The XCVU160-H1FLGC2104E is a cutting-edge field-programmable gate array (FPGA) from AMD Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data centers, aerospace, defense, and high-performance computing environments.
Product Specifications
Core Architecture
The XCVU160-H1FLGC2104E features advanced 20nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates:
- Logic Cells: 1,660,900 system logic cells
- CLB Flip-Flops: 3,321,600 flip-flops for high-speed data processing
- Block RAM: 75.9 Mb of block RAM for efficient data storage
- UltraRAM: 360 Mb of UltraRAM for large memory requirements
- DSP Slices: 4,272 DSP48E2 slices for signal processing applications
Package and Pin Configuration
The XCVU160-H1FLGC2104E comes in a robust FLGC2104 package with the following characteristics:
- Package Type: FLGC2104 (Flip-Chip Land Grid Array)
- Pin Count: 2,104 pins
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Speed Grade: -1 speed grade for balanced performance and power consumption
Performance Features
- High-Speed Transceivers: Up to 32 GTY transceivers supporting data rates up to 32.75 Gbps
- PCI Express: Native PCIe Gen4 support for high-bandwidth connectivity
- Memory Interfaces: Support for DDR4-3200, LPDDR4, and HBM2 memory interfaces
- Power Consumption: Optimized power management with dynamic voltage scaling
Price Information
The XCVU160-H1FLGC2104E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities. Contact authorized distributors for current pricing, volume discounts, and availability. Pricing typically varies based on:
- Order quantity and volume commitments
- Regional availability and distribution channels
- Support package requirements
- Lead time considerations
For the most competitive pricing on the XCVU160-H1FLGC2104E, we recommend requesting quotes from multiple authorized distributors and considering long-term supply agreements for high-volume applications.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications for the XCVU160-H1FLGC2104E
- User Guide: Comprehensive implementation guide with design considerations
- Package Information: Detailed pinout diagrams and package dimensions
- Thermal Management Guide: Cooling requirements and thermal design guidelines
Development Resources
- Vivado Design Suite: Full development environment support for the XCVU160-H1FLGC2104E
- IP Catalog: Extensive library of pre-verified IP cores
- Reference Designs: Example implementations and best practices
- Application Notes: Specific use case implementations and optimization techniques
Quality Documentation
- Quality and Reliability Report: Comprehensive testing data and reliability metrics
- Automotive Documentation: AEC-Q100 qualification reports where applicable
- RoHS Compliance: Environmental compliance certificates
Related Resources
Development Tools
The XCVU160-H1FLGC2104E is fully supported by AMD Xilinx’s comprehensive development ecosystem:
- Vivado ML Edition: Advanced synthesis and implementation tools
- Vitis Unified Software Platform: High-level synthesis and application acceleration
- Hardware Debug Tools: ChipScope Pro and integrated logic analyzers
- Simulation Tools: ModelSim and Questa simulation environments
Evaluation Boards
- VCU160 Evaluation Board: Purpose-built evaluation platform for the XCVU160-H1FLGC2104E
- Custom Carrier Cards: Third-party evaluation and development boards
- FMC Modules: FPGA Mezzanine Card ecosystem for rapid prototyping
Support Services
- Technical Support: Dedicated engineering support for XCVU160-H1FLGC2104E implementations
- Training Programs: Comprehensive training on Virtex UltraScale+ architecture
- Design Services: Professional consulting and design services
- Online Resources: Forums, knowledge base, and community support
Environmental & Export Classifications
Environmental Compliance
The XCVU160-H1FLGC2104E meets stringent environmental standards:
- RoHS Compliant: Restriction of Hazardous Substances directive compliance
- REACH Compliance: Registration, Evaluation, Authorization of Chemicals regulation
- Conflict Minerals: Fully compliant with conflict minerals regulations
- Green Product: Designed for environmental sustainability
Export Control Classifications
- ECCN: Export Control Classification Number as per US Export Administration Regulations
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufacturing location and origin documentation
- Export Licensing: Specific licensing requirements for restricted countries
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management system compliance
- TS 16949: Automotive quality management system (where applicable)
- AS9100: Aerospace quality management system certification
Operating Conditions
- Temperature Range: Commercial grade operation from 0ยฐC to +85ยฐC
- Humidity: 5% to 95% non-condensing relative humidity
- Altitude: Operation up to 2,000 meters above sea level
- Vibration: MIL-STD-883 vibration resistance standards
The XCVU160-H1FLGC2104E represents the pinnacle of FPGA technology, combining exceptional performance, advanced features, and comprehensive development support. Whether you’re developing next-generation data center acceleration, aerospace systems, or high-performance computing solutions, this FPGA provides the flexibility and performance needed for the most demanding applications.
For technical support, pricing information, or to discuss your specific application requirements for the XCVU160-H1FLGC2104E, contact your local AMD Xilinx representative or authorized distributor.
