1. Product Specifications
Core Architecture
- Manufacturer: AMD Xilinx (formerly Xilinx)
- Product Family: Zynq UltraScale+ RFSoC
- Part Number: XCZU29DR-1FFVF1760E
- Process Technology: 20nm FinFET+
- Operating Voltage: 0.85V
Processing System (PS)
- ARM Cortex-A53: Quad-core 64-bit processor (APU)
- ARM Cortex-R5: Dual-core real-time processor (RPU)
- Clock Speed: Up to 1.2GHz (ARM Cortex-A53)
Programmable Logic (PL)
- Logic Cells: 930,300 cells
- CLB Flip-Flops: Extensive reconfigurable logic resources
- Block RAM: High-capacity on-chip memory
- UltraRAM: Additional memory resources for data-intensive applications
RF Data Converters
- RF-ADCs: Up to 16 channels of 12-bit, 2.0 GSPS analog-to-digital converters
- RF-DACs: Up to 16 channels of 14-bit, 6.4 GSPS digital-to-analog converters
- Sampling Rate: High-speed direct RF sampling capability
- Noise Performance: Excellent noise spectral density for sensitive applications
High-Speed Connectivity
- GTY Transceivers: 16 channels supporting up to 32.75 Gbps
- GTR Transceivers: 4 channels for additional connectivity
- PCIe: PCIe Gen3/Gen4 support
- 100G Ethernet: Native 100 Gigabit Ethernet capability
- 150G Interlaken: High-speed packet processing interface
Package Information
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 1760 pins
- Package Size: 42.5mm x 42.5mm
- Speed Grade: -1 (Commercial)
- Temperature Grade: E (Extended Commercial: 0ยฐC to +85ยฐC)
Memory Interfaces
- DDR4: Multi-channel DDR4 memory controller
- LPDDR4: Low-power DDR4 support
- High Bandwidth Memory (HBM): Support for HBM2/HBM2E stacks
2. Pricing Information
Current Market Pricing (2025):
- Single unit pricing: Contact distributor for current rates
- Volume pricing: Significant discounts available for quantities >100 units
- Lead time: 6-16 weeks depending on quantity and configuration
- Price Range: Premium pricing tier reflecting advanced RFSoC technology
Authorized Distributors:
- DigiKey Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Regional distributors worldwide
Note: Pricing varies based on quantity, lead time, and market conditions. Contact authorized distributors for current quotations.
3. Documents & Media
Technical Documentation
- Datasheet: DS889 – Zynq UltraScale+ RFSoC Data Sheet
- User Guide: UG1075 – Zynq UltraScale+ Device Packaging and Pinout
- Technical Reference Manual: Complete register and interface specifications
- Product Selection Guide: Family comparison and selection criteria
Design Resources
- Vivado Design Suite: Primary development environment
- System Generator: Model-based design tools
- Reference Designs: Pre-built application examples
- IP Cores: Extensive library of verified IP blocks
Software & Tools
- PetaLinux: Embedded Linux development tools
- Vitis: Unified software platform for acceleration
- MATLAB/Simulink: Integration with MathWorks tools
- GNU Toolchain: Complete development environment
Application Notes
- RF system design guidelines
- Power management recommendations
- Thermal design considerations
- Signal integrity best practices
4. Related Resources
Development Platforms
- ZCU1275: Characterization kit for XCZU29DR evaluation
- ZCU216: RFSoC evaluation board
- Custom carrier boards: Third-party development platforms
Software Ecosystem
- PYNQ: Python-based rapid prototyping framework
- RFSoC-PYNQ: Specialized tools for RF applications
- SDR frameworks: Software-defined radio development tools
- 5G protocol stacks: Commercial and open-source implementations
Training & Support
- AMD Xilinx University Program: Educational resources
- Online training courses: Self-paced learning modules
- Community forums: Technical discussion and support
- Professional services: Design consultation and support
Application Areas
- 5G Wireless Infrastructure: Massive MIMO, beamforming systems
- Radar & SIGINT: Military and aerospace applications
- Cable Infrastructure: DOCSIS 3.1/4.0 systems
- Test & Measurement: High-speed signal analysis equipment
- Satellite Communications: Ground stations and payloads
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Regulation: Compliant with EU chemical regulations
- WEEE Directive: Proper disposal and recycling guidelines
- Conflict Minerals: Responsibly sourced materials
Quality & Reliability
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Temperature: Extended operating range options
- Quality Management: ISO 9001:2015 certified manufacturing
- Reliability Testing: Extensive qualification and characterization
Export Control Classifications
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various (Taiwan, Singapore, Malaysia)
- Export License: May require export license for certain destinations
Safety & Certifications
- FCC Part 15: Electromagnetic compatibility
- CE Marking: European conformity standards
- UL Recognition: Safety standards compliance
- IEC Standards: International electrotechnical standards
Packaging & Handling
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- ESD Protection: Class 1A electrostatic discharge sensitive
- Storage Conditions: -40ยฐC to +125ยฐC storage temperature
- Shelf Life: Indefinite when stored properly
Keywords: XCZU29DR-1FFVF1760E, Zynq UltraScale+ RFSoC, AMD Xilinx FPGA, RF data converters, 5G infrastructure, programmable SoC, high-speed transceivers, ARM Cortex processors
For the latest technical specifications, pricing, and availability, please consult the official AMD Xilinx documentation or contact authorized distributors.
