1. Product Specifications
Core Architecture
- Part Number: XCVU33P-3FSVH2104E
- Manufacturer: AMD (formerly Xilinx)
- FPGA Family: Virtex UltraScale+
- Speed Grade: -3 (Highest Performance)
- Process Technology: 20nm FinFET
Logic Resources
- Logic Elements/Cells: 961,800
- LABs/CLBs: 54,960
- Maximum Operating Frequency: 600 MHz
- DSP Slices: 24,746,394 total DSP capabilities
Memory and I/O
- Total I/O: 208 user I/O pins
- High-Speed Transceivers: Advanced SerDes capability
- On-chip Memory: Extensive Block RAM and UltraRAM resources
- Memory Interface: Support for DDR4, HBM2, and other high-speed memory standards
Package Details
- Package Type: 2104-BBGA (Ball Grid Array)
- Package Size: 47.5mm ร 47.5mm FCBGA
- Pin Count: 2104 pins
- Mounting Type: Surface Mount
Power and Electrical Characteristics
- Supply Voltage Range: 0.873V to 0.927V (VCCINT)
- Core Voltage: 0.85V nominal
- Power Options: Multiple power domains for optimized efficiency
- Low Power Features: Advanced power management capabilities
Operating Conditions
- Operating Temperature: 0ยฐC to 100ยฐC (TJ – Junction Temperature)
- Temperature Grade: Extended Commercial (E-grade)
- Storage Temperature: -65ยฐC to 150ยฐC
- Humidity: 10% to 85% non-condensing
2. Pricing Information
Current Market Pricing
Note: Pricing for the XCVU33P-3FSVH2104E varies based on quantity, supplier, and market conditions. Due to semiconductor supply constraints, current pricing requires direct inquiry with authorized distributors.
Purchasing Options
- Quantity Breaks: Available for volume purchases
- Lead Time: Contact authorized distributors for current availability
- Sample Availability: Engineering samples available through AMD Direct
- Distribution Channels: Available through major electronic component distributors including Digi-Key, Mouser, Arrow, and Avnet
Cost Considerations
- High-performance -3 speed grade commands premium pricing
- Long-term supply availability guaranteed (Active production status)
- Volume pricing available for production quantities
3. Documents & Media
Official Documentation
- Product Brief: Virtex UltraScale+ Family Overview
- Data Sheet: DS893 – Virtex UltraScale+ FPGAs Data Sheet
- Package Information: Package files and pinout documentation
- Migration Guide: UltraScale+ Migration and Compatibility Guide
Design Resources
- Reference Designs: Multiple application-specific reference designs
- IP Core Library: Extensive library of optimized IP cores
- Development Tools: Vivado Design Suite compatibility
- Application Notes: Signal integrity, power, and thermal management guides
Software Support
- Vivado Design Suite: Latest version compatibility
- SDK Support: Comprehensive software development kit
- Simulation Models: Behavioral and timing simulation models
- Evaluation Tools: Performance analysis and optimization tools
Media Resources
- Product Images: High-resolution package and die photos
- Block Diagrams: Architecture and connectivity diagrams
- Video Content: Technical presentations and demos
- Webinars: Design methodology and best practices
4. Related Resources
Development Platforms
- VCU118 Evaluation Kit: Comprehensive development platform for Virtex UltraScale+ FPGAs
- Accelerator Cards: U200, U250, and U280 data center acceleration cards
- Custom Boards: Third-party development boards and modules
Compatible Technologies
- High Bandwidth Memory (HBM): HBM2 memory interface support
- PCIe Connectivity: PCIe Gen3/Gen4 interface capabilities
- Networking Interfaces: 100GbE and beyond networking support
- DDR Memory: DDR4 and DDR5 memory controller IP
Software Ecosystem
- Operating System Support: Linux, VxWorks, and bare-metal support
- Programming Languages: C/C++, SystemC, OpenCL, and HDL support
- Libraries: Optimized math libraries and signal processing functions
- Framework Integration: TensorFlow, PyTorch, and other ML frameworks
Application Examples
- Data Center Acceleration: Machine learning inference and training
- High-Performance Computing: Scientific computing and simulation
- Networking Equipment: Routers, switches, and protocol processing
- Signal Processing: Radar, communications, and image processing
- Automotive: ADAS and autonomous driving applications
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS3 Compliant – Meets European Union RoHS directive requirements
- REACH Compliance: Compliant with EU REACH regulation
- Conflict Minerals: Compliant with conflict minerals regulations
- Lead-Free: Lead-free package and assembly process
Quality Standards
- ISO Certification: Manufactured in ISO 9001:2015 certified facilities
- Automotive Grade: Available in automotive-qualified versions (contact AMD)
- Military Grade: Defense-grade versions available (XQ series)
- Medical Grade: Suitable for medical device applications with proper qualification
Export Control Classifications
- ECCN Classification: Check current export control classification with AMD
- Country of Origin: Manufactured in AMD-qualified facilities
- Export Restrictions: Subject to applicable export control regulations
- Technology Transfer: Restricted technology – check compliance requirements
Lifecycle Status
- Production Status: Active in production – Full production and long-term support
- Lifecycle Stage: Growth phase with ongoing enhancements
- Support Timeline: Minimum 7-year production commitment
- Migration Path: Clear upgrade path to future architectures
Packaging and Handling
- ESD Protection: 100% ESD anti-static protection with high-performance packaging
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level 3)
- Storage Requirements: Controlled temperature and humidity environment
- Shipping Options: Multiple carrier options with proper handling protocols
Key Features & Benefits
Performance Advantages
- Highest Speed Grade: -3 speed grade offers maximum performance capability
- Advanced Architecture: UltraScale+ architecture with FinFET technology
- Massive Logic Capacity: Nearly 1 million logic elements for complex designs
- High I/O Count: 208 I/O pins for extensive connectivity requirements
Design Flexibility
- Reprogrammable Logic: Field-programmable for design iterations and updates
- Multiple Configuration: Support for various configuration methods
- Partial Reconfiguration: Dynamic reconfiguration capabilities
- Mixed-Signal Support: Analog and digital signal processing capabilities
Power Efficiency
- Advanced Power Management: Multiple power domains and clock gating
- Dynamic Power Scaling: Voltage and frequency scaling capabilities
- Low Static Power: Optimized for always-on applications
- Thermal Management: Advanced thermal monitoring and control
Target Applications
The XCVU33P-3FSVH2104E excels in applications requiring high-performance processing, including data center acceleration, machine learning inference, high-speed networking equipment, advanced driver assistance systems (ADAS), 5G infrastructure, medical imaging systems, and aerospace & defense applications.
Why Choose XCVU33P-3FSVH2104E?
This premium FPGA delivers unmatched performance for the most demanding applications. With its combination of massive logic resources, high-speed connectivity, and advanced power management, the XCVU33P-3FSVH2104E enables breakthrough designs in next-generation systems. The -3 speed grade ensures maximum performance capability, while the robust UltraScale+ architecture provides long-term scalability and reliability.
Contact your authorized AMD distributor today to discuss your XCVU33P-3FSVH2104E requirements and receive custom pricing for your application.
