Product Overview
The XCVU160-2FLGC2104E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex UltraScale family, engineered to deliver exceptional performance for demanding applications. This high-density FPGA combines advanced 20nm technology with innovative UltraScale architecture to provide unprecedented power efficiency, processing capability, and programmable acceleration for next-generation systems.
Built for professionals who require the highest levels of performance and flexibility, the XCVU160-2FLGC2104E delivers outstanding value for applications ranging from data center acceleration to aerospace and defense systems.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale Series
- Manufacturing Process: 20nm Technology Node
- Logic Elements: 1,621,200 system logic cells
- Configuration Logic Blocks (CLBs): 926,400
- System Gates: Equivalent to approximately 26 million gates
Memory & DSP Resources
- Block RAM: 13,005 Kbit total RAM capacity
- UltraRAM: Advanced on-chip memory for high-bandwidth applications
- DSP Slices: High-performance digital signal processing blocks
- Distributed RAM: Integrated throughout the logic fabric
I/O & Connectivity
- User I/O Pins: 416 configurable I/O pins
- Package Type: FCBGA-2104 (Flip Chip Ball Grid Array)
- Total Package Pins: 2,104 pins
- High-Speed Transceivers: Support for 100G Ethernet and 150G Interlaken
- PCIe Support: Integrated PCIe blocks for direct system integration
Performance Characteristics
- Speed Grade: -2 (Commercial temperature range)
- Maximum Operating Frequency: Up to 725 MHz
- Core Supply Voltage: 0.922V to 0.979V
- I/O Supply Voltage: 3.3V compatible
- Clock Management: Integrated MMCM (Mixed-Mode Clock Manager) and PLL
Environmental Specifications
- Operating Temperature Range: 0ยฐC to +100ยฐC (Junction Temperature)
- Package Dimensions: 45mm x 45mm FCBGA package
- Mounting Type: Surface Mount Technology (SMT)
2. Pricing Information
Current Market Pricing
Pricing for the XCVU160-2FLGC2104E varies based on quantity, supplier, and current market conditions. As a high-end enterprise-grade FPGA, this device is positioned in the premium price segment.
Volume Pricing
- Single Unit: Contact authorized distributors for current pricing
- Volume Discounts: Available for quantities of 100+ units
- OEM Pricing: Special pricing available for high-volume OEM customers
Authorized Distributors
- Primary Channels: Digi-Key, Mouser Electronics, Newark/Farnell
- Regional Distributors: Available through AMD Xilinx’s global distribution network
- Direct Sales: Available for enterprise customers through AMD Xilinx sales teams
Note: Due to the specialized nature and high value of this component, pricing is typically provided on a quote basis. Contact authorized distributors or AMD Xilinx directly for current pricing and availability.
3. Documents & Media
Technical Documentation
- Official Datasheet: Complete electrical and mechanical specifications
- User Guide (UG575): Package and pinout information
- Design Guidelines: Layout and thermal management recommendations
- Application Notes: Implementation best practices and design examples
Design Resources
- Pinout Files: Available in ASCII, TXT, and CSV formats
- Package Files: 3D mechanical models for PCB design
- Reference Designs: Pre-validated design examples and IP cores
- Development Tools: Vivado Design Suite compatibility documentation
Software Support
- Vivado Design Suite: Primary development environment
- IP Catalog: Extensive library of pre-verified IP blocks
- SDK/Vitis: Software development tools for embedded applications
- Programming Files: Configuration and debugging utilities
Multimedia Resources
- Technical Webinars: Design tutorials and best practices
- Video Tutorials: Step-by-step implementation guides
- White Papers: Advanced design methodologies and optimization techniques
4. Related Resources
Development Platforms
- Evaluation Boards: VCU118 and similar development platforms
- Starter Kits: Complete development ecosystems for rapid prototyping
- Reference Designs: Proven implementations for common applications
Compatible IP Cores
- High-Speed Interfaces: 100G Ethernet, PCIe Gen3/4, DDR4/5 controllers
- Signal Processing: Advanced DSP libraries and algorithms
- Video Processing: 4K/8K video codec implementations
- Networking: Layer 2/3 networking protocol stacks
Design Services
- Professional Services: AMD Xilinx consulting and design services
- Training Programs: Comprehensive FPGA design training courses
- Technical Support: 24/7 technical support for enterprise customers
- Community Forums: Access to extensive developer community resources
Ecosystem Partners
- EDA Tools: Support for major EDA tool suites
- IP Providers: Third-party IP core vendors and libraries
- System Integrators: Qualified design service providers
- Hardware Partners: Compatible memory, power, and connectivity solutions
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS3 compliant (Restriction of Hazardous Substances)
- REACH Compliance: Fully compliant with EU REACH regulation
- Conflict Minerals: Compliant with conflict minerals regulations
- Environmental Standards: Meets or exceeds industry environmental standards
Quality & Reliability Standards
- Quality Standard: ISO 9001:2015 certified manufacturing
- Reliability Testing: Comprehensive qualification per JESD standards
- Automotive Grade: Industrial grade, suitable for extended temperature applications
- Moisture Sensitivity Level (MSL): MSL-3 classification for handling and storage
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- Country of Origin: Manufactured in AMD Xilinx certified facilities
- Export Restrictions: Subject to U.S. export administration regulations
- International Compliance: Complies with international trade regulations
Regulatory Certifications
- FCC Compliance: Meets FCC Part 15 requirements for electronic devices
- CE Marking: European Conformity marking for EU market compliance
- Safety Standards: UL recognized component status
- International Standards: Compliant with IEC, JEDEC, and IEEE standards
Supply Chain Information
- Lead Time: Typically 30 weeks for standard orders
- Product Status: Active production status
- Lifecycle Stage: Current generation, long-term availability assured
- Alternative Sources: Contact AMD Xilinx for authorized supply chain partners
Key Benefits of XCVU160-2FLGC2104E
High Performance: Advanced 20nm technology delivers exceptional performance per watt, making it ideal for compute-intensive applications requiring maximum efficiency.
Scalable Architecture: The UltraScale architecture provides scalable performance from entry-level to high-end applications, ensuring future-proof designs.
Comprehensive Ecosystem: Extensive tool support, IP libraries, and development resources accelerate time-to-market for complex designs.
Enterprise-Grade Reliability: Built to the highest quality standards with comprehensive testing and qualification for mission-critical applications.
Future-Ready Design: Advanced features and extensive I/O capabilities ensure compatibility with emerging standards and protocols.
The XCVU160-2FLGC2104E represents the pinnacle of FPGA technology, delivering unmatched performance, flexibility, and reliability for the most demanding applications in today’s data-driven world.
