Product Specifications
Core Architecture
- Part Number: XCZU21DR-2FFVD1156E
- Family: Zynq UltraScale+ RFSoC
- Logic Cells: 930,300 cells
- Technology Node: 20nm technology
- Package: 1156-Pin FCBGA
- Speed Grade: -2
Processing System
- ARM Cortex-A53: Quad-core 64-bit ARM Cortex-A53 (APU)
- ARM Cortex-R5: Dual-core ARM Cortex-R5 (RPU) processing system
- Operating Systems Support: Linux, Android, Xilinx RTOS
RF Data Converters
- RF-ADCs: Up to 16 channels of RF-ADCs
- RF-DACs: Up to 16 channels of RF-DACs
- Digital Signal Processing: Integrated DDCs (Digital Down Converters) and DUCs (Digital Up Converters)
- Configuration: Individual real data or paired I/Q data configuration
Technical Specifications
- Supply Voltage: 0.85V / 0.9V
- Maximum Frequency: 4 GHz
- Maximum Operating Temperature: 100ยฐC
- Number of Transceivers: 16
- RAM Size: 1.6 MB
Memory & Connectivity
- Memory Controllers: DDR3 and LPDDR3 support
- High-Speed Serial: Up to 28.21Gb/s serial transceivers
- Interface Protocols: PCIe, 100G Ethernet, 150G Interlaken
- Connectivity: ARM AMBA AXI4 protocol for high-bandwidth connections
Security Features
- Boot Security: 256-bit AES-GCM and SHA/384 blocks
- Configuration Security Unit (CSU): Secure boot capability
- Encryption: User encryption support after boot
Monitoring Capabilities
- System Monitor: On-chip temperature and supply sensors
- External Monitoring: Up to 17 external analog inputs
- Environmental Monitoring: Real-time physical environment monitoring
Price
The XCZU21DR-2FFVD1156E pricing varies based on quantity and distributor. Pricing fluctuates based on global market conditions and inventory levels. For current pricing information:
- Volume Pricing: Available through authorized distributors
- Stock Availability: 8 pcs in stock (varies by distributor)
- Lead Time: Contact distributors for current lead times
- Request Quote: Submit RFQ for competitive pricing
Recommended Distributors:
- Octopart (price comparison from 15+ distributors)
- Micro-Semiconductor.com
- FPGAkey
- Allicdata Electronics
Documents & Media
Technical Documentation
- Official Datasheet: PDF datasheet available from AMD/Xilinx
- Product Guide: Zynq UltraScale+ RFSoC comprehensive documentation
- Programming Guide: Vivado Design Suite documentation
- Reference Manual: Hardware and software integration guides
Development Resources
- Vivado Design Suite: Primary development environment
- SDK/Vitis: Software development platform
- IP Catalog: Pre-verified IP cores and reference designs
- Application Notes: Implementation guidelines and best practices
CAD Resources
- Symbol Libraries: Schematic symbols for major CAD tools
- Footprint Libraries: PCB layout footprints
- 3D Models: STEP files for mechanical design
- Pin Configuration: Detailed pinout documentation
Related Resources
Development Platforms
- Evaluation Boards: ZCU111 evaluation kit recommended
- Reference Designs: Software-defined radio implementations
- Starter Kits: Zynq UltraScale+ RFSoC development platforms
Software Tools
- Vivado Design Suite: User-friendly synthesis and implementation
- MATLAB/Simulink: System-level design and verification
- GNU Radio: Open-source software-defined radio framework
- LabVIEW: Graphical programming environment
Application Areas
- 5G Wireless Infrastructure: Base station and small cell applications
- Software-Defined Radio: Direct RF sampling implementations
- Cable Infrastructure: DOCSIS applications
- Aerospace & Defense: Radar and communication systems
- Test & Measurement: High-speed data acquisition systems
Technical Support
- Community Forums: Xilinx developer community
- Application Engineers: Technical design support
- Training Programs: FPGA and SoC design courses
- Webinars: Regular technical presentations
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free manufacturing process
- REACH Compliance: European chemical regulation compliance
- Operating Temperature Range: Commercial grade (0ยฐC to 85ยฐC)
- Storage Temperature: -65ยฐC to 150ยฐC
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
Export Classifications
- Export Control Classification Number (ECCN): Subject to U.S. export regulations
- Country of Origin: Manufactured in Asia-Pacific region
- Harmonized Tariff Schedule (HTS): 8542.39.0001
- Export Licensing: May require export license for certain countries
Package & Handling
- Package Type: Flip-Chip Ball Grid Array (FCBGA)
- Pin Count: 1156 pins
- Package Dimensions: 35mm x 35mm nominal
- Anti-Static Requirements: ESD sensitive device – proper handling required
- Storage Requirements: Dry storage in sealed moisture barrier bag
Quality Standards
- Quality Grade: Production quality
- Lifecycle Status: Production (active)
- MTBF: High reliability for mission-critical applications
- Quality Certifications: ISO 9001 manufacturing quality standards
Keywords: XCZU21DR-2FFVD1156E, Zynq UltraScale+ RFSoC, FPGA, Software-Defined Radio, 5G Infrastructure, RF Data Converters, ARM Cortex-A53, Xilinx FPGA, Programmable Logic, High-Speed Processing
