High-Performance FPGA for Advanced Computing Applications
The XCVU125-3FLVB1760E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Virtex UltraScale family. This high-performance device delivers exceptional processing power and flexibility for demanding applications in data centers, aerospace, defense, and telecommunications. The XCVU125-3FLVB1760E combines advanced 20nm technology with innovative UltraScale architecture to provide unmatched performance per watt.
1. Product Specifications
Core Architecture
- Product Family: Virtex UltraScale FPGA
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Part Number: XCVU125-3FLVB1760E
- Technology Node: 20nm process technology
- Speed Grade: -3 (highest performance grade)
Logic Resources
- Logic Cells: 1,566,600 equivalent logic cells
- Logic Blocks: 89,520 CLBs (Configurable Logic Blocks)
- System Logic Cells: 1,253,280 cells
- Macrocells: 1,566,600 macrocells
Memory Resources
- Total RAM: 90,726,400 bits (90.7 Mb)
- Block RAM: High-density embedded memory blocks
- UltraRAM: Advanced on-chip memory for data buffering
I/O and Packaging
- Package Type: 1760-pin FCBGA (Flip Chip Ball Grid Array)
- Package Size: 47.5mm x 47.5mm
- Total I/O Pins: 702 user I/O pins
- Pin Count: 1760 total pins
- Mounting Type: Surface Mount Technology (SMT)
Power Specifications
- Supply Voltage: 0.970V – 1.030V (Core voltage)
- Power Optimization: Advanced power management features
- Low Power Design: Optimized for energy-efficient operation
Environmental Specifications
- Operating Temperature: 0°C to +100°C (Junction Temperature)
- Storage Temperature: -65°C to +150°C
- Moisture Sensitivity Level: MSL 4 (72 hours at 30°C/60% RH)
- Lead-Free: Yes, RoHS compliant
2. Price
Pricing Information
- Market Position: Premium high-performance FPGA
- Volume Pricing: Available for bulk orders
- Lead Time: 10-16 weeks standard delivery
- Minimum Order Quantity: 1 piece
- Packaging: Tray packaging for production volumes
Note: Pricing varies based on quantity, lead time, and market conditions. Contact authorized distributors for current pricing and availability.
Request Quote: For competitive pricing and volume discounts on XCVU125-3FLVB1760E, please contact:
- Authorized AMD Xilinx distributors
- Electronic component suppliers
- FPGA specialty vendors
3. Documents & Media
Technical Documentation
- Product Datasheet: DS890 – UltraScale FPGA Overview
- User Guide: UG575 – UltraScale Architecture User Guide
- Package Specifications: 1760-FCBGA package details
- Pinout Files: CSV and TXT format pinout files
- Product Selection Guide: Virtex UltraScale family comparison
Design Resources
- Vivado Design Suite: Primary development environment
- Reference Designs: Application-specific example designs
- IP Catalog: Extensive library of verified IP cores
- Development Boards: Compatible evaluation platforms
- Application Notes: Design methodology and best practices
Software Tools
- Vivado Design Suite: Complete FPGA design flow
- Vitis Unified Software Platform: Accelerated application development
- Hardware Manager: Programming and debugging tools
- System Generator: DSP design tools for MATLAB/Simulink
4. Related Resources
Development Ecosystem
- Evaluation Boards: VCU125 evaluation board and similar platforms
- Development Kits: Starter kits for rapid prototyping
- Reference Designs: Proven designs for common applications
- Training Resources: Online courses and technical seminars
Compatible Products
- Memory Interfaces: DDR4, DDR3, QDR, RLDRAM support
- High-Speed I/O: PCIe Gen3, 100G Ethernet, Serial transceivers
- Clock Management: Mixed-Mode Clock Managers (MMCM)
- DSP Resources: Optimized DSP48E2 slices for signal processing
Application Areas
- Data Center Acceleration: Machine learning, database acceleration
- 5G Wireless Infrastructure: Baseband processing, beamforming
- Aerospace & Defense: Radar processing, signal intelligence
- High-Performance Computing: Scientific computing, financial modeling
- Video Processing: 4K/8K video transcoding, broadcast equipment
Technical Support
- Design Advisory Services: Expert consultation for complex designs
- Technical Forums: Community-driven support platform
- Application Engineers: Direct access to AMD Xilinx specialists
- Training Programs: Comprehensive FPGA design courses
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with EU RoHS Directive 2015/863
- REACH Compliance: Compliant with EU REACH regulation
- Lead-Free Status: 100% lead-free manufacturing process
- Halogen-Free: Meets halogen-free requirements for green manufacturing
- Conflict Minerals: Compliant with conflict minerals regulations
Export Control Classifications
- US Export Control: Subject to US Export Administration Regulations (EAR)
- ECCN Classification: 3A001.a.7 (High-performance computing)
- Export License: May require export license for certain destinations
- Trade Compliance: Fully compliant with international trade regulations
Quality Standards
- ISO 9001: Manufacturing under ISO 9001 quality management
- Automotive Grade: Not automotive qualified (industrial grade)
- Reliability Testing: Extensive qualification and reliability testing
- JEDEC Standards: Compliant with JEDEC packaging standards
Packaging & Handling
- ESD Sensitive: Requires proper ESD handling procedures
- Moisture Sensitivity: MSL 4 – requires controlled humidity storage
- Temperature Storage: -65°C to +150°C storage temperature range
- Packaging Material: Recyclable packaging materials
Why Choose XCVU125-3FLVB1760E?
The XCVU125-3FLVB1760E represents the pinnacle of FPGA technology, combining massive parallel processing capability with energy efficiency. Its advanced UltraScale architecture delivers breakthrough performance for the most demanding applications. With comprehensive development tools, extensive IP library, and robust technical support, this FPGA accelerates time-to-market while ensuring long-term design success.
Key Advantages
- Exceptional Performance: Industry-leading processing power and bandwidth
- Energy Efficient: Optimized power consumption for data center deployment
- Scalable Architecture: Flexible design scales from prototype to production
- Comprehensive Ecosystem: Complete development environment and support
- Long-Term Availability: Extended product lifecycle support through 2045
The XCVU125-3FLVB1760E is ideal for engineers and system architects who demand the highest performance FPGA solution for next-generation applications. Contact your AMD Xilinx representative or authorized distributor for detailed specifications, pricing, and technical support.
