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XCVU190-1FLGC2104I – AMD Xilinx Virtex UltraScale FPGA

Original price was: $20.00.Current price is: $19.00.

Product Overview

The XCVU190-1FLGC2104I is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s acclaimed Virtex UltraScale family. This advanced FPGA delivers exceptional processing power, programmable acceleration, and superior I/O capabilities for demanding applications requiring heterogeneous processing solutions. Built on cutting-edge 20nm technology, the XCVU190-1FLGC2104I provides unprecedented power efficiency and performance optimization for next-generation electronic systems.

1. Product Specifications

Core Architecture

  • FPGA Family: Virtex UltraScale Series
  • Process Technology: 20nm
  • Speed Grade: -1 (Commercial)
  • Device Density: XCVU190 class

Logic Resources

  • Logic Cells: Up to 2,349,900 cells
  • Logic Blocks: 1,074,240
  • System Logic Cells: Approximately 1,879,920
  • CLB Slices: High-density configuration

Memory & Storage

  • Total RAM: 136,090 Kbit
  • Block RAM: Distributed throughout device
  • UltraRAM: Advanced on-chip memory technology
  • Configuration Memory: Non-volatile storage support

I/O & Connectivity

  • Total I/O Pins: 416 I/O
  • Package Type: 2104-Pin FCBGA (Flip Chip Ball Grid Array)
  • Package Code: FLGC2104
  • Pin Count: 2104 pins total

Clock Management

  • Clock Resources: MMCM (Mixed-Mode Clock Manager)
  • PLL Support: Integrated Phase-Locked Loops
  • Maximum Operating Frequency: Up to 725 MHz
  • Clock Distribution: Advanced clocking architecture

Power Specifications

  • Core Supply Voltage: 922 mV to 979 mV (typical)
  • I/O Supply Voltage: 3.3V compatible
  • Power Optimization: UltraScale power-efficient design
  • Temperature Grade: Industrial (-40ยฐC to +100ยฐC)

Advanced Features

  • DSP Slices: High-performance digital signal processing
  • Transceivers: High-speed serial connectivity
  • SSI Technology: Stacked Silicon Interconnect support
  • Configuration: Multiple configuration modes

2. Pricing Information

Current Market Pricing

  • Unit Price Range: Contact authorized distributors for current pricing
  • Volume Discounts: Available for bulk orders (typically 100+ units)
  • Lead Time: Standard 12-16 weeks from authorized distributors
  • Availability: Contact suppliers for real-time stock status

Authorized Distributors

  • Digi-Key Electronics: Primary North American distributor
  • Mouser Electronics: Global electronics distributor
  • Newark/Farnell: European and global distribution
  • FPGAkey: Specialized FPGA component supplier

Pricing Factors

  • Market demand and availability
  • Order quantity and volume commitments
  • Lead time requirements
  • Geographic region
  • Distributor relationship and terms

Note: Prices subject to change. Contact authorized distributors for current quotations and availability.

3. Documents & Media

Technical Documentation

  • Official Datasheet: Comprehensive specifications and electrical characteristics
  • User Guide: Detailed implementation and design guidelines
  • Package Drawing: Mechanical specifications and pin assignments
  • Pinout Documentation: Complete pin mapping and signal descriptions

Design Resources

  • Reference Designs: Pre-built application examples
  • IP Cores: Xilinx intellectual property library access
  • Constraint Files: Timing and placement constraints
  • Board Layout Guidelines: PCB design recommendations

Software Tools

  • Vivado Design Suite: Primary development environment
  • IP Integrator: Graphical IP integration tool
  • Hardware Manager: Programming and debugging interface
  • SDK Integration: Software development kit compatibility

Application Notes

  • Power Management: Optimization techniques and guidelines
  • High-Speed Design: Signal integrity best practices
  • Thermal Management: Heat dissipation strategies
  • Configuration Methods: Various programming approaches

4. Related Resources

Development Platforms

  • Evaluation Boards: Contact distributors for compatible development boards
  • Starter Kits: Entry-level development platforms
  • Reference Designs: Industry-specific application examples
  • Third-Party Boards: Compatible development platforms from partners

Software Ecosystem

  • Vivado Design Suite: Complete design flow from synthesis to bitstream
  • Vitis Unified Platform: Software development environment
  • PetaLinux: Linux development tools for embedded applications
  • Third-Party Tools: Compatible EDA tool integration

Technical Support

  • Xilinx Forums: Community-driven technical discussions
  • Application Engineers: Direct technical support access
  • Documentation Portal: Comprehensive resource library
  • Training Resources: Online and instructor-led courses

Design Services

  • Xilinx Partner Network: Certified design service providers
  • Consulting Services: Professional design assistance
  • IP Licensing: Additional intellectual property cores
  • Custom Solutions: Tailored implementation services

5. Environmental & Export Classifications

RoHS Compliance

  • RoHS Status: Compliant with EU RoHS Directive 2011/65/EU
  • Hazardous Substances: Below threshold limits for restricted materials
    • Lead (Pb): <1000 ppm
    • Mercury (Hg): <1000 ppm
    • Cadmium (Cd): <100 ppm
    • Hexavalent Chromium (Cr6+): <1000 ppm
    • PBB/PBDE: <1000 ppm
    • Phthalates (DEHP, BBP, DBP, DIBP): <1000 ppm

Environmental Standards

  • REACH Compliance: Conforms to EU REACH regulation
  • WEEE Directive: Compatible with waste electrical equipment regulations
  • ISO 14001: Manufactured under environmental management standards
  • Green Certification: Environmentally conscious manufacturing

Export Control Classifications

  • ECCN: Export Control Classification Number (contact manufacturer)
  • HTS Code: Harmonized Tariff Schedule classification
  • Country of Origin: Manufactured in accordance with applicable regulations
  • Export License: May require export licensing for certain destinations

Quality Standards

  • ISO 9001: Quality management system compliance
  • IATF 16949: Automotive quality standards (where applicable)
  • IPC Standards: Electronic assembly standards compliance
  • Conflict Minerals: Compliant with conflict minerals regulations

Certifications

  • CE Marking: European Conformity marking
  • FCC Compliance: US Federal Communications Commission standards
  • IC Certification: Industry Canada certification
  • Safety Standards: UL/CSA safety compliance where applicable

Keywords: XCVU190-1FLGC2104I, Xilinx FPGA, Virtex UltraScale, programmable logic, high-performance computing, 20nm FPGA, industrial electronics, embedded systems, digital signal processing

Note: Specifications subject to change. Consult official AMD Xilinx documentation for the most current information. Contact authorized distributors for pricing, availability, and technical support.