1. Product Specifications
Core Architecture
- Device Family: Zynq UltraScale+ RFSoC
- Part Number: XCZU28DR-2FFVG1517E
- Technology Node: 16nm FinFET+ (20nm equivalent)
- Speed Grade: -2 (Commercial)
- Package Type: 1517-pin Fine-pitch Ball Grid Array (FCBGA)
Processing System
- Application Processing Unit (APU): Quad-core ARM Cortex-A53 64-bit processors
- Real-time Processing Unit (RPU): Dual-core ARM Cortex-R5F processors
- System Memory: 256KB on-chip memory per processor unit
- Cache Hierarchy: L1 and L2 cache for APU, L1 cache and Tightly Coupled Memory for RPU
Programmable Logic Resources
- Logic Cells: 930,300 system logic cells
- LUTs (Look-Up Tables): 6-input configurable logic blocks
- DSP Slices: 27×18 multipliers for high-performance signal processing
- Block RAM: 36Kb blocks with integrated FIFO and ECC support
- UltraRAM: 4Kx72 blocks for large memory requirements
- Maximum Frequency: 933MHz
RF Data Converters
- ADC Channels: Up to 8 channels of 14-bit RF-ADCs
- ADC Sampling Rate: Up to 5 GSPS (Giga Samples Per Second)
- DAC Channels: Up to 8 channels of 14-bit RF-DACs
- DAC Sampling Rate: Up to 10 GSPS
- Analog Bandwidth: Up to 6GHz
- Frequency Support: All frequency bands below 6GHz for 5G applications
Advanced Features
- Digital Down Converters (DDCs): Power-efficient with programmable interpolation/decimation
- Digital Up Converters (DUCs): NCO and complex mixer support
- Decimation/Interpolation: Multiples of 1, 2, 4, and 8
- SerDes Transceivers: 16 GTY channels with 32.75 Gbps transmission rate
- PS-GTR Transceivers: 4 channels supporting up to 6.0 Gb/s
Electrical Specifications
- Core Voltage: 0.85V (typical 0.95V for core operations)
- Operating Temperature: Industrial temperature range
- Power Efficiency: Optimized for low-power RF applications
Interfaces & Connectivity
- High-Speed Interfaces: PCIe, Interlaken, and Ethernet
- Memory Controllers: DDR4, HMC (Hybrid Memory Cube) support
- External Memory: NAND, SD/eMMC, Quad SPI controllers
- I/O Resources: Comprehensive set of configurable I/O pins
2. Price
The XCZU28DR-2FFVG1517E is positioned as a premium RF SoC solution. Pricing varies based on:
- Quantity Tiers: Volume discounts available for large orders
- Distribution Channel: Authorized distributors offer competitive pricing
- Market Fluctuation: Real-time price monitoring available through distributor networks
- Lead Time: Standard and expedited delivery options
For current pricing and availability, we recommend requesting quotes from authorized distributors such as:
- Octopart price comparison platform
- Worldway Electronics
- Ovaga Technologies
- EBICS distributor network
Note: Prices fluctuate based on global supply chain conditions and demand. Contact authorized distributors for the most current pricing information.
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive 48-page technical specification document
- User Guide: Detailed implementation and design guidelines
- Reference Manual: Complete register and configuration documentation
- Application Notes: RF design best practices and implementation examples
Design Resources
- EDA/CAD Support:
- PCB footprint libraries
- 3D STEP models
- Schematic symbols
- Altium Designer libraries
- Development Tools: Vivado Design Suite compatibility
- IP Cores: Integrated DFE (Digital Front End) IP for 5G applications
Evaluation Platforms
- ZCU111 Evaluation Kit: Complete development platform featuring the XCZU28DR-2FFVG1517E
- Reference Designs: Software-defined radio implementations
- Demo Applications: 5G NR, DOCSIS, and wireless infrastructure examples
Software Support
- Vivado Design Suite: Primary development environment
- Vivado HLS: High-Level Synthesis tools
- SDK: Software Development Kit for ARM processors
- Linux Support: Embedded Linux distributions
4. Related Resources
Development Ecosystem
- AMD Xilinx University Program: Educational resources and training materials
- Technical Support: Comprehensive engineering support network
- Community Forums: FPGA development community and knowledge base
- Training Courses: RF design and FPGA development certification programs
Compatible Products
- Equivalent Devices:
- XCZU28DR-2E (Alternative package)
- XCZU29DR-2FFVG1517I (Industrial temperature range)
- XCZU28DR-1 (Speed grade -1 variant)
- Development Boards: ZCU111, ZCU208, ZCU216 evaluation platforms
- Companion ICs: Clock generators, power management solutions
Application Resources
- 5G Infrastructure: Base station and small cell implementations
- Software Defined Radio: Direct RF sampling architectures
- Test & Measurement: High-speed data acquisition systems
- Aerospace & Defense: Radar and electronic warfare applications
- Medical Imaging: High-resolution imaging systems
Technical Support Channels
- FPGA Forums: Community-driven technical discussions
- Application Engineering: Direct access to AMD technical experts
- Design Consultants: Third-party design service providers
- Training Partners: Authorized training organizations
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free and RoHS compliant (varies by source – some indicate compliant, others non-compliant)
- REACH Compliance: Meets European chemical safety regulations
- Green Technology: Environmentally conscious manufacturing processes
- Conflict Minerals: Compliant with conflict minerals regulations
Export Control Classifications
- HTS Code: 8542.31.00.01 (Harmonized Tariff Schedule)
- ECCN: Subject to U.S. Export Administration Regulations
- Export Restrictions: May require export licenses for certain destinations
- Country of Origin: Manufactured in facilities compliant with international standards
Quality & Reliability
- ISO Certification: Manufactured in ISO-certified facilities
- Automotive Grade: Suitable for automotive applications (where specified)
- Military Standards: Meets relevant military and aerospace standards
- Reliability Testing: Extensive qualification and reliability testing
Packaging & Handling
- Moisture Sensitivity: Controlled humidity packaging
- ESD Protection: Electrostatic discharge protection required
- Storage Requirements: Temperature and humidity controlled storage
- Peak Reflow Temperature: Specified soldering temperature limits
Regulatory Compliance
- FCC Certification: Compliant with FCC regulations for RF emissions
- CE Marking: European conformity marking where applicable
- Safety Standards: IEC and UL safety standard compliance
- Telecommunication Standards: 3GPP and IEEE standard compliance
Why Choose XCZU28DR-2FFVG1517E?
The XCZU28DR-2FFVG1517E represents the pinnacle of RF SoC technology, offering unmatched integration of processing power, RF capabilities, and programmable logic. Its comprehensive feature set makes it the ideal choice for next-generation wireless infrastructure, enabling rapid deployment of 5G networks and advanced RF applications.
Key Benefits:
- Single-chip solution reduces system complexity and cost
- Integrated RF data converters eliminate external components
- High-performance ARM processors enable software-defined functionality
- Extensive ecosystem support accelerates development
- Future-proof architecture supports evolving standards
For technical inquiries, pricing, or application support, contact authorized AMD distributors or visit the AMD Xilinx technical support portal.
