The XCVU190-H1FLGC2104E is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s prestigious Virtex UltraScale family, engineered to deliver exceptional performance and integration capabilities for demanding applications. This cutting-edge device combines the proven UltraScale architecture with advanced 20nm technology to provide unprecedented power savings, processing capability, and I/O bandwidth.
1. Product Specifications
Core Performance
- FPGA Family: Virtex UltraScale Series
- Logic Blocks: 1,074,240 Logic Cells
- System Logic Cells: 2,349,900
- Process Technology: 20nm TSMC
- Package Type: FCBGA-2104 (Flip Chip Ball Grid Array)
- Total Pins: 2,104 pins
- Speed Grade: H1 (High-performance grade)
Memory & Storage
- Total RAM: 136,090 Kbit block RAM
- Block RAM: High-density on-chip memory for data buffering and storage
- UltraRAM: Advanced memory architecture for cost-effective system implementation
I/O & Connectivity
- User I/O: 416 configurable I/O pins
- High-Speed Transceivers: Advanced GTY and GTH transceivers
- Maximum Data Rate: Up to 16.375 Gbps (speed grade dependent)
- Serial I/O Bandwidth: Industry-leading performance for high-speed interfaces
Power & Operating Conditions
- Core Supply Voltage: 922mV to 979mV
- I/O Supply Voltage: 3.3V
- Maximum Operating Frequency: 725 MHz
- Clock Management: MMCM (Mixed-Mode Clock Manager) and PLL support
- Power Efficiency: Up to 40% lower power consumption vs. previous generation
Architecture Features
- Stacked Silicon Interconnect (SSI): Next-generation 3D IC technology
- Fine Granular Clock Gating: ASIC-like power management
- Enhanced System Logic Packing: Optimized for reduced dynamic power
- DSP Slices: High-performance digital signal processing capabilities
2. Price Information
The XCVU190-H1FLGC2104E pricing varies based on quantity, distributor, and current market conditions. For the most competitive pricing:
- Quote Request: Contact authorized distributors for current pricing
- Volume Discounts: Available for bulk orders and OEM customers
- Market Intelligence: Real-time pricing tracking available through electronic component distributors
- Historical Price Data: Price trend analysis available for purchasing decisions
Note: Due to the specialized nature and high performance of this device, pricing is typically provided upon request. Contact authorized AMD Xilinx distributors such as Digi-Key, Newark, Mouser, or specialized FPGA suppliers for current availability and pricing.
3. Documents & Media
Technical Documentation
- Official Datasheet: Virtex UltraScale FPGAs Data Sheet (DS893)
- DC and AC Switching Characteristics: Comprehensive electrical specifications
- Product Selection Guide: UltraScale FPGA family comparison and selection criteria
- Packaging Information: Detailed mechanical drawings and specifications
- Pinout Documentation: Complete pin assignment and signal descriptions
Design Resources
- Vivado Design Suite: AMD’s integrated design environment for synthesis, implementation, and debugging
- IP Catalog: Extensive library of pre-verified IP cores
- Reference Designs: Application-specific design examples and templates
- Application Notes: Best practices and implementation guidelines
Development Tools
- Software Downloads: Latest Vivado Design Suite versions
- Device Support: Comprehensive device libraries and models
- Simulation Models: Behavioral and timing models for system verification
4. Related Resources
Development Platforms
- VCU110 Development Kit: Virtex UltraScale FPGA evaluation platform
- proFPGA Modules: Third-party prototyping solutions featuring XCVU190
- Custom Development Boards: Available from various ecosystem partners
Compatible Products
- Memory Interfaces: DDR4, DDR3, QDR, RLDRAM support
- High-Speed Interfaces: PCIe Gen4/Gen3, USB 3.0, Ethernet 400G
- Development Boards: ZedBoard, Basys 3, Nexys4-DDR, Terasic DE10-Nano
Technical Support
- AMD Xilinx Forums: Community-driven technical discussions
- Application Engineers: Direct technical support for complex implementations
- Training Resources: Comprehensive learning materials and certification programs
- Partner Network: Certified design services and consulting partners
Software Ecosystem
- Vivado HLS: High-Level Synthesis for C/C++ to RTL conversion
- SDSoC: Software-defined development environment
- Vitis: Unified software platform for edge AI and data center acceleration
- LabVIEW FPGA: Graphical development environment integration
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical safety regulations
- Lead-Free: Uses lead-free soldering and assembly processes
- Halogen-Free: Environmentally friendly packaging materials
Operating Environment
- Operating Temperature Range: Commercial and industrial temperature grades available
- Storage Temperature: Extended range for various storage conditions
- Humidity Tolerance: Designed for diverse environmental conditions
- Shock and Vibration: Suitable for demanding industrial applications
Export Classification
- ECCN: Export Control Classification Number assigned per US regulations
- Country of Origin: Manufacturing location for trade compliance
- Export Licensing: May require export licenses for certain destinations
- Trade Compliance: Meets international trade and security requirements
Quality Standards
- ISO 9001: Quality management system certification
- Automotive Grade: Available variants meeting automotive quality standards
- Reliability Testing: Comprehensive qualification and reliability programs
- Lifecycle Support: Long-term availability and obsolescence management
Packaging & Handling
- Moisture Sensitivity Level (MSL): Specified for proper storage and handling
- ESD Protection: Electrostatic discharge protection requirements
- Tape and Reel: Available in production-ready packaging
- Tray Packaging: Alternative packaging options for development and prototyping
The XCVU190-H1FLGC2104E represents the pinnacle of FPGA technology, offering unmatched performance and flexibility for next-generation system designs. Whether you’re developing advanced networking equipment, high-performance computing systems, or complex signal processing applications, this device provides the computational power and I/O capabilities needed to bring your innovations to market.
