Bottom Line Up Front: The XCVU440-2FLGB2377E is a high-performance Field Programmable Gate Array (FPGA) from AMD/Xilinx’s Virtex UltraScale family, featuring 5,540,850 logic cells, advanced 20nm technology, and exceptional power efficiency designed for demanding applications requiring heterogeneous processing capabilities.
Product Specifications
Core Features
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Virtex UltraScale FPGA
- Part Number: XCVU440-2FLGB2377E
- Logic Elements: 5,540,850 cells / 4,432,680 logic blocks
- Process Technology: Advanced 20nm manufacturing node
- Package Type: 2377-Pin FCBGA (Flip Chip Ball Grid Array)
- Speed Grade: -2 (Standard performance tier)
- Operating Voltage: 0.922V to 0.979V core supply
Advanced Capabilities
- Total Block RAM: 88.6Mb (90,726 Kbit)
- I/O Pins: 1,300 user I/O
- I/O DLLs: 120 high-performance delay-locked loops
- Operating Frequency: Up to 594MHz
- Technology Architecture: UltraScale with SSI (Stacked Silicon Interconnect)
- DSP Performance: High DSP-to-logic ratio for signal processing applications
Physical Characteristics
- Package Dimensions: 2377-Ball FCBGA format
- Mounting Type: Surface Mount Technology (SMT)
- Operating Temperature Range: 0ยฐC to 100ยฐC (Junction Temperature)
- Package Weight: Optimized for high-density applications
Price Information
Current Market Pricing
The XCVU440-2FLGB2377E commands premium pricing reflective of its advanced capabilities:
- Single Unit Price: Approximately $60,496 USD
- Volume Pricing: Available for quantities of 10+ units with progressive discounts
- Market Position: High-end enterprise and aerospace/defense applications
- Lead Time: 40 weeks from authorized distributors
- Availability: Active product status with global distribution network
Cost Considerations
- Premium pricing reflects advanced 20nm technology and high logic density
- Competitive total cost of ownership due to power efficiency and integration capabilities
- Volume discounts available for production quantities
Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive PDF available from AMD/Xilinx
- Reference Manuals: UltraScale Architecture user guides and implementation guides
- Application Notes: Power management, signal integrity, and design optimization
- Design Tools: Vivado Design Suite compatibility and optimization guides
Development Resources
- CAD Models: 3D package models for PCB design tools
- Pin-out Information: Complete I/O assignment and electrical characteristics
- Timing Models: Speed files and timing analysis data
- Power Models: Dynamic and static power estimation tools
Software Support
- Vivado Design Suite: Primary development environment with synthesis and implementation
- IP Catalog: Extensive library of verified IP cores and reference designs
- Debugging Tools: ChipScope Pro and integrated logic analyzers
- Simulation Models: Behavioral and timing simulation support
Related Resources
Development Ecosystem
- Evaluation Boards: Xilinx UltraScale development kits and reference platforms
- Partner Solutions: Third-party boards from Avnet, Digilent, and other ecosystem partners
- Training Materials: Online courses and certification programs for UltraScale architecture
Compatible Products
- XCVU440 Family Variants: Different speed grades and package options available
- Memory Interfaces: DDR4, DDR3, LPDDR4 controller IP and reference designs
- Connectivity IP: PCIe Gen3/4, Ethernet, USB, and high-speed serial interfaces
Application Areas
- Aerospace & Defense: Radar processing, software-defined radio, secure communications
- Data Center Acceleration: AI/ML inference, database acceleration, network processing
- 5G Infrastructure: Baseband processing, beamforming, network function virtualization
- High-Performance Computing: Scientific computing, financial modeling, image processing
Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant – meets European restriction of hazardous substances
- REACH Compliance: Compliant with EU chemical safety regulations
- Conflict Minerals: Sourced responsibly per industry standards
- Pb-Free: Lead-free manufacturing and assembly processes
Operating Environmental Specifications
- Operating Temperature: 0ยฐC to 100ยฐC junction temperature
- Storage Temperature: Extended range for non-operating conditions
- Humidity Tolerance: Standard semiconductor environmental ratings
- Shock and Vibration: Suitable for industrial and aerospace applications
Export and Trade Classifications
- ECCN Classification: Subject to US Export Administration Regulations (EAR)
- Export Control: May require export licenses for certain countries and applications
- ITAR Status: Commercial product, not subject to International Traffic in Arms Regulations
- Country of Origin: Manufactured in qualified semiconductor facilities
Quality and Reliability
- Quality Standard: ISO 9001 certified manufacturing processes
- Reliability Testing: Comprehensive qualification including thermal cycling and stress testing
- Packaging Standards: JEDEC-compliant packaging with traceability
- Product Status: Active production with long-term support commitment
Key Applications: The XCVU440-2FLGB2377E excels in applications requiring massive parallel processing, high-speed I/O, and power efficiency, making it ideal for next-generation data center acceleration, 5G infrastructure, aerospace systems, and advanced driver assistance systems (ADAS).
Competitive Advantages: Advanced UltraScale architecture delivers up to 2x power efficiency compared to previous generations while providing exceptional logic density and integrated high-speed transceivers for comprehensive system-on-chip solutions.
