The XCVU190-3FLGA2577E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex UltraScale family. This powerful FPGA delivers exceptional performance for demanding applications requiring high-speed processing, programmable acceleration, and advanced I/O capabilities.
Product Specifications
Core Architecture
- Part Number: XCVU190-3FLGA2577E
- FPGA Family: Virtex UltraScale Series
- Technology Node: 20nm technology
- Logic Cells: 1,879,920 cells
- System Logic Cells: 2,349,900 macrocells
- Logic Blocks: 1,074,240 logic blocks
Package and Pinout
- Package Type: 2577-Pin FCBGA (Flip Chip Ball Grid Array)
- Package Code: FLGA2577E
- Total I/O Pins: 448 I/O
- Speed Grade: -3 (High Performance)
Memory and Processing
- Total RAM: 136,090 Kbit
- Clock Management: MMCM (Mixed-Mode Clock Manager), PLL
- Maximum Operating Frequency: 725 MHz
Power Specifications
- Core Supply Voltage: 0.95V
- I/O Supply Voltage: 3.3V
- Power Efficiency: Unprecedented power savings with advanced UltraScale architecture
Key Features
- High-Speed Transceivers: Advanced GTY and GTH transceivers for high-speed serial interfaces
- DSP Performance: Optimized DSP slices for signal processing applications
- Stacked Silicon Interconnect (SSI): Next-generation SSI technology for enhanced performance
- RoHS Compliance: Yes – environmentally compliant
Price
The XCVU190-3FLGA2577E pricing varies based on quantity, supplier, and market conditions. For current pricing information:
- Request Quote: Contact authorized distributors for volume pricing
- Price Monitoring: Real-time price tracking available through electronic component suppliers
- Historical Pricing: Available for purchasing decision analysis
- Volume Discounts: Available for bulk orders from authorized distributors
Note: Pricing is subject to change based on market conditions and availability. Contact suppliers directly for the most current pricing information.
Documents & Media
Technical Documentation
- Official Datasheet: XCVU190-3FLGA2577E PDF datasheet available from AMD Xilinx
- Package Pinout Files: ASCII package files in TXT and CSV format (described in UG575)
- Reference Manual: Virtex UltraScale FPGA family reference documentation
- Application Notes: Design implementation guides and best practices
Development Resources
- Vivado Design Suite: Primary development environment for synthesis and implementation
- IP Catalog: Extensive library of pre-verified IP cores
- Development Boards: Compatible evaluation and development platforms
- Reference Designs: Sample projects and design examples
Support Materials
- Pinout Information: Detailed pin assignment and connectivity data
- Programming Tools: Configuration and debugging utilities
- Technical Support: Access to AMD Xilinx technical documentation portal
Related Resources
Development Ecosystem
- Compatible Development Boards:
- ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR
- Terasic DE10-Nano, Digilent Arty S7
- proFPGA UltraScale modules for advanced prototyping
Related FPGA Variants
- XCVU190-2FLGC2104E: 2104-pin package variant with different I/O configuration
- XCVU190-H1FLGA2577E: High-temperature grade option
- XCVU190-3FLGB2104E: Alternative package option with 2104 pins
Applications
- High-Performance Computing: Accelerated computing and data processing
- Signal Processing: Advanced DSP applications and communications
- Aerospace & Defense: Mission-critical systems requiring high reliability
- Data Center Acceleration: Heterogeneous processing applications
- 5G Infrastructure: High-speed wireless communication systems
- Machine Learning: AI acceleration and inference engines
Technical Support
- Community Forums: FPGA technical forums for design assistance
- Training Resources: Design methodology and tool usage training
- Application Engineering: Direct support from AMD Xilinx field engineers
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes – complies with Restriction of Hazardous Substances directive
- Lead-Free: Package meets lead-free manufacturing standards
- Environmental Rating: Industrial temperature grade operation
- Packaging: Anti-static packaging for component protection
Operating Conditions
- Operating Temperature Range: Commercial/Industrial grade specifications
- Storage Temperature: Extended temperature range for storage
- Humidity Tolerance: Designed for varied environmental conditions
- Thermal Management: Advanced thermal design for reliable operation
Export and Trade Classifications
- Country of Origin: Manufactured under AMD Xilinx quality standards
- Export Control: Subject to U.S. export administration regulations
- Trade Compliance: Meets international trade and customs requirements
- Documentation: Certificate of compliance available upon request
Quality Standards
- Manufacturing Quality: ISO-certified manufacturing processes
- Reliability Testing: Extensive qualification and stress testing
- Traceability: Full component traceability and lot tracking
- Warranty: Standard manufacturer warranty coverage
Keywords: XCVU190-3FLGA2577E, Virtex UltraScale FPGA, AMD Xilinx, 2577-pin FCBGA, high-performance FPGA, programmable logic, field programmable gate array, embedded systems, signal processing, 20nm technology, UltraScale architecture
