1. Product Specifications
Core Architecture
- Device Family: Virtexยฎ UltraScale+โข HBM FPGA
- Manufacturer: AMD (formerly Xilinx)
- Part Number: XCVU35P-1FSVH2892E
- Speed Grade: -1 (standard performance)
- Process Technology: 16nm FinFET+ technology
Logic Resources
- Logic Cells: 1,906,800 system logic cells
- CLB Slices: 49,597,645 configurable logic blocks
- DSP Slices: Optimized for high-performance signal processing
- Block RAM: High-density memory blocks for data buffering
- UltraRAM: Advanced memory hierarchy for large data sets
I/O and Connectivity
- User I/Os: 416 high-speed I/O pins
- High-Speed Transceivers: Next-generation transceivers supporting multiple protocols
- Memory Interfaces: DDR4, HBM2, and other high-bandwidth memory support
- PCIe Support: PCIe Gen3/Gen4 compliance for system integration
Package Details
- Package Type: FSVH2892 (Flip-Chip Stacked Very High pin count)
- Pin Count: 2892 pins
- Package Technology: FCBGA (Flip-Chip Ball Grid Array)
- Thermal Solution: Advanced thermal design for high-performance operation
Electrical Characteristics
- Core Voltage (VCCINT): 0.85V nominal
- I/O Voltage: Multiple voltage standards supported
- Power Consumption: Optimized for performance per watt
- Operating Temperature: Industrial temperature range
Performance Features
- High Bandwidth Memory (HBM): Integrated HBM2 stacks for memory-intensive applications
- AI/ML Acceleration: Dedicated DSP engines for neural network processing
- Video Processing: Hardware acceleration for video codecs and image processing
- Networking: High-speed packet processing capabilities
2. Price Information
Pricing Structure
- Quantity Breaks: Volume discounts available for large orders
- Lead Time: Standard lead times apply; expedited options available
- Currency: Pricing available in USD, EUR, and other major currencies
- Quote Request: Contact authorized distributors for current pricing
Market Positioning
The XCVU35P-1FSVH2892E is positioned as a premium FPGA solution, with pricing reflecting its advanced HBM technology and high-performance capabilities. For current pricing and availability, contact authorized AMD distributors or submit a Request for Quote (RFQ).
Cost Considerations
- Initial unit cost offset by performance advantages
- Reduced system complexity through integration
- Lower total cost of ownership for high-performance applications
- Development cost savings through comprehensive tool support
3. Documents & Media
Technical Documentation
- Product Data Sheet: Comprehensive specifications and electrical characteristics
- User Guide: Detailed implementation guidelines and best practices
- Package and Pinout Information: Pin assignments and package drawings
- Power and Thermal Guidelines: Thermal management and power consumption data
Design Resources
- Reference Designs: Proven implementations for common applications
- Application Notes: Specific use case implementations and optimizations
- IP Cores: Pre-verified intellectual property for rapid development
- Evaluation Boards: Development platforms for prototyping
Software Tools
- Vivadoยฎ Design Suite: Complete FPGA design environment
- Vitisโข Unified Software Platform: High-level synthesis and application development
- Development Boards: Hardware platforms for evaluation and development
- Simulation Models: Behavioral and timing models for design verification
Multimedia Resources
- Product Videos: Technical overviews and demonstration videos
- Webinars: Training sessions and technical deep-dives
- White Papers: Detailed technical analysis and application insights
- Case Studies: Real-world implementation examples and results
4. Related Resources
Development Ecosystem
- Vivadoยฎ Design Suite: Industry-leading FPGA design tools
- Vitisโข AI: Machine learning development framework
- PYNQ Framework: Python-based development for rapid prototyping
- Xilinx Runtime (XRT): Optimized runtime environment for deployed applications
Technical Support
- AMD Support Community: Online forums and technical discussions
- Technical Documentation Portal: Comprehensive resource library
- Training and Certification: Educational programs for developers
- Partner Network: Certified design service providers
Compatible Products
- Development Boards: ZCU104, ZCU106, and custom boards
- Memory Modules: HBM2 memory stacks and DDR4 interfaces
- Cooling Solutions: Thermal management systems for high-performance operation
- Power Supplies: Precision power delivery systems
Application Areas
- Data Center Acceleration: Server acceleration and cloud computing
- Machine Learning: AI inference and neural network processing
- High-Performance Computing: Scientific computing and simulation
- Video Processing: Broadcast, surveillance, and streaming applications
- Telecommunications: 5G infrastructure and network processing
- Automotive: ADAS and autonomous vehicle processing
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS directive for hazardous substances
- REACH Regulation: Compliant with EU chemical safety regulations
- Conflict Minerals: Responsible sourcing of materials
- Environmental Management: ISO 14001 certified manufacturing processes
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7.b
- USHTS (US Harmonized Tariff Schedule): 8542390001
- TARIC (EU Tariff Classification): 8542399000
- Country of Origin: Manufacturing location details available upon request
Regulatory Certifications
- CE Marking: European Conformity compliance
- FCC Compliance: US Federal Communications Commission approval
- Safety Standards: UL, CSA, and international safety certifications
- Quality Standards: ISO 9001 certified manufacturing processes
Shipping and Handling
- ESD Protection: Anti-static packaging for component protection
- Moisture Sensitivity: Proper moisture barrier packaging
- Temperature Control: Climate-controlled shipping when required
- Documentation: Certificate of Compliance and test reports included
Lifecycle Information
- Product Longevity: Long-term availability commitment
- End-of-Life Notification: Advanced notice of product lifecycle changes
- Obsolescence Management: Migration path planning and support
- Sustainability: Environmental impact reduction initiatives
Why Choose XCVU35P-1FSVH2892E?
The XCVU35P-1FSVH2892E represents the pinnacle of FPGA technology, combining ultra-high performance processing with integrated HBM memory technology. Its advanced 16nm process technology delivers exceptional performance per watt, while the comprehensive development ecosystem ensures rapid time-to-market for complex applications.
Whether you’re developing next-generation data center accelerators, implementing cutting-edge machine learning algorithms, or creating high-performance video processing solutions, the XCVU35P-1FSVH2892E provides the computational power and flexibility needed to excel in today’s demanding applications.
Contact authorized AMD distributors today to learn more about how the XCVU35P-1FSVH2892E can accelerate your next high-performance design project.
