The XCVU190-2FLGB2104E is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.
Product Specification
The XCVU190-2FLGB2104E features advanced 20nm process technology, providing optimal balance between performance, power efficiency, and cost-effectiveness. This FPGA incorporates 1,143,000 logic cells with 5,720 CLBs (Configurable Logic Blocks), making it suitable for complex digital signal processing and system-on-chip implementations.
Key Technical Specifications:
- Logic Cells: 1,143,000
- CLBs: 5,720
- Block RAM: 75.9 Mb
- UltraRAM: 360 Mb
- DSP Slices: 4,560
- Package: FLGB2104 (2104-pin flip-chip BGA)
- Speed Grade: -2 (standard performance)
- Operating Temperature: Commercial (0ยฐC to +85ยฐC)
The XCVU190-2FLGB2104E supports high-speed transceivers with data rates up to 32.75 Gbps, enabling seamless integration with modern communication protocols and high-bandwidth applications.
Price
The XCVU190-2FLGB2104E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and performance characteristics. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Pricing typically varies based on order quantity, delivery timeline, and regional market conditions.
For budget planning purposes, consider factors such as development tools licensing, evaluation boards, and supporting components when calculating total project costs for the XCVU190-2FLGB2104E implementation.
Documents & Media
Essential Documentation:
- Product Brief and Datasheet
- Packaging and Pinout Specifications
- AC/DC Switching Characteristics
- Configuration User Guide
- PCB Design Guidelines
- Thermal Management Guidelines
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Hardware evaluation boards documentation
- Programming and debugging guides
Video Resources:
- Product overview presentations
- Technical webinars and training materials
- Implementation case studies
- Performance benchmarking demonstrations
Related Resources
Compatible Development Tools:
- Vivado Design Suite (latest version recommended)
- Vitis Unified Software Platform
- Hardware evaluation boards for rapid prototyping
- IP cores and reference designs
Supporting Components:
- Compatible power management solutions
- Clock generation and distribution devices
- High-speed connector systems
- Thermal management solutions
Application Areas:
- 5G wireless infrastructure
- Machine learning acceleration
- Video processing and broadcasting
- Aerospace and defense systems
- Test and measurement equipment
Environmental & Export Classifications
Environmental Compliance: The XCVU190-2FLGB2104E meets stringent environmental standards including RoHS compliance for lead-free manufacturing processes. The device operates within commercial temperature ranges (0ยฐC to +85ยฐC) and maintains reliability across specified voltage and environmental conditions.
Export Classifications:
- ECCN (Export Control Classification Number): Check current regulations
- HTS (Harmonized Tariff Schedule): Verify with customs authorities
- Country of Origin: Manufactured according to international standards
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive-grade reliability testing available
- Extended temperature variants for specialized applications
The XCVU190-2FLGB2104E represents Xilinx’s commitment to delivering high-performance FPGA solutions for next-generation applications requiring exceptional processing capabilities and flexibility.
For technical support, pricing inquiries, and detailed specifications regarding the XCVU190-2FLGB2104E, contact your local Xilinx representative or authorized distributor.
