Product Overview
The XCVU125-H1FLVB1760E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Virtex UltraScale+ family, delivering exceptional processing power and integration capabilities for demanding applications. This advanced programmable logic device combines industry-leading performance-per-watt with comprehensive system integration features, making it ideal for data center acceleration, 5G infrastructure, aerospace & defense, and high-performance computing applications.
1. Product Specifications
Core Architecture
- FPGA Family: Virtex UltraScale+
- Part Number: XCVU125-H1FLVB1760E
- Technology Node: 16nm FinFET+ process technology
- Package Type: 1760-pin FLVB (Flip-Chip Ball Grid Array)
- Operating Temperature: 0ยฐC to 100ยฐC (TJ)
- Supply Voltage: 0.970V ~ 1.030V
Logic Resources
- System Logic Cells: Up to 1,566,600 logic cells
- CLB (Configurable Logic Block): 89,520 CLBs
- DSP Slices: Enhanced DSP48E2 slices with floating-point support
- Block RAM: Up to 500Mb total on-chip memory
- UltraRAM: Integrated UltraRAM blocks for high-density memory applications
I/O and Connectivity
- User I/O: 702 I/O pins
- High-Speed Transceivers: Up to 32.75 Gb/s GTY transceivers
- PCIe Support: Integrated PCIe Gen3 x16 blocks
- Memory Interface: DDR4 support up to 2,666 Mb/s
- Ethernet MAC: Integrated 100G Ethernet MAC with KR4-FEC
Performance Features
- DSP Performance: Up to 38 TOP/s (TeraOPS) compute performance
- Memory Bandwidth: Advanced memory interface capabilities
- Power Efficiency: Up to 60% power savings vs. previous generation
- Clock Networks: ASIC-like clocking with low skew performance
Key Advantages
- 3X Performance-per-Watt: Compared to 7 series FPGAs
- High Integration: Reduces external component count
- Scalable Architecture: Supports complex system designs
- Security Features: AES-GCM decryption and RSA-2048 authentication
- Vivado Design Suite: Compatible with AMD’s comprehensive design tools
2. Price
Pricing Information
The XCVU125-H1FLVB1760E is available through authorized AMD distributors worldwide. Pricing varies based on:
- Quantity: Volume discounts available for large orders
- Lead Time: Standard vs. expedited delivery options
- Distribution Channel: Authorized distributors include Mouser, DigiKey, Avnet, and TrustedParts
- Market Conditions: Semiconductor pricing subject to market fluctuations
Price Range: Contact authorized distributors for current pricing
- Small quantities (1-10 units): Quote on request
- Volume pricing (100+ units): Significant discounts available
- Production quantities (1000+ units): Custom pricing available
Where to Buy
- Mouser Electronics: Authorized distributor with global inventory
- DigiKey: Comprehensive stock and technical support
- Avnet: Professional engineering services and support
- TrustedParts: Authorized inventory verification
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical and timing specifications
- Product Brief: Overview of features and applications
- Package & Pinout Guide: Detailed pin assignments and package information
- AC & DC Characteristics: Timing and power specifications
- Migration Guide: Upgrade path from previous generations
Design Resources
- Vivado Design Suite: Complete FPGA design environment
- Application Notes: Implementation guides and best practices
- Reference Designs: Pre-verified IP cores and system examples
- Board Design Guidelines: PCB layout recommendations
- Thermal Design Guide: Heat dissipation and cooling requirements
Software Tools
- Vivado Design Suite: Free WebPACK edition available
- Vitis Unified Software Platform: Application development environment
- IP Catalog: Extensive library of verified IP cores
- Simulation Tools: ModelSim, Questa, VCS support
- Debug Tools: Integrated logic analyzer and debugging capabilities
4. Related Resources
Development Boards
- VCU118 Evaluation Kit: Complete development platform
- Custom Evaluation Boards: Third-party development solutions
- Reference Designs: Pre-built system implementations
- Starter Kits: Entry-level development platforms
IP Cores and Solutions
- 100G Ethernet MAC: Integrated networking solution
- PCIe Endpoint/Root Complex: High-speed system interconnect
- DDR4 Memory Controller: Optimized memory interface
- DSP Libraries: Signal processing algorithms
- Video Processing: Codec and image processing IP
Application Areas
- Data Center Acceleration: Machine learning and AI inference
- 5G Infrastructure: Base station and network processing
- Aerospace & Defense: Radar and signal processing systems
- High-Performance Computing: Scientific and technical computing
- Test & Measurement: Signal generation and analysis equipment
Technical Support
- AMD Support Portal: Comprehensive technical documentation
- Community Forums: User community and expert support
- Training Resources: Online courses and certification programs
- Professional Services: Design consulting and implementation support
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Restriction of Hazardous Substances compliant
- REACH Compliant: Registration, Evaluation, Authorization of Chemicals
- Halogen-Free: Environmentally friendly manufacturing
- Lead-Free: Pb-free solder ball attachment
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management system
- Automotive Grade: AEC-Q100 qualified variants available
- Military Grade: Extended temperature and ruggedized options
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- Country of Origin: Manufactured in foundries worldwide
- Export Restrictions: Subject to U.S. export control regulations
- International Compliance: Meets global trade requirements
Packaging and Handling
- Packaging: Anti-static tray packaging
- Storage Requirements: Dry storage recommended
- Handling Precautions: ESD sensitive device
- Shelf Life: Unlimited when properly stored
- Traceability: Full lot traceability maintained
Reliability Data
- MTBF (Mean Time Between Failures): >1,000,000 hours
- Operating Life: 15+ years typical application life
- Temperature Cycling: -55ยฐC to +125ยฐC (1000 cycles)
- Thermal Shock: MIL-STD-883 Method 1011
- Vibration: MIL-STD-883 Method 2007
The XCVU125-H1FLVB1760E represents AMD’s commitment to delivering cutting-edge programmable logic solutions that enable breakthrough system performance while maintaining industry-leading power efficiency. This advanced FPGA provides the foundation for next-generation applications requiring high-performance computing, advanced signal processing, and flexible system integration.
