1. Product Specifications
Core Specifications
- Part Number: XCVU33P-2FSVH2104E
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Virtex UltraScale+
- Logic Elements/Cells: 961,800 logic cells
- Total I/O Pins: 208 user I/O
- Package Type: 2104-FCBGA (Flip Chip Ball Grid Array)
- Speed Grade: -2 (balanced performance and power)
Technical Parameters
- Operating Voltage: 0.825V ~ 0.876V (VCCINT)
- Operating Temperature Range: 0ยฐC to 100ยฐC (Junction Temperature)
- Process Technology: 20nm FinFET+ process
- Maximum Frequency: 600MHz
- Mounting Type: Surface Mount
- RoHS Status: RoHS3 Compliant
Advanced Features
- High Bandwidth Memory (HBM) integration capability
- SSI Technology for enhanced system scalability
- UltraRAM for high-density memory requirements
- DSP Slices for intensive signal processing applications
- PCIe Gen4 and 100G Ethernet support
- Advanced Security Features including AES and RSA encryption
Architecture Highlights
The XCVU33P-2FSVH2104E incorporates AMD’s most advanced FPGA architecture, featuring:
- Configurable Logic Blocks (CLBs) for maximum flexibility
- Block RAM for efficient memory implementation
- Clock Management Tiles for precise timing control
- Transceivers for high-speed serial communication
- Hard IP blocks for accelerated processing
2. Price Information
Current Market Pricing
The XCVU33P-2FSVH2104E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities:
- Estimated Price Range: Contact authorized distributors for current pricing
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: Typically 25 weeks (subject to availability)
- Packaging: Standard tray packaging for production quantities
Cost-Effective Alternatives
For budget-conscious applications, consider these related models:
- XCVU33P-1FSVH2104E: Lower speed grade variant
- XCVU35P-2FSVH2104E: Higher I/O count option
Note: Prices vary by distributor and quantity. Contact authorized suppliers for current quotations and volume discounts.
3. Documents & Media
Official Documentation
- Datasheet: Complete technical specifications and electrical characteristics
- Product Brief: Overview of key features and applications
- Package Information: Mechanical drawings and pin-out details
- Migration Guide: Upgrade path from previous generations
Development Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Proven implementation examples
- Application Notes: Design guidelines and best practices
Support Materials
- User Guides: Comprehensive design and implementation guides
- Errata: Known issues and workarounds
- PCN Notifications: Product change notifications
- Quality Reports: Reliability and test data
4. Related Resources
Development Tools
- Vivado Design Suite: Complete FPGA design environment
- Vitis Unified Software Platform: Accelerated application development
- ChipScope Pro: Advanced debugging capabilities
- ModelSim: Simulation and verification tools
Evaluation Platforms
- VCU128 Evaluation Kit: Full-featured development platform
- Alveo Data Center Cards: Ready-to-deploy acceleration solutions
- Custom Evaluation Boards: Available from ecosystem partners
Software Ecosystem
- Xilinx Runtime (XRT): Optimized runtime environment
- PYNQ Framework: Python-based rapid prototyping
- Vitis Libraries: Optimized software libraries
- OpenCL Support: Industry-standard parallel computing
Application Areas
The XCVU33P-2FSVH2104E excels in:
- Data Center Acceleration
- 5G Wireless Infrastructure
- High-Performance Computing (HPC)
- Machine Learning Inference
- Video Processing and Transcoding
- Network Function Virtualization (NFV)
- Aerospace and Defense Systems
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant (Lead-free)
- REACH Compliance: Meets EU chemical regulations
- Conflict Minerals: Compliant with Dodd-Frank Act
- ISO 14001: Manufactured under certified environmental management
Export Control Classifications
- ECCN: 3A001.a.7.b (Export Administration Regulations)
- USHTS: 8542390001 (US Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU Trade Integrated Tariff)
- Country of Origin: Multiple (final assembly location varies)
Quality Standards
- Automotive Grade: AEC-Q100 qualified variants available
- Military Grade: Extended temperature and reliability options
- Commercial Grade: Standard operating conditions
- Industrial Grade: Enhanced temperature range (-40ยฐC to 100ยฐC)
Packaging and Handling
- MSL Rating: Moisture Sensitivity Level 3
- ESD Protection: Class 1B electrostatic discharge sensitive
- Storage Requirements: Controlled temperature and humidity
- Handling Procedures: Anti-static precautions required
Why Choose XCVU33P-2FSVH2104E?
The XCVU33P-2FSVH2104E represents the pinnacle of FPGA technology, combining massive logic capacity with advanced features for next-generation applications. Its balanced -2 speed grade offers optimal performance-per-watt efficiency, making it ideal for power-sensitive applications without compromising computational capability.
Key Benefits:
- Scalable Performance: Adapt to evolving requirements
- Power Efficiency: Optimized for reduced power consumption
- Security Features: Built-in encryption and authentication
- Proven Reliability: Extensive qualification and testing
- Ecosystem Support: Comprehensive development tools and resources
For technical support, pricing information, or application-specific guidance, contact authorized AMD/Xilinx distributors or field application engineers.
