Product Specifications
Core Architecture
- Part Number: XCVU35P-L2FSVH2104E
- Manufacturer: AMD/Xilinx (formerly Xilinx)
- Family: Virtex UltraScale+ HBM FPGA
- Technology Node: 16nm/20nm FinFET+ process technology
- Logic Cells: 1,906,800 system logic cells
- Logic Elements: 1,906,800 logic units
- CLBs/LABs: 108,960 Configurable Logic Blocks
Electrical Specifications
- Supply Voltage (VCCINT): 0.72V/0.85V dual voltage operation
- Core Voltage Range: 0.698V ~ 0.742V
- Speed Grade: -L2 (Low power variant with -2 speed performance)
- Operating Temperature: 0ยฐC ~ 100ยฐC (TJ – Junction Temperature)
- Temperature Range: Extended (E), Industrial (I), and Military (M) options available
Package & I/O
- Package Type: 2104-Pin FC-FBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 47.5mm ร 47.5mm
- Total I/O Pins: 416 user I/O
- Pin Count: 2104 total pins
- Mounting Type: Surface Mount Technology (SMT)
- Package Format: Tray packaging
Performance Features
- Memory Integration: High Bandwidth Memory (HBM) support
- DSP Slices: Advanced signal processing capabilities
- Block RAM: Integrated memory blocks for data storage
- UltraRAM: Additional high-density memory resources
- Transceivers: Next-generation high-speed serial transceivers
- Maximum Frequency: Up to 800MHz operation
Power Management
The XCVU35P-L2FSVH2104E features advanced power optimization:
- Low Power Operation: -L2 grade provides reduced static power consumption
- Dual Voltage Support: 0.85V operation maintains -2I speed grade performance
- Ultra-Low Power Mode: 0.72V operation for maximum power efficiency
- Dynamic Power Scaling: Adaptive power management based on workload demands
Price Information
Current Market Pricing (Subject to availability and quantity):
- Pricing varies significantly based on current semiconductor market conditions
- Volume discounts available for bulk orders
- Lead times may vary due to high demand for advanced FPGAs
- Contact authorized distributors for current quotes and availability
Authorized Distributors:
- DigiKey Electronics
- Mouser Electronics
- Avnet
- Arrow Electronics
- Future Electronics
Note: Due to semiconductor supply chain fluctuations since 2021, prices are subject to frequent changes. Contact distributors directly for real-time pricing and lead times.
Documents & Media
Technical Documentation
- Product Datasheet: Complete electrical and mechanical specifications
- User Guide: XCVU35P comprehensive implementation guide
- Design Guide: Virtex UltraScale+ FPGA design methodology
- Package Information: Mechanical drawings and pin assignments
- Thermal Design Guidelines: Heat dissipation and thermal management
- Power Estimation Tools: Dynamic and static power calculation utilities
Software & Development Tools
- Vivado Design Suite: Primary development environment for synthesis, implementation, and debugging
- Software Development Kit (SDK): Embedded software development tools
- IP Catalog: Pre-verified intellectual property cores
- Reference Designs: Application-specific starting templates
- Simulation Models: Behavioral and timing simulation support
Application Notes
- High-Performance Computing (HPC) implementations
- Machine Learning acceleration techniques
- 5G wireless infrastructure designs
- Data center acceleration solutions
- Video processing and computer vision applications
Related Resources
Development Platforms
- Evaluation Boards: XCVU35P development and evaluation kits
- Reference Boards: Application-specific demonstration platforms
- Starter Kits: Entry-level development packages
- Third-Party Boards: Partner ecosystem development platforms
Software Ecosystem
- Operating System Support: Linux, VxWorks, FreeRTOS compatibility
- Programming Languages: VHDL, Verilog, SystemVerilog, C/C++, OpenCL
- High-Level Synthesis: C/C++ to RTL conversion tools
- Debug Tools: Integrated logic analyzer and protocol checker
Application Areas
- Artificial Intelligence: Deep learning inference and training acceleration
- 5G Infrastructure: Baseband processing and beamforming
- Cloud Computing: Workload acceleration and data processing
- Automotive: ADAS and autonomous driving systems
- Aerospace & Defense: Signal processing and communications
- Medical Imaging: Real-time image processing and analysis
- Financial Services: Low-latency trading and risk analysis
Technical Support
- Documentation Portal: Comprehensive technical library
- Community Forums: Developer community and peer support
- Training Resources: Online courses and certification programs
- Application Engineering: Direct technical support from AMD/Xilinx experts
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Regulation: Compliant with European chemical safety standards
- Conflict Minerals: Compliant with conflict-free sourcing requirements
- ISO 14001: Manufactured under environmental management standards
Quality & Reliability
- Quality Standards: ISO 9001:2015 certified manufacturing
- Reliability Testing: Extensive qualification and stress testing
- Product Lifecycle: Long-term availability and support commitment
- Automotive Grade: Available in automotive-qualified variants (contact for details)
Export Control Information
- ECCN Classification: Export Control Classification Number compliance
- Country of Origin: Manufactured in approved facilities
- Export Restrictions: Subject to applicable export control regulations
- Documentation: Certificate of Compliance available upon request
Product Status
- Lifecycle Stage: Active product in full production
- Recommended for New Designs: Suitable for current and future projects
- Long-term Support: Extended product lifecycle commitment
- Migration Path: Clear upgrade path to future device families
The XCVU35P-L2FSVH2104E represents the pinnacle of FPGA technology, offering unmatched performance, flexibility, and efficiency for next-generation computing applications. With its advanced architecture and comprehensive development ecosystem, this device enables engineers to tackle the most challenging digital signal processing and compute acceleration requirements.
