Product Specification
The XCVU35P-1FSVH2104E features advanced 20nm technology that provides superior power efficiency and performance capabilities. This FPGA incorporates 1,728,000 system logic cells and 5,520 DSP slices, making it ideal for complex signal processing and computational tasks.
Key specifications of the XCVU35P-1FSVH2104E include:
- Logic Cells: 1,728,000 system logic cells
- Block RAM: 129.0 Mb total block RAM
- DSP Slices: 5,520 DSP48E2 slices
- Package Type: FSVH2104 (Flip-Chip Stacked Silicon Via BGA)
- Speed Grade: -1 (standard performance)
- I/O Pins: 832 user I/O pins
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Process Technology: 20nm TSMC process
The XCVU35P-1FSVH2104E supports multiple high-speed serial transceivers and advanced memory interfaces, enabling seamless integration with modern system architectures. Its sophisticated clocking architecture and low-power design make it suitable for battery-powered and thermally-constrained applications.
Price
Pricing for the XCVU35P-1FSVH2104E varies based on quantity, lead time, and supplier. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for large-scale deployments. The XCVU35P-1FSVH2104E represents excellent value considering its high-performance capabilities and comprehensive feature set.
For accurate pricing information on the XCVU35P-1FSVH2104E, consult with official distributors such as Digi-Key, Mouser Electronics, or Arrow Electronics, as prices fluctuate based on market conditions and inventory levels.
Documents & Media
Comprehensive documentation is available for the XCVU35P-1FSVH2104E to support design and development:
Technical Documentation:
- XCVU35P-1FSVH2104E Product Brief and Datasheet
- Virtex UltraScale+ FPGA User Guide
- Package and Pinout Specifications
- Power and Thermal Design Guidelines
- PCB Design Guidelines for FSVH2104 package
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- IP core documentation and examples
- Timing and power analysis tools
Support Materials:
- Package drawings and 3D models
- IBIS models for signal integrity analysis
- Thermal simulation models
- Design constraint files (XDC)
All documentation for the XCVU35P-1FSVH2104E is available through the official Xilinx documentation portal and authorized distributor websites.
Related Resources
The XCVU35P-1FSVH2104E ecosystem includes numerous complementary products and development tools:
Development Boards:
- Virtex UltraScale+ VCU128 Evaluation Kit
- Custom carrier boards supporting FSVH2104 package
- Third-party development platforms
Software Tools:
- Vivado Design Suite (synthesis, implementation, debugging)
- Vitis Unified Software Platform
- IP Integrator for system-level design
- ChipScope Pro for in-system debugging
Related FPGA Products:
- Other Virtex UltraScale+ family members
- Kintex UltraScale+ alternatives for cost-sensitive applications
- Zynq UltraScale+ MPSoCs for processor-centric designs
Technical Support:
- Xilinx Community Forums
- Application engineering support
- Training courses and certification programs
- Design services partnerships
Environmental & Export Classifications
The XCVU35P-1FSVH2104E complies with international environmental and export regulations:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH (Registration, Evaluation, Authorization of Chemicals) compliant
- Halogen-free package materials available
- Lead-free solder ball attachment (Pb-free)
Export Classification:
- Export Control Classification Number (ECCN) applies
- Subject to U.S. Export Administration Regulations (EAR)
- May require export licenses for certain destinations
- Consult current export control lists for specific requirements
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive-grade versions available (XCVU35P-1FSVH2104I)
- Military and aerospace screening options
- Extended temperature range variants
Package Information:
- MSL (Moisture Sensitivity Level) rating provided
- Peak solder temperature specifications
- Storage and handling guidelines
- Anti-static precautions required
The XCVU35P-1FSVH2104E meets stringent quality requirements and environmental standards, ensuring reliable operation in diverse applications while maintaining compliance with global regulations.
The XCVU35P-1FSVH2104E represents the pinnacle of FPGA technology, combining high performance, flexibility, and reliability for next-generation electronic systems. Contact authorized distributors for detailed specifications, pricing, and technical support.
