The XCVU125-3FLVA2104E is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ series, engineered to deliver exceptional performance for the most demanding applications in aerospace, defense, communications, and high-performance computing.
Product Specifications
The XCVU125-3FLVA2104E features a robust architecture built on advanced 20nm technology, providing superior processing capabilities and power efficiency. This FPGA incorporates:
Logic Resources:
- 1,278,000 system logic cells
- 159,750 configurable logic blocks (CLBs)
- 5,520 block RAM modules
- 360 UltraRAM blocks
Processing Power:
- 2,520 DSP slices for high-speed signal processing
- Operating speed grade of -3 for maximum performance
- Advanced clock management with multiple phase-locked loops (PLLs)
I/O Capabilities:
- 832 user I/O pins in FLVA2104 package
- Support for DDR4-2666 memory interfaces
- High-speed serial transceivers for multi-gigabit connectivity
- Flexible I/O standards compatibility
Package Details:
- FLVA2104 flip-chip land grid array package
- 2104-pin configuration for extensive connectivity options
- Industrial-grade temperature range operation
- RoHS compliant construction
Price
The XCVU125-3FLVA2104E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and high-performance specifications. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Pricing varies based on order quantity, delivery requirements, and regional market conditions.
Documents & Media
Technical Documentation:
- Product datasheet with complete electrical specifications
- User guide for development and implementation
- Package and pinout documentation
- Design methodology guides
- Application notes for specific use cases
Software Resources:
- Vivado Design Suite compatibility information
- IP core libraries and reference designs
- Simulation models and timing analysis tools
- Programming and configuration guides
Development Tools:
- Evaluation boards and development kits
- Debug and analysis software
- Power estimation utilities
- Signal integrity analysis tools
Related Resources
Compatible Products:
- Memory interfaces (DDR4, LPDDR4, HBM)
- High-speed connectors and cables
- Power management solutions
- Cooling and thermal management systems
Development Ecosystem:
- Xilinx development boards featuring the XCVU125-3FLVA2104E
- Third-party acceleration cards and modules
- Software libraries and middleware
- Training materials and online resources
Application Examples:
- 5G wireless infrastructure
- Artificial intelligence and machine learning acceleration
- High-frequency trading systems
- Radar and signal processing applications
- Video processing and broadcast equipment
Environmental & Export Classifications
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance
- Conflict minerals reporting template available
- Halogen-free package construction
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Industrial temperature range: -40ยฐC to +100ยฐC
- Extended temperature options available
- Humidity and altitude specifications per JEDEC standards
Export Classifications:
- Export Control Classification Number (ECCN) as per US regulations
- Harmonized System (HS) code for international trade
- Country of origin documentation
- Export licensing requirements where applicable
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive-grade options (AEC-Q100) available
- Military and aerospace grade variants
- Comprehensive quality assurance testing
The XCVU125-3FLVA2104E represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support. Its advanced architecture makes it ideal for next-generation applications requiring high computational density, flexible connectivity, and reliable operation in demanding environments.
