1. Product Specifications
Core Architecture
- Part Number: XCVU31P-2FSVH1924E
- Manufacturer: AMD (formerly Xilinx Inc.)
- Product Family: Virtex® UltraScale+™
- Speed Grade: -2 (Industrial grade)
- Product Status: Active
Technical Specifications
- Logic Elements/Cells: 961,800 logic cells
- Number of LABs/CLBs: 54,960
- Total RAM Bits: 24,746,394
- System Logic Cells: 31.6 million
- Number of I/Os: 208 user I/Os
- Maximum User I/Os: 1,924
Physical Characteristics
- Package Type: 1924-FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 45mm × 45mm
- Pin Count: 1924 pins
- Mounting Type: Surface Mount Technology (SMT)
- Packaging: Tray
Electrical Specifications
- Supply Voltage (VCCINT): 0.825V ~ 0.876V
- Operating Temperature Range: 0°C ~ 100°C (TJ)
- Technology Node: 20nm FinFET+ process
- Power Consumption: Optimized for high-performance with efficient power management
Performance Features
- High-Speed Transceivers: Advanced SerDes technology
- Memory Interface: Support for multiple memory standards
- DSP Slices: High-performance digital signal processing capabilities
- Clock Management: Advanced clocking resources with low jitter
- Security Features: Secure boot and encrypted bitstreams support
2. Price Information
The XCVU31P-2FSVH1924E pricing varies based on quantity, supplier, and current market conditions. Based on current market data:
Market Pricing Overview
- Price Range: Contact authorized distributors for current pricing
- Lead Time: Typically 25 weeks from manufacturer
- Availability: Available through authorized distributors worldwide
- Stock Status: Multiple suppliers maintain inventory
Cost Considerations
- Prices fluctuate based on semiconductor market conditions
- Volume discounts available for bulk orders
- Extended warranty options may affect pricing
- Custom packaging options available at additional cost
Note: For accurate pricing and availability, please contact authorized distributors such as DigiKey, Global-IC, Ovaga Technologies, or other certified AMD/Xilinx partners.
3. Documents & Media
Official Documentation
- Datasheet: XCVU31P-2FSVH1924E.pdf (Available from AMD/Xilinx)
- Pin Configuration: 1924-pin FCBGA pinout diagram
- Package Drawing: Mechanical specifications and dimensions
- Thermal Characteristics: Junction temperature and thermal resistance data
Design Resources
- CAD Models: 3D models for PCB design tools
- IBIS Models: Signal integrity simulation models
- Reference Designs: Application-specific design examples
- Footprint Libraries: PCB footprint symbols for major EDA tools
Software Tools
- Vivado Design Suite: Primary development environment
- Vitis Unified Software Platform: For embedded and acceleration development
- IP Catalog: Pre-verified IP cores and interfaces
- Development Boards: Evaluation and development platforms
Application Notes
- High-speed PCB design guidelines
- Power supply design recommendations
- Thermal management best practices
- Signal integrity considerations
4. Related Resources
Development Ecosystem
- Vivado ML Edition: Advanced synthesis and implementation tools
- Vitis HLS: High-level synthesis for C/C++ development
- PetaLinux Tools: Embedded Linux development
- SDSoC Development Environment: System-level optimization tools
Compatible Products
- XCVU33P Series: Higher capacity variants
- XCVU35P Series: Extended I/O variants
- XCVU37P Series: Maximum performance options
- Development Boards: ZCU102, ZCU104, ZCU106 evaluation platforms
Technical Support
- AMD Developer Zone: Online resources and community forums
- Documentation Portal: Complete technical library
- Training Resources: Online courses and certification programs
- Partner Network: Certified solution providers and consultants
Application Areas
- Data Center Acceleration: Machine learning inference and training
- 5G Infrastructure: Wireless base stations and network equipment
- Video Processing: Real-time video encoding/decoding and streaming
- Automotive: ADAS and autonomous driving systems
- Aerospace & Defense: Radar, communications, and signal processing
- Industrial Automation: Real-time control and monitoring systems
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant (Lead-free)
- REACH Compliance: Fully compliant with EU REACH regulations
- Environmental Grade: Industrial temperature range (0°C to 100°C TJ)
- Moisture Sensitivity Level (MSL): Level 3
- Package Material: Halogen-free, environmentally friendly materials
Export Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- Country of Origin: Manufactured in Asia-Pacific region
- HS Code: 8542.31.0001 (Electronic integrated circuits)
- Export Restrictions: May require export license for certain destinations
Quality Standards
- Quality Grade: Industrial grade (-2 speed grade)
- Reliability Standards: Meets automotive and industrial quality requirements
- Testing Standards: Compliant with JEDEC standards
- Traceability: Full supply chain traceability available
Handling Requirements
- ESD Sensitivity: Class 1 (ESD sensitive device)
- Storage Conditions: Dry storage required, controlled humidity
- Handling Precautions: Antistatic handling procedures required
- Shelf Life: Unlimited when stored properly
Key Benefits of XCVU31P-2FSVH1924E
The XCVU31P-2FSVH1924E stands out as a premium FPGA solution offering:
- Exceptional Performance: Nearly 1 million logic cells for complex algorithms
- Advanced Architecture: 20nm FinFET+ technology for optimal power efficiency
- Extensive I/O Capability: 208 user I/Os with 1,924 total pins for maximum connectivity
- Industrial Reliability: Qualified for demanding industrial applications
- Comprehensive Ecosystem: Full development tool suite and extensive IP library
- Future-Proof Design: Support for emerging standards and protocols
For technical specifications, pricing inquiries, or application support, contact your local AMD/Xilinx authorized distributor or visit the official AMD developer resources portal.
