Product Overview
The XCVU160-H1FLGB2104E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale family, designed to deliver exceptional processing power and flexibility for demanding applications. This advanced FPGA combines cutting-edge 20nm technology with innovative architectural features to provide unprecedented performance in data processing, signal processing, and high-speed connectivity applications.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale Series
- Manufacturing Process: 20nm technology node
- Logic Cells: 1,621,200 system logic cells
- Logic Blocks: 926,400 configurable logic blocks (CLBs)
- Package: FCBGA-2104 (Flip-Chip Ball Grid Array)
- Pin Count: 2,104 pins
- Speed Grade: -H1 (High-performance grade)
Memory Resources
- Total Block RAM: 13,005 Kbit of distributed memory
- UltraRAM: Advanced on-chip memory blocks for enhanced performance
- Memory Controllers: Integrated DDR4 support up to 2,666 Mb/s
I/O and Connectivity
- User I/O Pins: 416 configurable I/O pins
- High-Speed Transceivers: GTH and GTY transceivers supporting up to 30.5 Gbps
- PCIe Support: Integrated PCIe Gen3 x16 blocks
- Ethernet: 100G Ethernet MAC cores with FEC support
- Interlaken: 150G Interlaken interface support
DSP and Processing
- DSP Slices: Optimized for both fixed-point and floating-point operations
- AI/ML Support: INT8 optimization for AI inference applications
- Processing Power: Up to 38 TOPs (22 TeraMACs) of DSP compute performance
Power and Thermal
- Supply Voltage: 0.95V core voltage
- Operating Temperature Range: Commercial grade (0ยฐC to 85ยฐC)
- Junction Temperature: Up to 125ยฐC maximum
- Power Optimization: Advanced power management features for optimal efficiency
2. Pricing Information
The XCVU160-H1FLGB2104E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and high-performance specifications. Pricing varies based on:
- Volume Requirements: Bulk pricing available for large quantities
- Distribution Channel: Authorized distributors offer competitive pricing
- Regional Availability: Pricing may vary by geographic region
- Market Conditions: Subject to semiconductor market fluctuations
For current pricing information and volume discounts, customers should contact authorized AMD/Xilinx distributors or submit quote requests through official channels. The device is typically available in minimum quantities of 1 unit with bulk packaging options for production volumes.
3. Documents & Media
Technical Documentation
- Product Brief: Comprehensive overview of XCVU160-H1FLGB2104E features and specifications
- Datasheet: Detailed electrical and mechanical specifications
- Package Files: Pinout information in TXT and CSV formats (reference UG575)
- User Guides: Application-specific implementation guides
- Reference Manuals: Comprehensive technical reference documentation
Design Tools and Software
- Vivado Design Suite: Primary development environment for XCVU160-H1FLGB2104E
- IP Catalog: Extensive library of pre-verified IP cores
- Development Kits: Evaluation boards and starter kits available
- Application Notes: Best practices and design guidelines
Multimedia Resources
- Product Videos: Technical demonstrations and feature overviews
- Webinars: Training sessions and application-specific presentations
- Case Studies: Real-world implementation examples
4. Related Resources
Development Ecosystem
- proFPGA Modules: Third-party FPGA prototyping solutions featuring XCVU160
- Evaluation Boards: Various development platforms supporting the XCVU160-H1FLGB2104E
- Reference Designs: Pre-built solutions for common applications
Compatible Technologies
- DDR4 Memory: High-speed memory interface support
- PCIe: Native PCIe Gen3 connectivity
- Ethernet: 100G/150G networking capabilities
- High-Speed Serial: Advanced transceiver technology
Application Areas
- Data Center Acceleration: Compute-intensive workloads and AI/ML inference
- 5G Infrastructure: Baseband processing and network acceleration
- Networking: 1+ Tbps line card implementations
- Radar Systems: Signal processing for defense and aerospace
- Test Equipment: High-performance signal generators and analyzers
Support Services
- Technical Support: Access to AMD/Xilinx technical experts
- Training Programs: Comprehensive FPGA design courses
- Community Forums: Peer-to-peer technical discussions
- Documentation Portal: Centralized access to all technical resources
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Yes – Restriction of Hazardous Substances compliant
- REACH Compliance: Meets European chemical regulation requirements
- Lead-Free: Compatible with lead-free soldering processes
- Halogen-Free: Available in halogen-free package options
Operating Environment
- Commercial Temperature: 0ยฐC to +85ยฐC ambient operating range
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing relative humidity
- Altitude: Up to 2,000 meters above sea level
Export and Trade Compliance
- Export Classification: Subject to U.S. Export Administration Regulations (EAR)
- ECCN: Export Control Classification Number as defined by BIS
- Country Restrictions: May be subject to export restrictions to certain countries
- End-Use Restrictions: Military and dual-use applications may require special licensing
Quality and Reliability
- Automotive Grade: AEC-Q100 qualified versions available for automotive applications
- Industrial Grade: Extended temperature range options for harsh environments
- Reliability Standards: Meets industry-standard reliability requirements
- Quality Certifications: ISO 9001 manufacturing quality standards
Packaging and Handling
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- ESD Protection: Electrostatic discharge protection requirements
- Handling Precautions: Special handling requirements for high-pin-count packages
- Storage Requirements: Proper storage conditions to maintain device integrity
The XCVU160-H1FLGB2104E represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive connectivity and processing capabilities. Its advanced architecture makes it ideal for next-generation applications requiring high-speed data processing, AI acceleration, and complex signal processing in demanding environments.
