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XCVU125-H1FLVC2104E – Xilinx Virtex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

The XCVU125-H1FLVC2104E is a high-performance field-programmable gate array (FPGA) from Xilinx’s Virtex UltraScale+ series, designed for demanding applications requiring exceptional processing power and flexibility. This advanced FPGA delivers superior performance for data center acceleration, aerospace, defense, and high-end industrial applications.

Product Specifications

Core Features of XCVU125-H1FLVC2104E

Logic Resources:

  • Logic Cells: 1,287,360
  • CLB LUTs: 518,400
  • CLB Registers: 1,036,800
  • Block RAM: 38.4 Mb
  • UltraRAM: 360 Mb

Processing Power:

  • DSP Slices: 1,968
  • Maximum Operating Frequency: Up to 741 MHz
  • System Logic Cells: 1,287,360
  • Memory Interface: DDR4-2666, DDR3, QDR-IV

Package Details:

  • Package Type: FLVC2104
  • Pin Count: 2,104 pins
  • Package Size: 55mm x 55mm
  • Ball Pitch: 1.0mm

Performance Specifications:

  • Process Technology: 20nm FinFET+
  • Core Voltage: 0.85V
  • I/O Voltage: 1.0V to 3.3V
  • Operating Temperature Range: -40ยฐC to +100ยฐC (Commercial)

Price Information

The XCVU125-H1FLVC2104E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities:

  • List Price: Contact authorized distributors for current pricing
  • Volume Pricing: Available for quantities of 100+ units
  • Lead Time: Typically 12-16 weeks for standard orders
  • Minimum Order Quantity: 1 unit

Note: Pricing for the XCVU125-H1FLVC2104E varies based on market conditions, order volume, and distributor agreements. Contact your local Xilinx representative for the most current pricing information.

Documents & Media

Technical Documentation for XCVU125-H1FLVC2104E

Datasheets & Specifications:

  • Virtex UltraScale+ FPGA Data Sheet (DS893)
  • XCVU125-H1FLVC2104E Product Brief
  • Package and Pinout Specifications
  • AC/DC Switching Characteristics

Design Resources:

  • Vivado Design Suite compatibility guide
  • Power Estimation Spreadsheet
  • PCB Design Guidelines for FLVC2104 package
  • Thermal Management Application Notes

Software & Tools:

  • Vivado Design Suite (latest version recommended)
  • Vitis Unified Software Platform
  • IP Catalog and Reference Designs
  • Simulation Models and Libraries

Application Notes:

  • High-Speed Serial I/O Implementation
  • Memory Interface Solutions
  • Power Management Strategies
  • Signal Integrity Guidelines

Related Resources

Development and Support for XCVU125-H1FLVC2104E

Evaluation Platforms:

  • Virtex UltraScale+ FPGA Development Boards
  • Compatible evaluation kits and modules
  • Third-party development platforms

IP Cores and Solutions:

  • Xilinx IP Portfolio compatibility
  • Memory controllers and interfaces
  • High-speed connectivity solutions
  • Video and imaging processing IP

Training and Support:

  • Xilinx University Program resources
  • Online training courses and tutorials
  • Community forums and support
  • Professional services and consulting

Competitive Alternatives:

  • Other Virtex UltraScale+ family members
  • Performance comparison guides
  • Migration and upgrade paths
  • Cost-optimization recommendations

Environmental & Export Classifications

Compliance and Regulations for XCVU125-H1FLVC2104E

Environmental Certifications:

  • RoHS Compliant (Lead-free)
  • REACH Regulation compliant
  • Conflict Minerals Reporting Template (CMRT) available
  • Green Package designation

Export Control Information:

  • Export Control Classification Number (ECCN): 3A001.a.7
  • Country of Origin: Various (contact for specific lot information)
  • Export licensing requirements may apply
  • Encryption capability classification

Quality Standards:

  • ISO 9001:2015 certified manufacturing
  • Automotive Quality Grade (AEC-Q100) options available
  • Military/Aerospace grade versions (contact for availability)
  • Extended temperature range variants

Packaging and Shipping:

  • Moisture sensitivity level (MSL): Level 3
  • Electrostatic discharge (ESD) sensitive device
  • Tray and tape & reel packaging options
  • Anti-static packaging requirements

The XCVU125-H1FLVC2104E represents the pinnacle of FPGA technology, combining exceptional performance with advanced features for next-generation applications. Contact your authorized Xilinx distributor for detailed specifications, pricing, and availability information.