Product Overview
The XCVU160-3FLGC2104E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Xilinx Virtex UltraScale family, designed for high-performance computing applications requiring exceptional processing power and flexibility. This advanced FPGA delivers outstanding performance for data center acceleration, high-performance computing, and communications infrastructure applications.
1. Product Specifications
Core Technical Specifications
- Part Number: XCVU160-3FLGC2104E
- Family: Virtex UltraScale FPGA
- Manufacturer: AMD (formerly Xilinx)
- Logic Cells: 1,621,200 cells
- Technology Node: 20nm FinFET technology
- Speed Grade: -3 (High Performance)
- Package Type: FCBGA (Flip Chip Ball Grid Array)
- Pin Count: 2104 pins
- Package Size: FLGC2104
- Operating Voltage: 0.95V core voltage
- I/O Count: 416 user I/O pins
Performance Features
- DSP Slices: High-density DSP blocks for signal processing
- Block RAM: Extensive on-chip memory resources
- UltraRAM: Advanced memory architecture for reduced BOM cost
- Transceivers: Next-generation high-speed serial connectivity
- Power Efficiency: Advanced power management with UltraScale architecture
- Processing Bandwidth: Exceptional signal processing capabilities
Architecture Highlights
- Stacked Silicon Interconnect (SSI) Technology: Enables larger device capacity
- 20nm Process Technology: Delivers optimal power-performance balance
- Programmable Logic: Flexible reconfiguration for diverse applications
- High-Speed Interfaces: Support for latest connectivity standards
- Advanced Clock Management: Precision timing control and distribution
2. Price Information
The XCVU160-3FLGC2104E pricing varies based on quantity, lead time, and distributor. Current market pricing for the XCVU160 series typically ranges from $25,000 to $35,000+ per unit for single quantities, with volume discounts available for larger orders.
Pricing Factors
- Quantity Breaks: Significant discounts for volume purchases
- Lead Time: Standard vs. expedited delivery options
- Packaging: Tray or tape & reel packaging
- Distributor Selection: Authorized vs. independent distributors
- Market Conditions: Supply and demand fluctuations
Note: For current pricing and availability, contact authorized AMD distributors or request quotes from electronic component suppliers.
3. Documents & Media
Technical Documentation
- Product Datasheet: Complete electrical and mechanical specifications
- Reference Manual: Comprehensive programming and configuration guide
- Package Information: Pinout diagrams and mechanical drawings
- Application Notes: Implementation guidance and best practices
- Errata Documents: Known issues and workarounds
Development Resources
- Vivado Design Suite: Primary development environment for XCVU160-3FLGC2104E
- Development Boards: Compatible evaluation and development platforms
- IP Cores: Pre-verified intellectual property blocks
- Example Designs: Reference implementations and tutorials
- Video Tutorials: Training content for FPGA development
Quality Documentation
- Quality Reports: Manufacturing quality certifications
- Test Reports: Electrical and functional test results
- Reliability Data: MTBF and lifetime projections
- Compliance Certificates: RoHS, REACH, and other regulatory compliance
4. Related Resources
Development Tools
- Vivado Design Suite: Complete FPGA development environment
- Vitis Unified Software Platform: Software development platform
- ChipScope Pro: Real-time debugging and analysis
- ISE Design Suite: Legacy development tool support
Compatible Products
- Development Boards: VCU110, VCU118, and custom evaluation platforms
- Memory Interfaces: DDR4, QDRII+, RLDRAM III support
- Connectivity Options: PCIe Gen3/4, 100G Ethernet, Aurora protocols
- Power Management: Compatible voltage regulators and power solutions
Application Areas
- Data Center Acceleration: Machine learning inference and training
- High-Performance Computing: Scientific computing and simulation
- Communications Infrastructure: 5G base stations and network equipment
- Video Processing: 4K/8K video transcoding and streaming
- Aerospace & Defense: Radar, sonar, and secure communications
Support Resources
- Technical Support: AMD customer support and community forums
- Training Programs: FPGA design courses and certification
- Design Services: Professional services and consulting
- Third-Party Ecosystem: Partner solutions and IP providers
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Compliance: European chemical safety regulation adherence
- Conflict Minerals: Responsible sourcing certification
- Halogen-Free: Reduced environmental impact packaging
- WEEE Directive: Electronic waste management compliance
Operating Conditions
- Operating Temperature Range: Commercial (0ยฐC to +85ยฐC) and Industrial grades
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters above sea level
- Shock and Vibration: MIL-STD specifications for rugged applications
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Manufacturing location information
- Export Restrictions: Compliance with international trade regulations
- License Requirements: Government approval for restricted destinations
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management system
- AS9100: Aerospace quality management (when applicable)
- IPC Standards: Electronic assembly and testing compliance
- JEDEC Standards: Semiconductor industry standard compliance
Packaging & Handling
- MSL Rating: Moisture Sensitivity Level classification
- ESD Protection: Electrostatic discharge handling requirements
- Packaging Materials: Anti-static and protective packaging
- Traceability: Full supply chain tracking and documentation
- Shelf Life: Storage time limitations and handling instructions
Keywords: XCVU160-3FLGC2104E, Virtex UltraScale FPGA, AMD Xilinx, high-performance FPGA, 20nm technology, 2104-pin FCBGA, data center acceleration, programmable logic, field programmable gate array
For technical support, pricing inquiries, or additional product information regarding the XCVU160-3FLGC2104E, please contact authorized AMD distributors or visit the official AMD documentation portal.
