“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XCVU37P-3FSVH2892E: High-Performance Xilinx Virtex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

Product Specifications

The XCVU37P-3FSVH2892E features robust technical specifications that make it ideal for complex digital signal processing and high-bandwidth applications:

Core Architecture:

  • Logic Cells: 3,780,000 system logic cells
  • CLB Flip-Flops: 4,560,000
  • CLB LUTs: 2,280,000
  • Block RAM: 132.9 Mb total block RAM
  • UltraRAM: 216 Mb integrated UltraRAM blocks

Processing Capabilities:

  • DSP Slices: 5,952 DSP48E2 slices for high-performance arithmetic operations
  • Speed Grade: -3 (highest performance grade)
  • Operating voltage: Multiple I/O standards supported

Package Details:

  • Package Type: FSVH2892 (Flip-Chip Stacked Very High pin count)
  • Pin Count: 2,892 pins
  • Package Size: 55mm x 55mm BGA
  • Operating Temperature Range: Commercial (0ยฐC to +85ยฐC)

Connectivity Features:

  • PCIe Gen4 x16 interfaces
  • 100G Ethernet MAC support
  • High-speed serial transceivers: Up to 32.75 Gbps
  • DDR4-3200 memory interface support

Price

The XCVU37P-3FSVH2892E pricing varies based on quantity and distributor. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. Lead times may vary depending on market conditions and production schedules.

Note: Pricing is subject to change without notice. Contact your local distributor for the most current pricing information for the XCVU37P-3FSVH2892E.

Documents & Media

Essential documentation and resources for the XCVU37P-3FSVH2892E include:

Technical Documentation:

  • Product Data Sheet: Complete electrical and mechanical specifications
  • User Guide: Implementation guidelines and best practices
  • Package and Pinout Information: Detailed pin assignments and package drawings
  • Power and Thermal Guidelines: Power consumption estimates and thermal management

Development Resources:

  • Vivado Design Suite compatibility information
  • Reference designs and application notes
  • IP core compatibility matrix
  • Timing and constraint guidelines

Software Support:

  • Vivado Design Suite 2023.1 or later
  • Vitis Unified Software Platform support
  • Hardware-in-the-loop simulation tools
  • Debug and verification utilities

Related Resources

Complementary products and resources that enhance XCVU37P-3FSVH2892E implementation:

Development Boards:

  • VCU128 Evaluation Kit (compatible with similar Virtex UltraScale+ devices)
  • Custom carrier boards from third-party vendors
  • Evaluation and prototyping platforms

IP Cores and Libraries:

  • Xilinx LogiCORE IP portfolio
  • DSP and communications IP blocks
  • Interface IP for PCIe, Ethernet, and memory controllers
  • Security and encryption IP cores

Design Tools:

  • Vivado Design Suite
  • Vitis HLS for high-level synthesis
  • System Generator for DSP
  • ChipScope Pro for in-system debugging

Training and Support:

  • Xilinx University Program resources
  • Technical support forums and communities
  • Professional design services partnerships

Environmental & Export Classifications

The XCVU37P-3FSVH2892E meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS compliant (Lead-free manufacturing)
  • REACH regulation compliance
  • Conflict minerals reporting compliant
  • ISO 14001 environmental management certified manufacturing

Export Classifications:

  • Export Control Classification Number (ECCN): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.33.0001
  • Country of Origin: Varies by manufacturing location
  • Export licensing may be required for certain destinations

Quality Standards:

  • ISO 9001:2015 quality management certified
  • Automotive-grade versions available (contact for AEC-Q100 qualified parts)
  • Military and aerospace screening available through qualified suppliers

Packaging and Handling:

  • Moisture sensitivity level (MSL): Level 3
  • Anti-static packaging required
  • Storage temperature range: -55ยฐC to +150ยฐC
  • Recommended storage humidity: <85% RH

The XCVU37P-3FSVH2892E represents the pinnacle of FPGA technology, offering unmatched performance and flexibility for next-generation applications requiring massive parallel processing capabilities and high-speed connectivity.