“We’ve trusted Rayming with multiple PCB orders, and they’ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XCVU125-3FLVD1517E – Xilinx Virtex UltraScale FPGA

Original price was: $20.00.Current price is: $19.00.

Overview

The XCVU125-3FLVD1517E is a high-performance Field Programmable Gate Array (FPGA) from AMD/Xilinx’s Virtex UltraScale family. This powerful programmable logic device delivers exceptional performance and integration capabilities for demanding applications requiring advanced processing, connectivity, and acceleration features.

1. Product Specifications

Core Architecture

  • FPGA Family: Virtex UltraScale
  • Manufacturer: AMD/Xilinx
  • Technology Node: 20nm manufacturing process
  • Logic Cells: 1,253,280 logic cells
  • Logic Blocks: 89,520 CLBs (Configurable Logic Blocks)
  • Total RAM: 90,726 Kbits embedded memory
  • DSP Slices: High-performance DSP capabilities for signal processing

Package & Physical Specifications

  • Package Type: 1517-Pin FCBGA (Flip-Chip Ball Grid Array)
  • Pin Count: 1517 pins
  • Package Size: Compact form factor optimized for high-density applications
  • Mounting Type: Surface Mount Technology (SMT)
  • Operating Temperature: Commercial grade (0°C to 85°C)
  • Supply Voltage: 0.95V core voltage with additional I/O voltage requirements

Performance Features

  • Speed Grade: -3 (high performance)
  • I/O Capabilities: 338 user I/O pins
  • Transceiver Support: High-speed serial transceivers up to 12.5 Gbps
  • Memory Interface: Support for DDR4, DDR3, and other memory standards
  • PCIe Support: PCIe Gen3 x8 lanes
  • Ethernet: 100G Ethernet and 150G Interlaken support

Key Technical Capabilities

  • Stacked Silicon Interconnect (SSI): Next-generation interconnect technology
  • UltraRAM: High-density on-chip memory blocks
  • Clock Management: Advanced clock generation and distribution
  • Power Management: Multiple power domains with dynamic power optimization
  • Security Features: Built-in encryption and secure boot capabilities

2. Pricing

Market Positioning

The XCVU125-3FLVD1517E is positioned as a premium FPGA solution targeting high-performance applications. Pricing varies based on:

  • Quantity: Volume discounts available for large orders
  • Distribution Channel: Authorized distributors vs. direct sales
  • Market Conditions: Supply and demand fluctuations
  • Geographic Region: Regional pricing variations

Pricing Considerations

  • Lead Time: Standard availability with potential for expedited delivery
  • Minimum Order Quantity: Typically sold in tray quantities
  • Customization: Engineering support and customization services available
  • Lifecycle: Active product with long-term availability commitment

Note: For current pricing and availability, please contact authorized distributors or submit a Request for Quote (RFQ) through official channels.

3. Documents & Media

Official Documentation

  • Product Datasheet: Comprehensive technical specifications and electrical characteristics
  • User Guide (UG575): UltraScale and UltraScale+ Package Device Pinout Files
  • Application Notes: Implementation guides and best practices
  • Errata: Known issues and workarounds
  • Package Files: Pinout information in TXT and CSV formats

Design Resources

  • Vivado Design Suite: Primary development environment
  • IP Catalog: Pre-verified IP cores and interfaces
  • Reference Designs: Proven implementation examples
  • Board Support Packages: Development board resources
  • Training Materials: Video tutorials and documentation

Software Tools

  • Vivado IDE: Synthesis, implementation, and debugging
  • SDK/Vitis: Software development kit for embedded processing
  • IP Integrator: Graphical system design tool
  • Simulation Tools: ModelSim, Questa, and other supported simulators

4. Related Resources

Development Platforms

  • Evaluation Boards: VCU125 evaluation board and similar platforms
  • Starter Kits: Complete development solutions
  • Third-Party Boards: Partner ecosystem solutions
  • Custom Board Design: PCB layout guidelines and reference designs

Technical Support

  • AMD Support Portal: Online technical resources and documentation
  • Community Forums: Peer-to-peer support and discussions
  • Application Engineers: Direct technical support for complex designs
  • Training Programs: Comprehensive educational resources

Compatible Products

  • Memory Interfaces: DDR4, DDR3, RLDRAM, QDR
  • Connectivity: PCIe, Ethernet, USB, SATA
  • Analog Interfaces: ADC, DAC, and mixed-signal solutions
  • Development Tools: Logic analyzers, oscilloscopes, and debugging tools

Application Examples

  • 5G/6G Wireless: Baseband processing and beamforming
  • Data Center: Acceleration and network processing
  • Automotive: ADAS and autonomous driving systems
  • Industrial: Machine vision and control systems
  • Aerospace/Defense: Radar, communications, and signal processing

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliance: Restriction of Hazardous Substances directive compliant
  • WEEE: Waste Electrical and Electronic Equipment directive compliant
  • REACH: Registration, Evaluation, Authorization of Chemicals regulation compliant
  • Conflict Minerals: Compliant with conflict minerals regulations
  • Green Packaging: Environmentally conscious packaging materials

Export Control Information

  • Export Classification: Subject to U.S. Export Administration Regulations (EAR)
  • ECCN Classification: Classified under specific Export Control Classification Number
  • Dual-Use Technology: Requires export licensing for certain destinations
  • Re-export Restrictions: Subject to re-export control regulations
  • End-User Screening: Required for international shipments

Regulatory Certifications

  • FCC: Federal Communications Commission compliance
  • CE Mark: European Conformity marking
  • UL Listed: Underwriters Laboratories safety certification
  • ISO Standards: Quality management system compliance
  • ITAR: International Traffic in Arms Regulations consideration

Sustainability Initiatives

  • Carbon Footprint: Reduced environmental impact manufacturing
  • Recycling Programs: End-of-life product recycling support
  • Energy Efficiency: Low-power design methodologies
  • Sustainable Sourcing: Responsible supply chain practices

Why Choose XCVU125-3FLVD1517E?

The XCVU125-3FLVD1517E represents the pinnacle of FPGA technology, combining exceptional performance with advanced features for next-generation applications. Its powerful architecture, comprehensive tool support, and proven reliability make it the ideal choice for demanding applications requiring the highest levels of performance and integration.

Contact your local AMD/Xilinx representative or authorized distributor for detailed pricing, availability, and technical support.