The XCVU125-2FLVC2104I is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s Virtex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing sectors.
Product Specification
The XCVU125-2FLVC2104I features advanced 20nm technology with industrial-grade temperature range (-40ยฐC to +100ยฐC). This powerful FPGA incorporates 1,728,000 system logic cells and 5,520 DSP slices, providing substantial processing capabilities for complex digital signal processing tasks.
Key specifications of the XCVU125-2FLVC2104I include:
- Logic Cells: 1,728,000 system logic cells
- Block RAM: 75.9 Mb total block RAM
- DSP Slices: 5,520 DSP48E2 slices
- Package: 2104-pin FLVC (Flip Chip Land Grid Array)
- Speed Grade: -2 (industrial grade)
- I/O Pins: 832 user I/O pins
- Transceivers: 80 GTY transceivers supporting up to 32.75 Gbps
The XCVU125-2FLVC2104I supports multiple high-speed interfaces including PCIe Gen4, 100G Ethernet, and DDR4-3200 memory interfaces, making it ideal for bandwidth-intensive applications.
Price
The XCVU125-2FLVC2104I is positioned as a premium FPGA solution with pricing typically ranging from $8,000 to $12,000 per unit, depending on volume and distributor. Pricing may vary based on:
- Order quantity and volume discounts
- Regional availability and distribution channels
- Current market conditions and supply chain factors
- Customization requirements and support packages
For current pricing and availability of the XCVU125-2FLVC2104I, contact authorized Xilinx distributors or sales representatives for detailed quotations.
Documents & Media
Comprehensive documentation for the XCVU125-2FLVC2104I includes:
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Detailed implementation guidelines and best practices
- Package Information: Pinout diagrams and mechanical drawings
- Development Tools: Vivado Design Suite compatibility information
- Application Notes: Design examples and reference implementations
- Errata: Known issues and workarounds for the XCVU125-2FLVC2104I
Additionally, Xilinx provides extensive video tutorials, webinar recordings, and technical presentations covering the XCVU125-2FLVC2104I implementation strategies and optimization techniques.
Related Resources
The XCVU125-2FLVC2104I ecosystem includes:
- Development Boards: Evaluation platforms featuring the XCVU125-2FLVC2104I
- IP Cores: Pre-verified intellectual property for accelerated development
- Reference Designs: Proven implementations for common applications
- Software Tools: Vivado Design Suite, SDSoC, and SDAccel development environments
- Training Materials: Online courses and certification programs
- Community Support: Forums and technical communities for XCVU125-2FLVC2104I users
Compatible accessories include high-speed connectors, thermal management solutions, and power supply modules specifically designed for XCVU125-2FLVC2104I implementations.
Environmental & Export Classifications
The XCVU125-2FLVC2104I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (Lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting compliance
- ISO 14001 environmental management standards
Export Classifications:
- ECCN: 3A001.a.7 (Export Control Classification Number)
- CCATS: Available upon request for specific applications
- Country of Origin: Manufactured in advanced semiconductor facilities
- Export Licensing: May require export licenses for certain destinations
Operating Conditions:
- Industrial temperature range: -40ยฐC to +100ยฐC
- Humidity: 5% to 95% non-condensing
- Shock and vibration resistance per industry standards
- MTBF: >1,000,000 hours at 55ยฐC junction temperature
The XCVU125-2FLVC2104I is designed for mission-critical applications requiring high reliability and long-term availability, backed by Xilinx’s comprehensive quality assurance and supply chain management programs.
