
- Manufacturing Standards: ISO 9001 certified production facilities
- Quality Assurance: Comprehensive testing and validation procedures
- Reliability Testing: Extensive burn-in and stress testing
- Lifecycle Support: Long-term availability commitment through 2045
Export Control & Compliance
- Export Classification: Subject to U.S. Export Administration Regulations (EAR)
- ECCN Classification: Specific Export Control Classification Number assigned
- End Use Statement: Required for certain applications and destinations
- Compliance Documentation: Available through authorized channels
RoHS & Environmental Standards
- RoHS Compliant: Lead-free and environmentally friendly
- WEEE Compliance: European waste electrical equipment directive
- REACH Regulation: European chemical registration compliance
- Green Packaging: Sustainable packaging materials
Industry Certifications
- FCC Compliance: Radio frequency emission standards
- CE Marking: European conformity requirements
- IC Certification: Industry Canada compliance
- International Standards: IEC, IEEE, and other relevant standards
Note: The XCZU29DR-2FFVF1760I requires specialized expertise for implementation and may be subject to export control restrictions. Contact AMD or authorized distributors for detailed technical specifications, current pricing, and compliance information. This product is designed for professional use in commercial and industrial applications requiring high-performance RF signal processing capabilities.
