1. Product Specifications
Core Architecture
- Family: Zynq UltraScale+ RFSoC
- Logic Cells: 930,300 programmable logic cells
- Package Type: FFVG1517 (1517-pin Fine-pitch Ball Grid Array)
- Speed Grade: -1 (Industrial grade)
- Process Technology: 16nm FinFET+ manufacturing process
- Operating Voltage: 0.85V core voltage
Processing System
- Primary Processor: 64-bit quad-core ARM Cortex-A53 application processor
- Real-time Processor: Dual-core ARM Cortex-R5 real-time processor
- Processing Architecture: Heterogeneous multiprocessor system
- Memory Support: DDR4/DDR3L memory interfaces
RF Data Converter Capabilities
- RF-ADC Channels: Up to 16 channels with 14-bit resolution
- RF-DAC Channels: Up to 16 channels with 14-bit resolution
- ADC Sampling Rate: Up to 5 GSPS (Giga Samples Per Second)
- DAC Sampling Rate: Up to 10 GSPS
- Analog Bandwidth: Up to 6 GHz
- Frequency Support: All frequency bands below 6 GHz for 5G applications
Digital Signal Processing Features
- Digital Down Converters (DDCs): Power-efficient with programmable decimation
- Digital Up Converters (DUCs): Programmable interpolation capabilities
- Numerically Controlled Oscillator (NCO): Integrated for frequency synthesis
- Complex Mixer: Built-in for signal processing
- Dual-band Operation: Support for simultaneous multi-band processing
Environmental Specifications
- Operating Temperature Range: Industrial grade (-40ยฐC to +100ยฐC)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Humidity: 10% to 90% non-condensing
- Package Dimensions: BGA1517 standard footprint
2. Price
The XCZU28DR-1FFVG1517I is available through authorized distributors with competitive pricing based on quantity requirements. Pricing varies by:
- Volume Discounts: Significant cost reductions for bulk orders
- Lead Time: Standard and expedited delivery options available
- Market Conditions: Current semiconductor market pricing
- Distributor Selection: Multiple authorized channels available
For current pricing and availability, contact authorized AMD Xilinx distributors or submit a Request for Quote (RFQ) specifying quantity requirements and target pricing. Major distributors including DRex Electronics, FPGAkey, and Worldway Electronics maintain active inventory with competitive pricing structures.
3. Documents & Media
Technical Documentation
- Official Datasheet: DS889 – Zynq UltraScale+ RFSoC Overview (Available from AMD Technical Information Portal)
- Product Brief: Comprehensive feature overview and application guidelines
- Pin Description: Complete pinout documentation for FFVG1517 package
- Electrical Characteristics: Detailed DC and AC specifications
- Thermal Characteristics: Junction temperature and thermal resistance data
Design Resources
- Reference Designs: Pre-validated hardware designs for common applications
- Application Notes: Implementation guidelines for specific use cases
- User Guides: Step-by-step development and deployment instructions
- Errata Documentation: Known issues and workaround solutions
Software & Tools
- Vivado Design Suite: Primary development environment for XCZU28DR-1FFVG1517I
- PetaLinux Tools: Linux development kit for embedded applications
- Software Development Kit (SDK): Application development tools
- IP Catalog: Pre-verified intellectual property blocks
Media Resources
- Product Videos: Technical overviews and demonstration content
- Webinar Recordings: Educational content and best practices
- Training Materials: Comprehensive learning resources
- Community Forums: Technical support and peer collaboration
4. Related Resources
Development Platforms
- ZCU111 Evaluation Kit: Complete development platform for RFSoC evaluation
- ZCU208 Evaluation Kit: Advanced evaluation board for high-performance applications
- ZCU216 Evaluation Kit: Production-ready development platform
Complementary Products
- Memory Solutions: Compatible DDR4/DDR3L memory modules
- Clock Management: High-performance clock generation and distribution ICs
- Power Management: Optimized power supply solutions for RFSoC applications
- RF Components: Matching network components and RF front-end solutions
Application Segments
- 5G Infrastructure: Base station and small cell implementations
- Aerospace & Defense: Radar systems and electronic warfare applications
- Test & Measurement: High-speed data acquisition and signal analysis
- Cable Infrastructure: DOCSIS and broadband communication systems
- Wireless Communications: Software-defined radio implementations
Technical Support Resources
- AMD Xilinx Support Portal: Comprehensive technical support and documentation
- Community Forums: Peer-to-peer technical discussions and solutions
- Training Programs: Professional development and certification courses
- Third-party Ecosystem: Validated partner solutions and services
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with Restriction of Hazardous Substances directive
- REACH Compliance: Meets European Chemical Agency requirements
- Lead-free: 100% lead-free manufacturing and assembly processes
- Halogen-free: Environmentally responsible material composition
- Conflict Minerals: Compliant with conflict minerals regulations
Export Control Classifications
- HTS Code: 8542.31.00.01 (Harmonized Tariff Schedule classification)
- ECCN: Export Control Classification Number as per US Export Administration Regulations
- Country of Origin: Manufacturing location documentation available
- Export Licensing: Subject to applicable export control regulations
- Trade Compliance: Full compliance with international trade requirements
Quality & Reliability Standards
- JEDEC Standards: Compliant with industry-standard reliability testing
- Automotive Grade: AEC-Q100 qualified variants available
- Industrial Grade: Extended temperature range operation
- Quality Management: ISO 9001 certified manufacturing processes
- Reliability Testing: Comprehensive stress testing and qualification
Package & Handling
- Moisture Sensitivity Level: MSL-3 classification for storage and handling
- Package Marking: Clear identification and traceability markings
- Anti-static Protection: ESD-safe packaging and handling requirements
- Storage Requirements: Specific temperature and humidity guidelines
- Shelf Life: Standard semiconductor component shelf life specifications
Note: Specifications subject to change without notice. Consult official AMD Xilinx documentation for the most current technical specifications and availability information. The XCZU28DR-1FFVG1517I represents the pinnacle of software-defined radio technology, combining exceptional processing power with industry-leading RF performance in a single, integrated solution.
